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Latest News
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID Group
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswire
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young America
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium Corporation
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics Association
Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology
03/26/2026 | Wolfspeed
Arm Expands Compute Platform to Silicon Products in Historic Company First
03/26/2026 | Arm Holdings plc
AEM, ASE Enter Strategic Partnership to Accelerate AI and HPC Test Innovation
03/23/2026 | ACN Newswire
Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.
03/11/2026 | Ventec International Group
APEX EXPO 2026 Show Floor Sells Out – 416 Exhibitors – Largest Manufacturer Lineup in Six Years
03/06/2026 | Global Electronics Association
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.
SCHMID Delivers First InfinityLine H+ for Panel-Level Packaging to Leading U.S. Tech Firm
03/05/2026 | SCHMID Group
Semiconductor Ceramic Packaging Market to Reach $2.78B by 2030, Growing at 8.5% CAGR
03/04/2026 | Globe Newswire
SPG Opens New Austin Facility to Expand Engineered Packaging Capabilities and Regional Support
03/04/2026 | BUSINESS WIRE
ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers
03/03/2026 | Globe Newswire
Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
02/24/2026 | BUSINESS WIRE
Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
02/23/2026 | BUSINESS WIRE
Advanced Electronics Packaging Digest Expands Its Reach With New Substack Presence
02/23/2026 | I-Connect007
The Global Electronics Association and ISC3 Announce Strategic Partnership to Advance Circular and Sustainable Electronics
02/18/2026 | Global Electronics Association
$3.5 Million Award to Advance Power Device and Electronic Module R&D
02/17/2026 | University of Arkansas
Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design
02/16/2026 | Cadence Design Systems
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard Circuits
FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026
02/04/2026 | PRNewswire
Rigetti Announces Order for a 108-Qubit Quantum Computer from India’s C-DAC
01/23/2026 | Globe Newswire
What’s Next for Global Electronics: A 2026 Outlook from East Asia
01/23/2026 | Sydney Xiao, Global Electronics Association East Asia
Diamond Quanta Launches Adamantine Thermal, Advancing Packaging Roadmap Post-CES 2026
01/19/2026 | BUSINESS WIRE
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
01/12/2026 | Cadence Design Systems
JBNU Researchers Propose Hierarchical Porous Copper Nanosheet-Based Triboelectric Nanogenerators
01/08/2026 | PRNewswire
Semicon India Programme Builds Full Semiconductor Design-to-Packaging Ecosystem
12/15/2025 | PIB Delhi
Advanced Packaging Key to AI Chip Performance as Moore’s Law Slows, Analyst Says
12/15/2025 | PRNewswire
AI Workload Surge Sparks Demand for Alternative Memory and Chiplet Technologies, Expert Says
12/15/2025 | PRNewswire
Global Chiplet Market to Reach $157 Billion by 2030, Driven by AI and Enterprise Demand
12/15/2025 | BUSINESS WIRE
Semiconductor Assembly Packaging Equipment Market to Reach $11.1 Billion by 2034
12/15/2025 | Globe Newswire
Tata, Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
12/09/2025 | Tata Electronics
Global Electronics Association to Testify at USMCA Public Hearing; Industry Expert Chris Mitchell Available for Interviews
12/02/2025 | Global Electronics Association
The Global Electronics Association to Launch Double Materiality Assessment Toolkit to Support the Electronics Industry with Sustainability Reporting Compliance
12/17/2025 | Global Electronics Association
Hummink Raises $20 Million to Bring Micronic Precision Printing to Advanced Manufacturing
11/18/2025 | Globe Newswire
MacDermid Alpha Electronics Solutions Announces Agreement to Acquire Micromax
10/29/2025 | MacDermid Alpha Electronics Solutions
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial Team
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial Team
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications
10/24/2025 | BUSINESS WIRE
The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come
10/15/2025 | BUSINESS WIRE
TI’s New Power-management Solutions Enable Scalable AI Infrastructures
10/14/2025 | Texas Instruments
Electronics U Expands Global Workforce Training for the Electronics Industry
10/13/2025 | Global Electronics Association
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
10/08/2025 | Amkor Technology
TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging
10/02/2025 | Texas Instruments
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID Group
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | Siemens
Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
09/25/2025 | BUSINESS WIRE
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV Group
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.
Printed Electronics Market Size to Top $83.77 Billion by 2034 Driven by IoT Adoption and Flexible Device Demand
09/11/2025 | Globe Newswire
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIRE
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