Latest Articles

The Authors of the Printed Circuits Handbook 'Speak'

The seventh edition of the Printed Circuits Handbook was published this spring, which was also the 50th anniversary of the first edition. For this issue—“Voices”—we asked the many authors of the handbook for their thoughts—their voices. We asked a few questions to get them started; though not everyone spoke strictly about the handbook, we found their comments interesting and thought-provoking, and we hope you do as well.

Will The “Internet of Manufacturing” Really Impact Business?

Supporting legacy, new, and future automated processes, as well as the vast number of manual processes in use today, is the key to being able to successfully introduce the Internet of Manufacturing into SMT production.

I-Connect Survey: A Look at the Mil/Aero Industry

I-Connect007 recently conducted a survey on the military/defense and aerospace markets. Respondents were asked about the greatest challenges when it comes to PCB design, fabrication, and assembly; their customers’ demands; whether lead-free components are still an issue; and compliance challenges.

4 Benefits of Industrial Automation in Electronics Manufacturing

In a nutshell, industrial automation is a step beyond mechanization; it is about using control systems and technology to replace human physical and mental labor in the manufacturing and engineering sector. This article talks about four of the resulting benefits of automation for electronics manufacturers.

Standardizing Platforms from Characterization to Production

Over the past decade, the intense focus to reduce the cost of testing has produced a significant shift from using turnkey automated test equipment to building in-house and cost-optimized testers based on off-the-shelf instrumentation. This shift to a custom tester approach has been a large factor in the success of modular instrumentation platforms in the electronics manufacturing industry. This article explains why.

Case Study: Flex Smart Factory at Fuyong

This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.

Sensible Design: When Coatings Go Wrong

This month, I consider some of the more common, and often very frustrating, problems that may be encountered when coating electronic circuit boards and components. I also discuss some practical solutions. As we all know, nothing in life is straightforward.

The Industry Speaks

In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

Integrated Manufacturing Solutions: an EMS, ODM, CM, and OEM!

Robbin Thompson, VP Business Development at San Diego-based contract manufacturer Integrated Manufacturing Solutions (IMS), speaks with I-Connect007's Barry Matties and Judy Warner about her company's expansion, production capabilities and product lineup, as well as the culture at IMS.

Local SMTA Expos Are Where It’s Happening!

At the recent SMTA chapter expos, Greg Vance with Rockwell Automation and Brett Crane with Bird Electronic Corporation speak with I-Connect007's Patty Goldman about the event, and the trends happening in the electronics manufacturing industry.

The Benefits of 3D Printing within Contract Electronics Manufacturing

The buzz around 3D printing, or additive manufacturing as it also known, continues to grow day-by-day, and it is regularly hailed as a revolutionary "new" process. This article discusses the basics of 3D printing and the different types of printing processes that exist, along with the benefits these bring to contract electronics manufacturers and the customers they serve.

IMS and STEM: Building a Stronger Future

At the recent IEEE International Microwave Symposium (IMS2016) show held in San Francisco, California, I-Connect007's Barry Matties met with IEEE MTT Education Committee STEM Lead Steven Lardizabal to learn more about the show’s STEM outreach, how they inspire students to join the technology field, and the success of the educational program.

Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with SAT

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. This article reports a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.

Event Review: 7th Electronic Materials and Processes for Space Workshop

This year's Electronic Materials and Processes for Space Workshop discussed a wide range of technology issues and developments when it comes to PCB fabrication and assembly for space applications. From addressing reliability issues to dealing with cracks that may form during thermal cycling, to REACH regulations and their impact on space hardware, and tin whisker growths. Barrie Dunn provides the highlights.

3 Common Fears About Outsourcing Your Outbound Logistics

If you are still responsible for shipping finished product to your end users, you may be facing difficulties that are distracting you from your core activities. This article explains how you can overcome the common fears about outsourcing your outbound logistics to an EMS provider.

Moving Beyond Paideia: Learning for Earning

The complexities of our technological world and global marketplace now demand the development of specific, saleable skills as part of the student-customer's educational process--and that the template for teaching these skills must be based in the real world. Tom Borkes explains why in this article.

Investing in the Future Voices of our Industries

FIRST (For Inspiration and Recognition of Science and Technology) is a massive global initiative, aimed at getting kids more interested in STEM subjects through a variety of fun and interactive experiences. At a recent Maker Faire, Barry Matties spoke with FIRST's Jill Wilker and Ken Johnson about their organization's mission and vision.

Bumping of QFNs/LGAs and Other Leadless Devices for More Consistent Rework

Among the greatest challenges leadless devices present are the solder voiding primarily on the ground plane, the inability to clean underneath the devices post rework, and the difficulty in getting similar standoff heights on both the IO and center ground. This article talks about the type of rework methods available to address these issues.

Selecting a Selective Soldering System, Part 5

For the conclusion of his series on selective soldering discussion, Robert Voigt does a quick wrap-up to remind potential buyers about some important considerations that affect the purchase decisions they make.

How to Prevent Solder Bridges During Printed Circuit Board Assembly

Solder bridges occur when solder unintentionally connects one electronic component lead to another. Thankfully, a large number of solder bridges can be easily prevented. And while preventive measures may cost you a small amount of additional time and money, the long term payback can be significant.

Milwaukee Electronics: Screaming-Fast in Pursuit of 'Perfect Products'

Jered Stoehr, VP of sales and marketing at Milwaukee Electronics, discusses with I-Connect007's Judy Warner the innovative ways their company is meeting the needs of today's OEMs. He also talks about the challenges and opportunities they are seeing in their markets.

The STEM Trap

Post-secondary schools have not been responsive to the changing landscape of the modern electronic product assembly operation—they really can’t, considering the lack of real-world experience of most of the faculty. In this article, Tom Borkes explains why.

Condensation Testing—A New Approach

While the characterization of coating performance under high humidity conditions is detailed in well accepted IPC and IEC standards, the performance and testing under condensing conditions is not so well developed. This article talks about a new approach that has been developed where the test board is mounted on a substrate whose temperature can be independently controlled without changing the ambient condition.

Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements

This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth

Manufacturers are faced with steadily increasing miniaturization and higher packing density in PCB assemblies. Packing densities, in particular, repeatedly create challenges in terms of testability, especially when high components such as connectors are fitted in close proximity to other components. This article looks at different handling and testing requirements for connectors.

Why Flexibility is Crucial to the Success of Your Outbound Logistics

When it comes to outbound logistics, the ability to adapt in order to reach new markets and meet ever-changing customer demands, is vital. This article explores how partnering with an electronics manufacturing services (EMS) provider will help to ensure you are fully equipped for change in a fast-paced global environment.

Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.

Industry 4.0: Making the First Move

Many companies now have active Industry 4.0, Internet of Manufacturing, or smart factory projects. In each case, different approaches were taken that appeared to best fit the project requirements and that would deliver the intended benefits versus the cost and effort investment needed. However, there is no best solution. This article explains why.

Package-on-Package Warpage Characteristics and Requirements

iNEMI organized the Warpage Characteristics of Organic Packages Project to identify primary factors that can contribute to the warpage performance of selected components during typical SMT processes, to better understand package warpage characteristics across different package types and attributes. This article focuses on the work related to package-on-package.

EPC’s Michael de Rooij Discusses Strategic Partnership with Wurth Electronik

Michael de Rooij, PhD, of Efficient Power Conversion Corp. (EPC) talks to I-Connect007 guest editor Kim Sauer about their strategic alliance with Wurth Electronik, how their cooperation works, and how the technology solution they are co-developing can address the wireless power challenge as a whole.

Understanding How EMS Companies View Capital Investment Decisions

One of the great benefits of outsourcing your manufacturing is that it can largely remove the need to continually invest in expensive capital equipment. But when selecting an EMS partner, it is important to take a realistic view of their equipment list. This article explains why.

A New Dispensing Solder Paste for Laser Soldering Technology

A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.

How to Overcome Medical Electronics Manufacturing Challenges

There are a lot of things to consider when choosing a medical EMS provider to work with and it is worth taking time to make sure the partner fits your needs. To help you make comparisons between suppliers, this article lists a set of questions to ask to help ensure that the manufacturer you work with has the right experience and expertise for you.

The Pasternack Story

John Farley, director of marketing for Pasternack Enterprises, speaks with I-Connect007's Judy Warner during the recent International Microwave Symposium event about their experience at this year's show. John also discusses the multiple layers of Pasternack's RF products and services and the unique way they do business.

Addressing New Testing & Inspection Challenges

NK Chari, marketing director for manufacturing technologies at the Electronic Industrial Solutions Group of Keysight Technologies, talked about the challenges in PCBA testing and inspection, tougher requirements for testing, and the need for functional testing. He also mentioned some best practices to consider to improve the PCBA testing and inspection process.

Case Study: Achieving Near-Perfect Reads of Data Matrix Codes in PCB Assemblies

The range of Data Matrix marking techniques and PCB materials means that the appearance of marks in PCB assemblies can vary dramatically from one situation to the next. In this case study, each PCB needs to be read at the time of solder inspection so the inspection results can be stored in a database. An integrated solution was developed to reduce the downtime required for opening the inspection machine and manually entering the labels of the PCB assemblies.

I-Connect Survey: Automation or Reducing Process Steps?

In our recent survey, we asked what is more important: automating a process or eliminating process steps. Interestingly, the results are 50-50: half of our respondents say automating a process is more important, while the remaining 50 percent consider eliminating a process step a key strategy.

ITRI’s Wang Talks Future of Soldering and Paste Printing

In an interview with SMT Magazine, Wang Chao, technology manager at UK-based ITRI Ltd, discusses the biggest challenges in solder paste printing, how the solder paste material impacts the process, and the future for soldering and paste printing.

5 Myths About Electronics Manufacturing Outsourcing

OEMs have been outsourcing their electronics manufacturing and test for decades, yet a number of myths relating to outsourcing still remain today. In this article, Neil Sharp tackles some of these myths head on so that anyone considering outsourcing to an EMS provider can base their decision on facts and not fiction.

Selecting a Selective Soldering System, Part 4

In the previous three chapters on selective soldering, Robert Voigt covered the different applications well-suited to this technology, the various types of fluxing and soldering methods available, and nitrogen inerting. In this chapter, he discusses programming software, and how you can figure out the best sequence to optimize production speed.

An Integrated PCB Producer’s Approach to the Market

NCAB Group is one of the biggest PCB suppliers in the world. Barry Matties and Stephen Las Marias recently met with Andy Liu of NCAB to discuss an integrated producer’s approach to the market, new design tools, the current state of the Chinese market, and the future of 3D printed electronics.

Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection

A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.

The Fourth Industrial Revolution (Industry 4.0): Intelligent Manufacturing

The last industrial revolution was driven by striking advances in electronics and information technology having achieved enormous economic prosperity and manufacturing automation. So what is the fourth industrial revolution and what does it encompass? This article talks about the genesis of the term and the vision for Industry 4.0.

Improving Test and Inspection

In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.

Conversations with STI Electronics' Dave Raby at IPC IMPACT Washington, D.C.

Dave Raby, president and CEO of EMS firm STI Electronics and an eager participant at this year’s IMPACT Washington, D.C. event, speaks with I-Connect007’s Patty Goldman about his expectations at this year’s conference.

Zentech’s Matt Turpin on IMPACT Washington, D.C.’s Benefits

At the recent IMPACT Washington, D.C. 2016 event in Capitol Hill, Matt Turpin, CEO of EMS firm Zentech discusses with I-Connect007's Patty Goldman his expectations on the event, its importance, and how, so far, it has helped the electronics manufacturing industry in the United States.

Hand Soldering: The Move Toward Automation

At the recent NEPCON event in Shanghai, JBC's Domingo Taberner discussed with I-Connect007's Barry Matties the hand soldering market in China, the move towards automation, the greatest challenges their customers have in soldering, and what to know about choosing the right temperature and tip.

Sensible Design: Coatings—Five Essentials for Designers

In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.

A First-Timer's Perspective on IMPACT Washington, D.C. 2016

I-Connect007 editor Patty Goldman speaks with Faisal Pandit, president of Panasonic Factory Solutions Company, during the recent IMPACT Washington D.C. 2016 event. They discuss his experience as a first-time attendee, and his reasons for attending the event this year.

Solder Paste Dispensing: Breaking the Limits of Printing

In an interview with SMT Magazine, Eric Gu, application manager at Nordson Asymtek China, talks about the greatest challenges and innovations in solder paste dispensing, and factors to consider when using solder paste dispensers.

The Reliability Factor in Solder Paste Printing

In an interview with SMT Magazine, Knoll Evangelista of EMS firm EMS Components Assembly Inc. speaks about the solder paste printing challenge, what factors impact the process, and best practices to consider.

To Clean or No Clean?

The addition of a cleaning process to your manufacturing line will amount to an added 5–6 cents per board produced. Mike Konrad of Aqueous Technologies believes that is a small price to pay for the added value, testing, and reduced liability and insurance that a cleaning solution can provide; however, he admits cleaning isn’t for everyone.

Solder Paste Printing: A User’s Perspective

Integrated Micro-Electronics' Joemar Apolinario, Aurelio Bantigue, and Rodney Bebe, discuss the challenges and key considerations to make when dealing with tighter tolerances and finer pitches in line with the continuing miniaturization trend in the electronics manufacturing industry. They also talked about the impact of solder pastes in the printing process, and the criteria for their selection and qualification.

SPI Parameter Considerations for Tighter Tolerances

In an interview with SMT Magazine, Vi Technology’s Jean-Marc Peallat and Chong Choon Hee speak about the solder paste inspection challenges when it comes to tighter tolerances and finer lines and pitches in board assemblies, and the latest innovations happening in the SPI space to help customers address these issues.

The Sum of All Parts: The Fabricator-Assembler Connection

After discussing the relationship between PCB fabricators and those who design the boards (see my previous column ), it is imperative to do the same for the relationship between assemblers and fabricators. This brings about a whole new set of potential complications.

IPC President John Mitchell Discusses IPC's Footprint in China

At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.

Jumping Off the Bandwagon: The Production Engineering Student as Customer

Production, industrial, process, manufacturing engineering, to name a few fields of engineering study, will never be successfully taught on-line. In his latest article, Tom Borkes explains why.

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.

Creation Technologies on IMPACT Washington, D.C. 2016

Bhawnesh Mathur, president and CEO of contract electronics manufacturer Creation Technologies, shares his thoughts with I-Connect007's Patty Goldman on the benefits of the recent IMPACT Washington D.C. event.

Solder Jet Printing: Keeping Up with the Challenges

In an interview with SMT Magazine, Thomas Bredin, area sales manager at Mycronic, discusses solder paste printing, and how the jet printers are getting up to speed with the challenges such as tighter tolerances and finer lines and pitches. He also talks about key factors to consider when selecting a solder paste printer, and what Mycronic 4.0 is all about.
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