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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Latest Articles
Zuken Pulling Ahead in Automotive PCB Design
Interview: Incoming and Outgoing Presidents of Polar Instruments
Porsche Engineering…by Design
Estonia a Hot Spot for New Technology
Fadi Deek Discusses Mentor’s New Power Integrity eBook

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

Jan Pedersen: CircuitData Enhances Current Data Formats
Martin Cotton Discusses Ventec’s New Book and Low-Loss Materials

Mentor’s HyperLynx Automates SERDES Channel Design
Julie Ellis: TTM’s Interface Between Designer and Fabricator

Cadence’s Sigrity Automates Power Integrity Simulation Earlier in Design Cycle
South African Electronics Industry Going Strong
SnapEDA Harnesses Technology in Providing Verified Parts
Worldwide Systems Consulting: Tools, Process, People
IPC-2581 Demo Draws a Crowd at IPC APEX EXPO
RTW IPC APEX EXPO: Ucamco's New Tools for Designers, Fabricators

MakeHarvard 2018: The Super Bowl of Makeathons
Still Using 1980s Formats for Design Data Handoff?

RTW IPC APEX EXPO: Polar Instruments Discusses New Engineer, SpeedStack Upgrades
RTW IPC APEX EXPO: Judy Warner Discusses EDA Market and Altium's Growth

IoT: Let’s Put the “A” Back into EDA

RTW IPC APEX EXPO: Valor Tool Benefits from Merging Mentor, Siemens Technologies

Bridging the Customer-Supplier Gap

Frontline's InStack Viewer Helps Designers and Fabricators

Barry Katz Discusses SiSoft's DesignCon Papers and Plans for 2018

Real Time with... DesignCon: Mentor Partners with Sintecs on EU Project

Real Time with... DesignCon: User Feedback Helped Shape Altium Designer 18

Start Your IPC APEX EXPO Show Experience Here

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

Out-of-the-Box Innovation Strikes a Chord at NAMM 2018

Who Really Owns the PCB Layout? Part 2

EMA Cloud Lined with Capability
Rogers Continues Expansion into High-Speed Digital Materials
APCT’s Cartel Acquisition Adds Capacity, Technology and Certifications

Mentor Focusing on Power and Signal Integrity

A Conversation with Dorine Gurney, New President of Polar Instruments

Entering—and Enjoying—the Industry

Pulsonix Ready for 2018
Fully Automated Schematic Verification

What’s New in EDA: The Experts Discussion

Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?
PCB Cooling Strategies, Part 2

Thermal Management Update with Doug Brooks

PCB Cooling Strategies, Part 1

Streamlining Thermal Design of PCBs
Dr. Johannes Adam Gets Hot on Thermal Management
Mike Jouppi Discusses his Drive for Better Thermal Data
That’s Hot: Ventec’s Goodwin on Thermal Management

IEEE’s Romanian SIITME Show a Success
Tips & Tricks: Rule-Based PCB Layout

Mentor White Paper: Characteristic vs. Instantaneous Impedance

The Impact of HDI on PCB Power Distribution

Heat Transfer and Thermal Conductivity: The Facts

HDI PCBs: Make the Right Choice from Design to Volume
Three Perspectives for HDI Design and Manufacturing Success
Lee Ritchey On the Future of PCB Design
Who Really Owns the PCB Layout?

Bay Area Circuits Updates InstantDFM Tool
Cannonballs, eBooks, and Signal Integrity
