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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
New Camstar Electronics Suite Provides Game-changing Smart Manufacturing Capabilities for Electronics and Mechanical Processes
01/31/2019 | Mentor, a Siemens business
National Instruments App Note Demos EM Verification of Complex PCBs
01/29/2019 | National Instruments
Rogers to Show High-Speed and Millimeter Wave Materials at DesignCon 2019
01/28/2019 | Rogers Corporation
Orange County Chapter of the DC Designers Council Meeting January 22
01/15/2019 | Scott McCurdy, Freedom CAD Services
Ventec's Technology Ambassador Alun Morgan to Keynote at AltiumLive 2019
01/14/2019 | Ventec International Group
Mentor’s Hands-on Workshop on Virtual Prototype with HyperLynx
01/11/2019 | Mentor, a Siemens business
Mentor's Web Seminar on HyperLynx DRC Safety Critical and Creepage Checks
12/21/2018 | Mentor, a Siemens business
Mentor Paper: Ensuring DDRx Reliability by Integrating SI, PI
12/19/2018 | Mentor, a Siemens business
December Issue of Design007 Magazine Available Now
12/18/2018 | Andy Shaughnessy, Design007 Magazine
Cascade Chapter of IPC Designers Council Meets Dec. 7
11/29/2018 | IPC Designers Council, Cascade Chapter
Intelligent Framework Aims To Optimize Data Transfer in 5G Networks
11/29/2018 | North Carolina State University
Ventec to Focus on 5G, New Energy Vehicle and Mini LED Solutions at HKPCA 2018
11/29/2018 | Ventec International Group Co., Ltd.
November Issue of Design007 Magazine Available Now
11/21/2018 | Andy Shaughnessy, Design007 Magazine
New Mentor Xpedition Platform Delivers 'Shift-Left' Multi-Dimensional Verification
11/15/2018 | Mentor, a Siemens business
DownStream Technologies Unveils Updates of CAM350, DFMStream and BluePrint-PCB
11/14/2018 | DownStream Technologies, LLC
IPC Recognized by White House as a Major Contributor of New Job Opportunities to US Market
10/31/2018 | I-Connect007
Corelis Introduces New Features and Enhancements in ScanExpress Software Version 9.0
10/30/2018 | Corelis, Inc.
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