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Current IssuePartial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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Latest News
Mentor Webinar Sept. 8: Post-Route Verification of Multi-Gigabit Channels
08/26/2020 | Mentor, a Siemens business
Flex Expert Joe Fjelstad Releases Nine-Part Flexible Circuit Technology Workshop Series
08/04/2020 | I-Connect007
Mentor July 28 Webinar: A Hybrid Design Verification Methodology
07/23/2020 | Mentor, a Siemens business
EMA Design Automation Webinar Addresses Testing Challenges in PCB Design
07/17/2020 | EMA Design Automation
ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020
07/14/2020 | ESD Alliance
Rogers Corporation's Advanced Connectivity Solutions Business Adds North America Distribution Channel
07/07/2020 | Rogers Corporation
Mentor Webinar: Ensuring DDR4 Electrical Performance at Intended Data Rates
07/02/2020 | Mentor, a Siemens business
Dr. Alessandra Nardi Receives Marie R. Pistilli Women in Engineering Achievement Award
07/06/2020 | Business Wire
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/19/2020 | Andy Shaughnessy, Design007 Magazine
Essentra Components Advise on Efficient PCB Design With New Free Guide
06/16/2020 | Essentra Components
Altium and IHS Markit Partner to Solve Component End-of-Life Issues for PCB Design
06/11/2020 | Business Wire
Eagle Electronics Reduces Cycle Time for IPC-4761 Type VII Via Fill Process
06/08/2020 | Eagle Electronics
Ventec High-CTI Substrate Drives Increased Vehicle Electrification
06/04/2020 | Ventec International Group Co., Ltd.
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