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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
02/13/2018 | I-Connect007
Mentor Launches HyperLynx Solution with Automated and Intelligent Channel Extraction for SerDes Interfaces
02/13/2018 | Mentor, a Siemens business
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
02/12/2018 | Ventec
DownStream Technologies to Present Webinars in February and March
02/07/2018 | DownStream Technologies
Arrow Electronics and Cadence Launch Online Tool to Accelerate PCB Design Process
01/31/2018 | Cadence Design Systems, Inc.
EMA Enhances OrCAD Capture Cloud with 14 Million-Part Ultra Librarian Database
01/30/2018 | EMA Design Automation
Cadence to Showcase Signal and Power Integrity Solutions at DesignCon 2018
01/26/2018 | Business Wire
EMC & Technica to Introduce New Ultra High Speed Materials at DesignCon 2018
01/22/2018 | Technica USA
The PCB Design Magazine is Renamed Design007 Magazine; January 2018 Edition Now Available
01/19/2018 | Andy Shaughnessy, Design007 Magazine
Register for Nine Dot Connects' 1/31 Webinar: Double Data Rate Memory (DDR3)
01/17/2018 | Nine Dot Connects
Mentor Offers Free HyperLynx DRC Tool to the Hardware Engineering and PCB Design Community
01/17/2018 | Mentor, a Siemens business
Mentor Paper: The Benefits of Model-Based Engineering in Product Development
12/20/2017 | Mentor, a Siemens business
Mentor Names 2017 FloTHERM Award Winners for Electronics Thermal Design Excellence
12/12/2017 | Mentor, a Siemens business
American Standard Circuits Wins 2017 Innovator of the Year Award
12/05/2017 | American Standard Circuits
Register for Nine Dot Connects' December 20 Webinar: Spelunking in the Altium Schematic Preferences, Part 2
12/05/2017 | Nine Dot Connects
Mentor Unveils 2017 FloEFD Frontloading Computational Fluid Dynamics Award Winners
11/29/2017 | Mentor Graphics
Nine Dot Connects Nov. 29 Webinar: Spelunking in the Altium Schematic Preferences
11/21/2017 | Nine Dot Connects
I-Connect007 Launches The Printed Circuit Designer’s Guide to… Power Integrity by Example Micro eBook
11/15/2017 | I-Connect007
Polar Speedstack Si Integrates Insertion Loss Field Solver; To Exhibit at productronica
11/02/2017 | Polar Instruments
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