Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2
It’s Only Common Sense: Stop Watching the Headlines and Start Watching the Opportunity
The Right Approach: The Pros and Cons of PCB Vertical Integration
Latest News
After 30 Years, Samsung Moves U.S. HQ from New Jersey to Texas
06/04/2026 | I-Connect007 Editorial Team
Quobly Raises €115M Series A to Commercialize Silicon-Based Quantum Computers
06/04/2026 | PRNewswire
Fujitsu, Daiichi Life Launch Joint Research on Quantum-Powered Asset Management
06/04/2026 | Fujitsu
NVIDIA Joins Windows on Arm, Driving Arm-Based AI Notebook Share to 34.2% by 2029
06/04/2026 | TrendForce
Mouser's Rise of the Robots Program Explores Humanoid Design Considerations
06/03/2026 | BUSINESS WIRE
STMicroelectronics Raises Revenue Ambition for Data Centers on Strong AI Demand
06/03/2026 | STMicroelectronics
AI Data Center Expansion to Push EML and CW-DFB LD Monthly Capacity to 50.7M Units in 2026
06/03/2026 | TrendForce
Keysight, NTT DOCOMO, and NTT Collaborate on 6G Wireless Channel Modeling
06/02/2026 | BUSINESS WIRE
QTREX Secures Purchase Order from U.S. Fortune 500 Company for AME System
06/02/2026 | Globe Newswire
Tight DRAM Supply Boosts Pricing Power, HBM Contract Prices Set to Surge in 2027
06/02/2026 | TrendForce
Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
06/01/2026 | Cadence Design Systems
Agentic AI Fuels Memory Demand Growth, Market Projected to Hit $1.28T by 2027
05/29/2026 | TrendForce
Ynvisible Secures SEK 3.0M Grant to Advance Sustainable Manufacturing and Medical E-Paper
05/29/2026 | Ynvisible Interactive Inc.
TDK Ventures Invests in C2i Semiconductors to Revolutionize AI Data Center Power Delivery
05/28/2026 | BUSINESS WIRE
DIMAAG Acquires Akridata to Scale Physical AI and Next-Generation Infrastructure
05/28/2026 | BUSINESS WIRE
Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy
05/28/2026 | PRNewswire
Powermat, Anker Innovations Announce Patent License Agreement and Strategic Collaboration
05/27/2026 | PRNewswire
NUBURU Signs Tekne SPA and Initiates Golden Power Filing Process for Majority Acquisition
05/27/2026 | BUSINESS WIRE
Schaeffler, Spire Global Partner to Build Sovereign European Space Infrastructure
05/27/2026 | BUSINESS WIRE
GlobalPlatform Unveils Pavona, the First Open Silicon Platform with Post-Quantum Cryptography
05/26/2026 | BUSINESS WIRE
Omdia: European Smartphone Market Grows 2% in 1Q26 as Prices Hit Record High
05/26/2026 | BUSINESS WIRE
Quectel Expands EMEA Reach With Future Electronics Distribution Agreement
05/26/2026 | BUSINESS WIRE
Micron’s Fab 6 Starts LPDDR4 and DDR4 Production, but DDR4 Shortage Is Expected to Persist
05/26/2026 | TrendForce
Fujitsu Develops Self-Evolving AI Agent Technology for Business Operations
05/25/2026 | JCN Newswire
Combined Revenue of Top Five Global NAND Flash Suppliers Rose by 83.7% QoQ for 1Q26
05/25/2026 | TrendForce
QTREX in Advanced Talks with Top-Five Global Quantum Computing Firm on Strategic Collaboration
05/22/2026 | Globe Newswire
Doosan Robotics Strengthens European Presence with Expanded Frankfurt Branch
05/21/2026 | Doosan Robotics
Tata Electronics, ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India
05/21/2026 | Tata Electronics
Analog Devices Acquires Empower Semiconductor to Bolster AI-Era Power Portfolio
05/21/2026 | PRNewswire
IBM, U.S. Department of Commerce Announce America's First Quantum Foundry with $1B CHIPS Award
05/21/2026 | PRNewswire
Global TV Shipments Reach Post-Pandemic High in Q1 2026 Amid Memory Price-Driven Order Pull-Ins
05/21/2026 | TrendForce
Infineon Launches Moore4Power to Advance Next-Gen Sustainable Power Electronics
05/20/2026 | Infineon
GlobalFoundries Invests in Playground Global to Drive Long-Term Innovation
05/20/2026 | GlobalFoundries
Doosan Robotics Strengthens European Presence with Expanded Frankfurt Branch
05/20/2026 | PRNewswire
North American CSP Procurement of NVIDIA Racks to Drive 1.2x AI Inference Surge in 2026
05/20/2026 | TrendForce
Packet Digital Awarded $9.8M U.S. Navy Contract to Scale Battery Cell Production
05/18/2026 | Packet Digital
H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator
05/18/2026 | Siemens
Richardson Electronics, Gotion Partner on U.S.-made Battery Storage Systems
05/18/2026 | Richardson Electronics, Ltd.
Mobile DRAM Contract Prices Continue Rising in 2Q26, Pressuring Smartphone Production
05/15/2026 | TrendForce
Heilind Electronics Expands Circuit Protection Portfolio with OptiFuse Partnership
05/15/2026 | Globe Newswire
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRE
ONERugged Accelerates Smart Manufacturing with Rugged Computing Solutions
05/14/2026 | BUSINESS WIRE
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial Team
Robot Orders Hold Steady in Q1 2026 as Demand Broadens Across Non-Automotive Industries
05/13/2026 | BUSINESS WIRE
50% of Enterprises Risk Losing Top AI Talent by 2027 Without People-Centric AI Strategy
05/13/2026 | Gartner, Inc.
Lightium Selects Aras Innovator to Support Development of Photonic AI Chips
05/12/2026 | BUSINESS WIRE
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswire
Macnica ATD Europe Acquires Indesmatech to Deepen Engineering Presence Across Northern Europe
05/11/2026 | BUSINESS WIRE
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
05/11/2026 | Cadence Design Systems
GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend
05/08/2026 | GlobalFoundries
Siemens Hardware-assisted Verification Validates Arm AGI CPU for Scalable Agentic AI
05/06/2026 | Siemens
Advent Diamond, Northrop Grumman Set Record for Diamond-Based Solid-State Limiters
05/06/2026 | PRNewswire
North American AI Data Center Expansion Drives 2026 CapEx of Top Nine CSPs to US$830 Billion
05/06/2026 | TrendForce
Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswire
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswire
Infineon Brings Industrialization Expertise to European Quantum Chip Pilot Lines
05/04/2026 | Infineon
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundries
Navitas Semiconductor Appoints Davin Lee as Independent Director to its Board
05/04/2026 | Globe Newswire
STMicroelectronics Enables Always-On Vision with Ultralow-Power Image Sensors
05/01/2026 | STMicroelectronics
Neusoft Smart Go, Tencent Cloud Partner on AI-Powered Intelligent Cockpit Ecosystem
05/01/2026 | PRNewswire
NEC to Supply Nine Types of Defense Equipment for Three Australian Frigates
04/30/2026 | JCN Newswire
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
05/06/2026 | I-Connect007
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium Corporation
Strong AI Demand vs. Weak Consumer Segment Creates Pricing Divergence Among MLCC Suppliers
04/28/2026 | TrendForce
MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026
04/27/2026 | MacDermid Alpha Electronics Solutions
NEC Announces Strategic Collaboration with Anthropic Focused on Enterprise AI
04/27/2026 | JCN Newswire
Skydio Commits $3.5B to Expand U.S. Manufacturing and Secure American Drone Leadership
04/27/2026 | PRNewswire
Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities
04/27/2026 | TrendForce
5GAA Demonstrates Satellite, Safety and Cooperative Services in the Nordic Region
04/24/2026 | PRNewswire
Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation
04/22/2026 | PRNewswire
Lattice Collaborates with TI to Accelerate Edge AI for Robotics and Industrial Applications
04/22/2026 | Lattice Semiconductor
Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner
04/22/2026 | PRNewswire
Wearable Technology Market Expected to Reach $183.2 Billion by 2031, Growing at a CAGR of 12.75%
04/22/2026 | PRNewswire
BULL, Fujitsu Partner on High-Precision Space Situational Awareness Service in Japan
04/21/2026 | JCN Newswire
Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission
04/21/2026 | Infineon
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit Materials
Omdia: India Smartphone Shipments Drop 5% in Q1 2026 on Channel Caution and Pricing Pressure
04/21/2026 | BUSINESS WIRE
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe Newswire
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRE
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design Systems
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor Limited
EdgeCortix Secures Investment from Axiro Semiconductor, MPower Partners for Edge AI
04/15/2026 | BUSINESS WIRE
Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswire
Acron Technologies Acquires Alereon, Expanding Its Advanced Defense Capabilities
04/14/2026 | PRNewswire
Apple Foldables May Capture Almost 20% Share as Stress Management Reduces Creasing
04/14/2026 | TrendForce
Industry-Wide Memory Constraints Grow as AI-Driven Supply Shift Reshapes Market
04/13/2026 | Global Electronics Association
Infineon Further Extends Global Leadership in the Automotive Semiconductor Market
04/13/2026 | Infineon
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in