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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
Mentor White Paper: "Shift Left" Integrates Pervasive Verification Early in Design Process
05/08/2019 | Mentor, a Siemens business
iCD Releases Impedance Goal-seeking Functionality
05/02/2019 | Barry Olney, In-Circuit Design Pty Ltd
Register Now for Mentor's May 2 Webinar on Schematic Analysis
04/25/2019 | Mentor, a Siemens business
Orange County Designers Council Chapter Meeting April 25
04/10/2019 | Scott McCurdy, Freedom CAD Services
Cadence Unveils Clarity 3D Solver for System Analysis and Design
04/03/2019 | Cadence Design Systems, Inc.
DAIKIN Adopts Mentor's Xpedition PCB Design Platform for Global Design and Data Management
03/28/2019 | PRNewswire
EMA Launches Ultra Librarian Model Cloud on Maxim Integrated's Website
03/26/2019 | EMA Design Automation
Cascade Chapter of IPC Designers Council Meeting April 3
03/21/2019 | IPC Designers Council, Cascade Chapter
Mentor White Paper: Lean NPI at Optimum Design Associates, Part 3
03/13/2019 | Mentor, a Siemens business
DownStream Webinar March 27: Automate, Ease and Improve PCB Documentation
03/13/2019 | DownStream Technologies
Cadence Webinar: Preventing EMC Problems in IC Package and PCB Designs
03/08/2019 | Cadence Design Systems, Inc.
Mentor and Aberdeen Paper: Best Practices for Electronics Design Executives
02/27/2019 | Mentor, a Siemens business
February 2019 Issue of Design007 Magazine Available Now
02/26/2019 | Andy Shaughnessy, Design007 Magazine
Unexpected Growth Seen in PCB Design Software Market from 2018 to 2023
02/26/2019 | Market Study Report LLC
I-Connect007 Publishes Second Annual Show & Tell Magazine—All About IPC APEX EXPO 2019
02/19/2019 | I-Connect007
Mentor Webinar: Correct Model Assignments for SI (Full Flow)
02/13/2019 | Mentor, a Siemens business
Real Time with... IPC APEX EXPO 2019: Announcements on IPC Education Foundation Day & the New IPC Student Chapter
01/31/2019 | Real Time with...IPC
DesignCon 2019 Names Vishram Pandit Engineer of the Year and Announces 2019 Best Paper Award Finalists
01/31/2019 | GlobeNewswire
New Camstar Electronics Suite Provides Game-changing Smart Manufacturing Capabilities for Electronics and Mechanical Processes
01/31/2019 | Mentor, a Siemens business
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