Latest Articles

A Look at the Latest Demands for Flying Probe Testing

Publisher Barry Matties sat down with Seica GM Barbara Duval at the recent NEPCON China show to discuss Seica’s approach to the flying probe markets. Duval also shared some of the latest customer demands on test companies and the test market outlook in Europe and North America, in addition to China, which looks like it will see growth in 2016.

Material Witness: How About that Technical Roadmap!

You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.

CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms

I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.

Reducing SMT Print Cycle Time: The Effects on Assembly Cost and Quality

Models have been available for over 10 years showing how reduced stencil wiping frequency can lower print cycle time. More recently, solder paste formulations have been widely adapted that offer higher transfer efficiencies at small area ratios when subjected to higher sheer forces associated with faster squeegee speed and pressure over the stencil. This article shows how these two cycle time reducers increase throughput when the print step is the rate controller in an SMT process.

Debunking the Myth: Polyimide Tape is Not the Only Answer During Rework

The electronics manufacturing industry has its own myth in polyimide tape being the most effective way to shield neighboring components from heat exposure. Legend has it that this thin, adhesive-backed “protector” will shield components from damage.

Exact Science Implemented at Kester for Increased Reliablity

Kester's Bruno Tolla and Dr. Yanrong Shi discuss with Guest Editor Steve Williams the importance of fully understanding their many solder formulations with respect to solderability and reliability, as related to customer needs and applications. With their fully equipped lab Kester's team can delve deeply into understanding the interactions of the chemistry involved, all of which can affect solderability performance.

IPC Validation Services 2014

Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.

Solder Jet Printing: Is It the Right Time?

Publisher Barry Matties gets an update from Nico Coenen, sales director for Mycronic, on their solder jet printing system. Mycronic has been developing and pioneering this technology for 10 years and they believe now is the time for it to gain real traction. One thing is certain; solder jet printing certainly has advanced and could make a big difference in process and quality.

Jetting Strategies for mBGAs: A Question of Give and Take

Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.

EchoStar’s Les Beller Shares the PCB Design-to-Fab Process

Recently, I-Connect007 Publisher Barry Matties had the opportunity to interview Les Beller of EchoStar Technologies. Beller’s career began in the early 1980s as a circuit board designer, eventually leading him to EchoStar, where he has managed the PWB design group and spent time as a PCB quality engineer. He is now a manufacturing process engineer specializing in DFx. In this interview, Beller focuses on the many challenges circuit board designers face, strategies for bridging the gap between circuit design and fabrication, and the future of circuit designers.

A Conversation (and Day) with Joe Fjelstad, Part 5

Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.

0.3% Humidity, That's Super Dry!

Sitting down with Guest Editor Mark Thompson, Super Dry's Richard Heimsch describes their powerful new dry unit which is capable of 0.3 % relative humidity. Recovery after doors have been opened is lowered super fast in the storage cabinet, able to reach the "safe zone" within three minutes.

A Conversation (and Day) with Joe Fjelstad Part 4

We continue the conversation as it turns to the more technically focused area of disruptive technology. The method Joe has been demonstrating for years now is one which is poised to offer dramatic increases in electronic reliability while decreasing overall cost through the elimination of solder--a cornerstone concept of what has been coined as Occam technology.

Shax Engineering: The Biggest Little Board Shop in the Bay Area

In a recent visit to Shax Engineering, Barry Matties had the opportunity to interview Isam Shakour, founder and president of Shax Engineering. This little San Jose, California company is a complete turnkey operation, providing PCB layout, fabrication, and assembly services. We discussed the company’s growth since its 1998 founding, and Shakour’s plans for Shax going into the future.

Position Accuracy Machines for Selective Soldering of Fine-Pitch Components

Selective soldering is a reliable soldering process for THT connectors and offers a wide process window for designers. But selective soldering is a different process. Compared to wave soldering, there are additional process parameters that are affected by the higher temperatures.

Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II

Twenty-five years ago, solder paste residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were available, either with solvent or by using water, with or without detergent. Now, the assembly world is mainly no-clean: paste formulation is safer in terms of chemical reliability and process costs are reduced without cleaning.

Solving Inspection Problems with True 3D in AOI, AXI and SPI Systems

SAKI America's family of true-3D inspection systems cover the whole spectrum of SPI, AOI and AXI tasks. Quintin Armstrong explains how the unique resolution capability of their AXI achieves 100% detection of head-in-pillow defects.

A Conversation (and Day) with Joe Fjelstad Part 3

In Part 3 of this interview series, Fjelstad divulges his interesting entry into the electronics manufacturing industry, including a brief diversion as a restaurateur. In this portion of the interview, the pair was touring the Evergreen Aviation and Space Museum (home of the Spruce Goose) where Fjelstad spoke frankly about his experience in Vietnam and how it has shaped his view about war, which he shares. Finally, the importance of education was discussed, as well as India, and why the rest of the manufacturing world should be paying attention to them.

Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues

Optimization of a reflow profile often focuses on mitigating defects such as voiding, tombstoning, graping, and slumping/bridging. But little thought is given to the reflow profile’s effect on the electrical reliability of the no-clean flux residue. Because of the wide variation in size and thermal density of SMT components and PCBs, achieving a reflow profile that equally heats the entire assembly can be challenging and often impossible.

A Conversation (and Day) with Joe Fjelstad, Part 2

In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.

Enhancements in Consolidating Data Prep

Valor's principle of consolidating data once then using it in multiple areas downstream, for example stencil design, pick and place programming and test machine programming, has now been extended to include X-ray inspection programming. Mark Laing explains how.

A Conversation (and Day) with Joe Fjelstad, Part 1

I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.

Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements.

SJIT, Solder Joint Integrity Test, To Find Latent Defects in Printed Wiring Board Assembly

Capacitance method and IEEE 1149.1 or boundary scan method are often used to find opens between component leads and pads on a printed wiring board. These methods, however, can find complete opens or complete shorts only; and latent defects that can be complete defect after several years have not been found by the conversational method. This article talks about a method to find such latent defects by using 4-wire small resistance measurement technique.

Zentech: Expanding EMS Solutions and Supporting Innovation

Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.

Open Failure Analysis Lab Assessment Service Available

Bhanu Sood describes the services offered by the Center for Advanced Life Cycle Engineering, and explains how physics-of-failure techniques are applied as a means of gaining a scientific understanding of reliability.

Software and Hardware Solutions

Jim Dickerson discusses software that goes beyond the SMT line to manage the whole process flow of the factory. Shawn Robinson describes award-winning placement systems with multi-recognition camera technology.

Universal Instruments Talks Challenges in China's Electronics Manufacturing Industry

Glenn Farris, Vice President of Marketing at Universal Instruments Corp., discusses with I-Connect007 Guest Editor Jessie Jiang at RealTimeWith...NEPCON China 2015 the key challenges facing China's electronics manufacturing industry.

NEPCON China Showcases Latest Manufacturing Tech in Asia

Considered Asia's biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who are showcasing this week the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. I-Connect007 is on hand again this year covering this event with exclusive interviews and photos from the show floor.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.

How to Select an Automatic Pick-and-Place Machine

This is the third in a series of articles designed to help buyers analyze and select SMT equipment for PCB assembly, and examines automatic pick-and-place machines, the most complex component in a circuit assembly operation. This article will focus on features and capabilities and include some cautions regarding reliability of low-cost machines.

Understanding DFM and its Role in PCB Layout

DFM is short for “design for manufacturability.” It is the process of arranging a PCB layout topology to mitigate problems that could be encountered during the PCB fabrication and assembly processes required to manufacture an electronic system. Addressing fabrication issues is what’s known as design for fabrication (DFF), and addressing assembly issues during design is known as design for assembly (DFA).

Are the Robots Taking Over?

Some have a fear that robots are taking over, but the founders of Universal Robots have a different view. They have focused on producing a versatile robotic arm that frees humans from doing the repetitive tasks. Their journey has not been an easy one. From a startup with just a couple of employees their future was questionable at best, but they never gave up.

Benefits of Soldering with Vacuum Profiles

Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, bringing new challenges that are evolving on a daily basis due to the relentless introduction of new variants of so-called bottom-terminated components (BTCs). Connector geometries alone are not decisive—numerous pitfalls are of greater significance.

High Reliability Thanks to Adhesives

Protecting electronic components from thermal, mechanical and chemical stress is becoming increasingly important in many industries. DELO Industrial Adhesives’ product specialist Kevin Balben explains the correct uses of today’s encapsulants and compounds and clarifies the myths that surround them.

Time to Ditch Heavy Metal for Soft Rock?

Yash Sutariya and Thomas S. Tarter shine a light on the often overlooked topic when it comes to PCBs for LEDs: reliability. They wrote that composite materials can provide both a thermal management solution and a dimensional stability solution that has not yet been presented through conventional materials.

Bernie Kessler: Pioneering Spirit Then and Now

I-Connect007’s Patty Goldman sat down with longtime friend and IPC Hall of Famer Bernie Kessler at IPC APEX EXPO 2015 in San Diego. Among other things, the two discussed the early days of IPC, and the beginnings of APEX EXPO.

Developments with Metallic Thermal Interface Materials

Tim Jensen and Dave Saums write about the critical role of the thermal interface material in improving the efficiency of heat transfer between a semiconductor device and the surface to which it is attached.

Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”

I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.

The Importance of Solder Process Expertise

Alpha's Marketing Manager for the Americas Robert Wallace talks with Guest Editor Kelly Dack about the company's new products such as solder preforms shaped like passive components and low temperature solder alloy pastes, as well as other innovations that the company is doing.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. After this point, only remedial actions are possible if components are found to run too hot. John Parry discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

Doing Business in India and China

Electrolube Managing Director Ron Jakeman spoke to I-Connect007 Publisher Barry Matties at CPCA 2015 in Shanghai. The company, more than 70 years old, has evolved over the decades, from producing contact lubricants, to manufacturing globally, with subsidiaries worldwide, including Beijing, China. In this interview, manufacturing, state of the global markets, and even Indian cuisine are discussed.

Hunter Technology’s Two Newest CID Recipients Discuss Certification

I-Connect007 Guest Editor Kelly Dack spent time at Hunter Technology’s Silicon Valley plant, where he had the opportunity to sit down with two recent CID certification recipients, Jeff Davidson and Zev Gross, who recently completed Dack’s CID training program. The two also discuss the benefits of achieving certification and their plans to take the advanced course.

Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

Product Line Philosophy: Start Small...End Big

Ralph Savage, CEO of EasyBraid, talks to Kelly Dack about his company started their business, as well as some of the activites and technologies they are doing now, such as desoldering, stencil cleaning and a soldering technology based on the Curie principle. He also discussed the company's strategy in bringing world-class technology into the United States.

Upping the U.S. Service Level of Chinese Manufacturing

Eddie Tang of Glory Faith and Yash Sutariya, president of Alpha Circuit discuss the unique business relationship between their companies. Alpha provides consulting and technical service in North America for GF, including rework and emergency manufacturing capability in its North American plants.

How to Select a Pick-and-Place Machine, Part I

In this article, Robert Voigt writes about manual and semiautomatic pick and place machines, for users interested in going from a couple boards a day to much higher production volumes.

Electrolube Expands Their Coverage

Phil Kinner talks coatings and encapsulants with Kelly Dack and explains how thin coatings give environmental protection whereas thick opaque encapsulants provide IP protection and high reliability.

Raising a Unified Voice for an Advanced Manufacturing Economy

The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.

Hunter Technology on Design Operations and Business Strategies

Immediately following IPC APEX EXPO 2015, Guest Editor Kelly Dack paid a visit to Hunter Technology’s facility in Milpitas, California, where he interviewed Ian Grover, vice president of design engineering, and Chris Alessio, vice president of sales and programs. Discussed are Hunter’s design operations as well as the company’s overall business strategy.

Direct Marketing Strategy Paying Off

Approaching 50 years in the business of supplying assembly equipment to the small-to-medium user, with an emphasis on understanding the needs of the customer and providing the best in value and service, Manncorp's Henry Mann and Ed Stone believe in direct marketing with readily accessible information.

Neutral Cleaning and Latest Developments in Closed-Loop Control

Cleaning processes that are pH-neutral have become a trend-setter in semiconductor and power-electronics applications, and concentration management is simplified by full closed-loop control. Harald Wack and Todd Scheerer explain the technical and environmental benefits.

Trending at Freedom CAD: New Crop of Next‐Gen Designers

Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.

Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015

At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.

Role of Plasma in Reliability of Conformal Coating

Besides its established applications in PCB fabrication, plasma is increasingly used in preparing assenblies for conformal coating, rendering surfaces hydrophilic and so promoting wettability and coating adhesion for increased reliability.

Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts

At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.​

Tin Whisker Risk Assessment of a Tin Surface Finished Connector

Rockwell Collins initially investigated and qualified Samtec’s SEARAY solder charge connector technology with a focus on solder joint integrity. However, the connector in question was found to have a potential risk of tin whiskers due to a small region of the connector that was not protected by either solder poisoning or the connector’s mechanical configuration.

High-end Assembly Requirements for Precision Dispensing

Dispensing is the cost-effective solution for repeatably placing precise amounts of underfills, encapsulants and sealants in otherwise inaccessible areas as packaging complexity inceases, particularly in the third dimension. Brian Chung of Nordson Asymtek sees mobile and wearable electronics as the drivers of the leading edge of precision dispensing technology.

The Unpredictability of Tin Whiskers Endures

Into decade number two of the European Union’s RoHS and REACH restrictions for the use of lead in electronic components, the risk of tin whiskers in critical circuitry continues. This article will explore a tin whisker mitigation process for surface mount electronic components applicable to both passive and active components.

Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans

I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
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