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GrayMatter Robotics Awarded AFWERX Direct-to-Phase II SBIR Contract for Advanced Robotic Finishing System
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Industry Veteran Dr. Helen Song Joins Celera Semiconductor to Lead Product Design
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TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
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Small Material, Big Impact: IDTechEx Explores Graphene in Electronic Applications
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eInfochips, NXP Announce Collaboration Focused on Global Distribution and Customer Services
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Standex Electronics Unveils New Brand Identity to Power the Next Era of Engineering Innovation
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Gartner Forecasts Worldwide IT Spending to Grow 9.8% in 2026, Exceeding $6 Trillion For the First Time
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Gushine Electronics Inaugurates Hai Phong Lithium Battery Facility in Vietnam
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Nvidia, Microsoft, and BlackRock Lead $40 Billion Deal to Acquire Aligned Data Centers
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China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
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2H25 Foundry Utilization Exceeds Expectations, Some Players Are Prepared for Price Hikes
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Start Campus, Nscale Drive Europe’s First NVIDIA Blackwell Ultra AI Deployment
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The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come
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TI’s New Power-management Solutions Enable Scalable AI Infrastructures
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Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
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indie’s Narrow-Linewidth Visible Lasers Drive Quantum and Automotive Innovation
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Western Digital Opens Expanded System Integration Test Lab to Accelerate Innovation in the AI and Cloud Era
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Wiley Launches Interoperable Platform to Power Scientific Discovery in World's Leading AI Technologies
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CSP CapEx to Soar Past US$520 Billion in 2026, Driven by GPU Procurement and ASIC Development
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Keysight Enables 6G Digital Twin Research at the University of Texas at Austin
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Electronics U Expands Global Workforce Training for the Electronics Industry
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Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
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Smart Eye Collaborates with Sony on Next-Generation Interior Sensing and Iris Authentication
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Trio Wins Nobel Prize for Groundbreaking Quantum Physics Experiments
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ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
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Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
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RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution
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Septentrio, Xona Sign MOU to Accelerate Adoption of Next-Era Navigation Technology
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Hon Hai Sales Jump 11% on AI Server Boom, Boosting Nvidia Supply Chain
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C-Hawk Technology Unveils New Vietnam Facility, Scaling Global Advanced Manufacturing Capabilities
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Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split
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Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
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Omdia Forecasts Large-Area Display Shipments to Grow 2.8% YoY in 2025, Mobile PC Displays Lead the Growth
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Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
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Tobii, STMicroelectronics Enter Mass Production of Breakthrough Interior Sensing Technology
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TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging
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Global Wearable Medical Devices Market Predicted to Reach $185 Billion by 2032
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Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
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Spiking Neural Networks – Fraunhofer IIS Researches AI Chip for Fiber Optic Networks
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QuantumScape, Corning Announce Agreement for Ceramic Separator Development & Commercialization
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Tight Upstream Supply and Restocking Drive 2024 DRAM Module Revenue Growth of 7%
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SEALSQ, Kaynes SemiCon Announce Joint Venture to Establish India's First Secure Semiconductor Center
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GlobalFoundries, Corning Collaborate to Deliver Detachable Fiber Connector Solutions
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Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening
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SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
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Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
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Teledyne Labtech Leads Groundbreaking Welsh Space Cooling Project with Bangor University
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Global Wearable Band Market to Grow 9% as Smartwatches and Health Tech Surge
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Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
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NAND Flash Prices to Rise 5–10% in 4Q25, Driven by Spillover Demand for QLC Products
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Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
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ABS, Persona AI Partner to Bring Humanoid Robotics to Shipyards, Advancing Safety and Productivity
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Bittium Launches Embedded AI Offering and Announces Collaboration with Qualcomm
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STMicroelectronics' STARLight Project to Lead EU Silicon Photonics on 300mm Wafers
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Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
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HPE Now Powers New AI-Ready Supercomputer Set to Transform Environmental Forecasting in New Zealand
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Siemens Accelerates Complex Semiconductor Design and Test with Tessent IJTAG Pro
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Infineon to Sell its Bangkok/ Nonthaburi Site to Malaysian Pacific Industries Berhad
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Inference AI Driving Structural Shifts in High-Capacity Storage, Nearline SSD Demand Surges
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Cohu Eclipse Platform Chosen for Testing Next Generation AI Computing Devices
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Meta’s New AR Device to Lift LCoS Share to 13% by 2026, Intensifying Competition with LEDoS
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Anyon Systems Becomes Anchor Partner in Industrial Quantum Chip Fabrication Facility
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U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
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CoreWeave Posts £1.5 Billion Commitment to Power UK AI Innovation and Growth Through Sustainable Computing
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Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
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GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
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STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
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Global Notebook Shipments to Grow 2.2% in 2025 as Southeast Asia Production Capacity Expands
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HyRel Technologies Showcases Summer Intern Success Through Hands-On Innovation
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AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
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Latent AI, Wind River Collaborate to Advance Edge AI for Mission-Critical Systems
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QCraft Partners With TÜV Rheinland to Strengthen Safety-Led Autonomous Driving in Europe
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