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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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The Shaughnessy Report
Column from: Andy Shaughnessy
Andy Shaughnessy was the managing editor of Design007 Magazine for 14 years. Andy has been covering PCB design and EDA issues since 1999. A former crime reporter, Andy previously served as editor of Printed Circuit Design & Manufacture and conference chair for the PCB Design Conferences.