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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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Designer's Notebook
Column from: Vern Solberg
Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than thirty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.