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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Latest Articles
Chris Banton is Bullish on New Tech

Meet Two New CID Grads: Kalen Brown and Michael Steffen

CFX Preview at IPC APEX EXPO 2020
Curtis Scott Opens the Blinds on PCB Design
Bryan LaPointe: A Great Time to Be Working With Technology
Updates on Cleaning Standards and Committees

What You Need to Know About the Digital Factory
What You Need to Know About a PCB Design Career

The Value of Education and Communication

Planning a Successful Technical Conference

How to Become a Certified IPC Trainer

Top 10 Most-Read Design News Stories of 2019

Top 10 Most-Read Design Articles of 2019

Top 10 Most-Read Design Columns of 2019

MacroFab: Manufacturing Digitized

Wi-Fi 6: Wired vs. Wireless

Is Captive Making a Comeback?

Insulectro Works to Bridge the Fabricator/Designer Gap

Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation

Utilizing AI in CAD Library Development

The Viability of a Cyanide-free Immersion Gold Bath

The Future of the World Is Truly in the Hands of Our Youth
Digi-Key on Adapting to the Changing Industry Landscape, Part 2

Designing for Complex PCBs

AltiumLive Frankfurt 2019: Happy Holden Keynote

LA/Orange County SMTA Expo and Tech Forum Review

Words of Advice: Making Life Easier for Fabrication and Assembly

AltiumLive Frankfurt 2019: Carl Schattke Keynote

Traversing the Design Landscape With Hartley and Creeden
Conductivity Laminate for High-frequency Applications

What Does Intelligent Routing Look Like?

Words of Advice: What are Your Biggest Design Challenges?

Martyn Gaudion Discusses Backdrilling Software

Digi-Key on Adapting to the Changing Industry Landscape, Pt. 1

AltiumLive Frankfurt 2019: Jeremy Blum Keynote

Oren Manor on the Siemens-Mentor Integration

AltiumLive Frankfurt 2019: Rick Hartley Keynote
A Radical New Design Perspective
University Rover Challenge Tests Student Teams

Book Review: The Printed Circuit Designer’s Guide to…Executing Complex PCBs

Vertical Conductive Structures, Part 4: Tuning Your Signal Performance

Words of Advice: 5G Reliability

Lee Ritchey on the Direction of PCB Design
Flex Standards Update With Nick Koop

Communication, Part 6: The Importance of Technology Fit

Words of Advice: The OEM Systems Designer

Why Does the PCB Industry Still Use Gerber?
Dugan Karnazes Discusses His New Startup
Explaining the QSFP-DD Data Center Interconnect Standard

Meet Ray Prasad, SMT007 Columnist
Communication, Part 5: Internet Impedance Calculators for Modeling

Design For Excellence: Karen McConnell on Standards

IPC-2581 Continues to Flourish

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

Meet George Milad, I-Connect007 Columnist

So Many Standards Committees, So Little Time

Why Designers Need to Be at the SMTA Additive Electronics Conference

Words of Advice: Making Life Easier for Fabrication and Assembly

Happy Holden Previews His AltiumLive Frankfurt Keynote

Communication, Part 2: Design Data Packages
