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RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning

Alan Cable, president of ACE Production Technologies, talks to I-Connect007 guest editor Mark Thompson about selective soldering and how it helps electronics assemblers overcome the high cost of labor.

EDA Tools: Automation vs. Control

Stephen V. Chavez, CID+, is currently the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS). He's also a frequent speaker at the IPC APEX EXPO Design Forum. I caught up with Stephen and asked for his thoughts on the EDA tools of today, and whether he’d prefer to have more control vs. more automation.

Selecting a Selective Soldering System, Part 3

The previous two articles on selective soldering covered the different applications well-suited to this technology, and the various types of fluxing methods available. In this article, Robert Voigt discusses the common types of soldering technologies available, as well as nitrogen inerting systems.

Pad Defined vs. Mask Defined: Which Method is Optimal?

It seems that there is no universal consensus on a seemingly simple choice used in designing electronic circuits. Should the pads on the PCB be defined by the edge of the solder mask opening (mask defined), or should the solder mask opening fall short of the circuit board interconnect (pad or non-solder mask defined)? In this article, SMT Magazine columnist Mitch Holtzer discusses which among the two methods is optimal.

Improving the Solder Paste Printing Cycle Times

At the recent NEPCON China show in Shanghai, I interviewed Adam Sim, senior sales manager at Speedline ITW EAE, about the challenges in solder stencil printing, how printing cycle times may be improved, and the key factors to consider when selecting a solder paste printing solution.

To Bake or Not to Bake (in Rework)—That is the Question

When performing rework on printed circuit boards, the issue of the moisture having to be baked out of the PCB is often debated. Whether it is localized mini-wave rework, hand-soldering or convection rework, the board, as well as neighboring components, needs to be taken into account in terms of moisture protection during the reflow cycle. This article details the baking requirements during PCB rework.

Solder Paste Printing: Challenges and Best Practices

In an interview with SMT Magazine, Watson Tseng, General Manager of Shenmao America Inc., talks about the challenges in solder paste printing, key parameters and best practices to consider, and variables involved when it comes to selecting the appropriate solder paste for the printing process.

The Solder Paste Factor in Printing

Mitch Holtzer, Alpha Assembly Solutions’ global director of customer technical support, and expert columnist at SMT Magazine, talks about the challenges that customers face when it comes to solder paste printing, the impact of solder pastes on the printing process, and the variables involved when selecting the type of solder to use for specific applications.

3D Solder Joint Reconstruction on SMD Based on 2D Images

Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.

Solder Paste Exploration

From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.

Flexible Circuit Component Assembly… and a Math Lesson

Flexible circuits are often sold in multiple-up panels or arrays to facilitate the assembly of SMT components. Coordination between the desires of the assembly supplier and the fabricator can have a significant effect on costs based on material/panel utilization.

The Henry Ford Division of Labor Production Model

We are all aware of what the price of assembling a product is based upon: material cost, number of labor hours needed for the product assembly and test, and labor sell rate in dollars per hour. In this article, Tom Borkes writes why the disparity in labor sell rates is still daunting.

Selecting a Selective Soldering System, Part 2

In Part 1, Robert Voigt began a discussion of selective soldering, including how it works, some pros and cons, and several fluxing and soldering options to choose from. This chapter dives a little deeper into the mechanics of fluxing systems.

What’s in a Name? ICAPE Group’s Glenn Colescott Explains

Glenn Colescott, director of ICAPE USA, speaks with I-Connect007's Patty Goldman about his company, their expansion plans, why they attend regional shows like the SMTA West Penn Chapter Expo & Tech Forum, and how they make customers get over the phobia over a trading company.

SMTA West Penn Chapter Plans Manufacturing Boot Camp in August

DRS Technologies' Bill Capen, who is also the president of the SMTA West Penn Chapter, talks with I-Connect007's Patty Goldman about their expanded Chapter Expo & Tech Forum, and their plans of doing a boot camp in August.

Soldering Experts on Hand at SMTA’s West Penn Chapter Expo & Tech Forum

At the recent SMTA West Penn Chapter Expo & Tech Forum, Marilyn Lawrence, founder and president of Conformance Technologies Inc., speaks with I-Connect007's Patty Goldman about the importance of solder training, and how far it has come through the years.

Electrolube: We Like Problems (Chinese Style)

In a follow-up interview, Ron Jakeman, group managing director of Electrolube, discusses with I-Connect007's Pete Starkey his company's strategy in China and the opportunities they are seeing in the region. They also discussed the company's two new products that will complement their European range.

China, Trump, and the Future

At NEPCON China, Hamed El-Abd of WKK and I-Connect007's Barry Matties discussed China’s fluctuating economy, the impact of the U.S. presidential election, the current state of electronics manufacturing in the region, and the overall craziness of doing business in modern day China.

Making Systems Smarter to Gain Visibility, Traceability, and Reduce Handling Errors

At the recent IPC APEX EXPO event in Las Vegas, Bjorn Dahle, president of KIC, talks about his views on automation, the technology improvements being made in reflow ovens, and some of the strategies to reduce handling errors in assembly lines.

A Preview of the 2016 International Microwave Symposium

The 2016 International Microwave Symposium (IMS) is taking place May 22–27 in San Francisco. I-Connect007's Barry Matties spoke with IMS’s Amanda Scacchitti about the upcoming show, the keynote speakers, and how IMS continues to put an emphasis on STEM education with their own STEM program for kids.

Reducing Setup Time to Provide More Uptime in Production

In an interview with I-Connect007 at the recent IPC APEX EXPO event in Las Vegas, Bob Bouchard, corporate marketing manager at BTU, talks about the latest developments in their products, how their technology is helping users reduce their setup times, and the impact of Industry 4.0 in the electronics assembly industry.

How Far Does It Make Sense to Automate?

There are often many advantages to automating the final assembly process, but how far does it make sense to automate? Is a fully automated process better than a semi-automated, or partially manual process? This article tells you more about the challenges and advantages of automation, and the right approach to adopt based on your operations.

EMS Rules of Automation & ROI

Are smaller EMS companies effectively dependent on manual labor and excluded from the innovation that automation and the computerization of the factory operation can bring? The answer is no because IoT is coming to the rescue. This article explains the cost of automation, how much to invest in automation, and the latest technology developments that will provide you manufacturing flexibility.

Strategies to Reduce Handling Errors in Your Rework Process

In this interview during the recent IPC APEX EXPO in Las Vegas, Donald Naugler, president and general manager of VJ Electronix, discusses rework challenges and strategies to help customers reduce handling errors in their processes. He also talks about automation, and the impact of Industry 4.0 in the electronics assembly industry.

Working Smarter Through a Proprietary Systems Strategy

From an IT perspective, EMS companies have two choices: select off-the-shelf systems and deal with support gaps if the systems don’t provide all the tools needed to manage the business, or buy an off-the-shelf core system and create highly customized solutions to address any support gaps. This article talks about the benefits of having the latter approach.

The Importance of Being Earnest (Educated)

This new column in SMT Magazine, titled "Jumping Off the Bandwagon," is dedicated to the continued development and improvement of the high-tech electronic product assembly industry, and the human component of that industry. For his first article, Tom Borkes talks about issues that, unless addressed, will continue to put product assembly at a disadvantage in high labor rate areas of the world.

To Outsource or Not to Outsource PCB Rework

There is a case to be made that outsourcing certain rework projects makes a lot of sense, especially in large, complex or highly time-sensitive rework projects. However, careful review of the suppliers' knowledge of standards and adherence to processes needs to be taken in to consideration prior to making the outsourcing call.

IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda

IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”

Cost vs. Cause: What is More Critical to EMS Profitability?

The reality of the market is that each major global EMS player will ask solder paste manufacturers to reduce price, rather than improving first pass yield. But the economics of this market trend are unsustainable. This article explains why achieving first pass yield can be a tremendous driver for maximizing the profitability of an EMS provider.

Best-Practice Process Preparation for PCB Assembly

In this high-pressure environment, process preparation systems need to be able to cope with every aspect and production, all machines and processes, without mistakes and without confusion, to scale the flexibility and responsiveness of the production operation in line with customer and market expectations.

Benefits of Improving Reflow and Screen Printing Processes

With a level playing field in terms of access to talent, technology, knowhow, infrastructure, and financial resources, how can an EMS company build a successful business year after year, decade after decade? Read this article to find out how one EMS player—through process improvements—manages to remain strong in this industry.

The Launch of a Lifetime: Catching up with Barry Lee Cohen

Dan Beaulieu catches up with industry veteran Barry Lee Cohen to talk about the new company he launched last month—Launch Communications; his vision; and why he took the chance in striking it out on his own.

RTW IPC APEX EXPO: Introbotix Highlights HF Tech for Nondestructive Testing

Brian Butler, president and CEO of Introbotix, speaks with I-Connect007 guest editor Bob Neves about using high-frequency test technology for insertion loss testing. He also talks about the HDP User Group and its current activities and initiatives.

Weiner’s World

3D printing, China’s SMT equipment and robotics markets, IPC’s mandate, counterfeiters, and Taiwan PCB makers’ shift to automotive electronics—Gene Weiner talks about these things and more in this new article.

RTW IPC APEX EXPO: Mentor Graphics Takes Manufacturing Operations to the Next Level

Dan Hoz, general manager of Mentor Graphics Valor Division, discusses with I-Connect007's Andy Shaughnessy how they are helping electronics manufacturers take their operations to the next level through their Valor IoT Manufacturing solutions. He talks about the OML and the Valor IoT Device, and how these solutions will help the electronics manufacturing industry to move to Industry 4.0.

RTW IPC APEX EXPO: Metcal on the Benefits of Customer Collaboration

Robert Roush, product support engineer at Metcal, discusses with I-Connect007 editor Andy Shaughnessy the importance of working together with customers, and how this approach can drive innovations in every market. They also explore the benefits of having digital solder feeders compared to traditional analog versions.

Supplier Spotlight: Transition Automation

In an interview with I-Connect007, Alden Lewis, vice president of sales at Transition Automation, discusses how they are tackling solder paste printing problems with squeegee technologies.

Selective Soldering: Design, Process Challenges and Practical Solutions

A SMART Group workshop at the Bromsgrove, UK, premises of equipment and process materials distributor APP Electronics, set out to provide the answers, with a programme combining technical presentations, live demonstrations and hands-on sessions, introduced and moderated by Nigel Burtt, senior electronics manufacturing engineer at Renishaw and SMART Technical Committee Chairman.

Selecting a Selective Soldering System, Part 1

So far in this series, we’ve covered stencil printers, pick and place machines, reflow ovens and multiple types of through-hole soldering. In this and the next couple of chapters, we’ll discuss selective soldering machines. It’s useful to start by understanding why and when selective soldering is used.

The Buyer’s Guide to Automation

Back in the 1990s when high-volume production was still enjoyed by most operations, the idea of replacing remaining manual operations with automated processes seemed like a great idea, but the technology at the time did not quite deliver on expectations. Today, the same goals for automation are once again in play; but this time, although technical capabilities have vastly improved, little high-volume is left.

Super Dry Discusses Tower System Developments

Rich Heimsch, director of the Americas for Super Dry-Totech, sits with I-Connect007's Andy Shaughnessy during the recent IPC APEX EXPO in Las Vegas to discuss the latest product developments at his company, as well as opportunities they are looking at.

Enabling Process Innovation through Test and Measurement Solutions

In an interview with I-Connect007, National Instruments Managing Director Matej Kranjc discussed how their platforms are enabling the development of intelligent systems of systems that help users make smarter business decisions, and how big data analysis is enabling process innovation in the electronics assembly line.

RTW IPC APEX EXPO: Rehm Discusses Advantages of Moving Heat Technology

Rehm Thermal Systems general manager Paul Handler speaks with I-Connect007 guest editor Steve Williams about the advantages of the moving heat chamber compared to traditional technology in the market today, and why their systems are all Industry 4.0-ready.

In a Culture of Continuous Improvement, Processes Continually Improve

In an interview with SMT Magazine, Etratech’s Mike Renneboog, manufacturing manager, and Robert Clarke, process manufacturing engineer, discussed their most significant challenge to improving SMT line productivity and quality, and the lessons they learned along the way.

RTW IPC APEX EXPO: Saline Lectronics Discusses How Industry 4.0 Can Give CMs the Edge

Jason Sciberras and Davina McDonnell of Saline Lectronics speak with I-Connect007 guest editor Steve Williams about how they embraced Industry 4.0 in their manufacturing line.

RTW IPC APEX EXPO: Kurtz Ersa Talks Latest Innovations

Ernie Grice of Kurtz Ersa North America speaks with I-Connect007 guest editor Mark Thompson about their latest innovations, including voidless reflow machines, selective soldering machines and rework systems, as well as a new paste printer that incorporates a 3D inspection system.

RTW IPC APEX EXPO: Indium Tackles Solder Voiding

Glen Thomas, product manager for solder pastes at Indium Corp., discusses with I-Connect007 Guest Editor Dick Crowe the primary problem in SMT lines today—solder voiding—and how they are helping their customers address this issue.

Taking the Gremlins Out of Your Process

Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.

RTW IPC APEX EXPO: Mentor Graphics Makes Internet of Manufacturing Affordable

Michael Ford, marketing development manager at Mentor Graphics, and I-Connect007 editor Andy Shaughnessy discuss the Open Manufacturing Language (OML), the challenges in supporting the hundreds of thousands of machines that are out there at shopfloors already, and how Mentor is making the Internet of Manufacturing affordable for everyone in the PCB assembly supply chain.

IPC APEX EXPO: IPC Government Relations—Your Advocate in Washington

IPC's VP of Government Relations, John Hasselman, explains IPC's "meet the policy makers" initiative (site visits by congressmen) to help build and broaden relationships with these decision makers.

IPC APEX EXPO: Zentech's Matt Turpin Talks Strategies for Success in CM Industry

Zentech's Matt Turpin, named as one the electronics industry's Rising Stars by the IPC, speaks with I-Connect007 guest editor Dan Beaulieu on how to become successful in the electronics contract manufacturing space.

IPC APEX EXPO: Mirtec's D'Amico Speaks on How 3D AOI Tackles SMT Inspection Challenges

Brian D'Amico, president of Mirtec, speaks with I-Connect007 guest editor Bob Neves about the inspection challenges in the SMT industry amid the continuing trend towards smaller devices and components, and how 3D AOI is helping manufacturers address these issues.

IPC President John Mitchell on the Past, Present, and Future, Pt. 2

In Part 2 of our on-the-show-floor interview with John Mitchell, conducted at IPC APEX EXPO 2016, John continues describing IPC’s key measures, and then invites industry folks who are reading this to participate in a unique challenge—some might say experiment. The question is, will there be any takers?

IPC APEX EXPO: EPTAC Updates on Soldering Committee Developments

Leo Lambert, vice president and technical director at EPTAC Corp., provides I-Connect007 guest editor Joe Fjelstad an update on some of the standard developments at IPC's soldering and assembly committee.

IPC President John Mitchell on the Past, Present, and Future, Part 1

We conducted this interview with IPC President John Mitchell on the show floor at IPC APEX EXPO to discuss the event, the changes on the IPC board, and the key metrics that IPC uses to measure their own performance and effectiveness. John also invites the industry to a unique challenge.

Standard of Excellence: Tips for Finding a Great PCB R&D Partner

This new column, Standard of Excellence, represents a cooperative writing effort by a team of experts at American Standard Circuits. This month, we begin with CEO Anaya Vardya, who focuses on R&D. In his piece, he provides his insights on what characteristics to look for in a good R&D PCB fabrication vendor partner, and a few things that are expected of them to do for you.

Catching up with…PNC: Open House Planned for May

I’m a great believer in open houses. Any time customers and vendors get together to learn and talk about what they can do for each other it’s a good thing. That’s why, when I heard that PNC, in Nutley, New Jersey, planned to hold an open house on May 20, I wanted to learn more about it. So I called my friend Sam Sangani, the company’s owner, to learn more about it.

IPC APEX EXPO: Foresite Discusses Cleaning Challenges

I-Connect007 guest editor Michael Konrad sits with Eric Camden, lead investigator with Foresite, to talk about cleaning and why it is now back in the spotlight in electronics assembly.

IPC APEX EXPO: Improving Assembly Line Efficiencies with Material Handling Solutions

Ben Khoshnood, president of Inovaxe, discusses with I-Connect007's Stephen Las Marias how EMS and OEM firms can utilize material handling solutions to increase the efficiencies of their assembly lines and reduce operator errors. He also highlights the latest technology developments in their material handling systems.

IPC APEX EXPO: Cogiscan Explains Benefits of Having Real-Time Factory Intelligence

Francois Monette, VP of sales and marketing at Cogiscan, speaks to I-Connect007 guest editor Mark Thompson about modern factory intelligence, and the the benefits of having this capability in assembly lines.
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