Latest News

Principal Mineral Announces Acquisition of Isola and $280 Million in New Funding for Next Phase of Strategic Growth
06/16/2026 | Principal Mineral
Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations
06/10/2026 | Flexible Circuit Technologies
Altium Education Celebrates First Mayan-on-Chip Cohort in Yucatán
06/01/2026 | Altium
Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand
05/29/2026 | Cadence Design Systems
Valeo, Zuken Join Forces to Redefine Automotive Electronic Design
05/28/2026 | Zuken
Synopsys Posts Financial Results for Q2 Fiscal Year 2026
05/28/2026 | PRNewswire
Itera Exits Stealth with $12M to Bring Real-Time Prototyping to Electronics
05/27/2026 | BUSINESS WIRE
I-Connect007 Launches Enhanced Homepage to Better Connect the Electronics Industry With News, Expertise, and Resources
05/27/2026 | I-Connect007
Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine
05/18/2026 | I-Connect007 Editorial Team
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | Siemens
PTC Onshape Introduces Direct Altium Integration to Streamline ECAD-MCAD Collaboration
05/12/2026 | PRNewswire
Three Howard University Engineers Launch Trace to Automate PCB Design Workflows
05/12/2026 | Globe Newswire
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMI
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
05/06/2026 | I-Connect007
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | Zuken
XJTAG Launches Free Standalone ODB++ Layout Viewer for Fast PCB Signal Navigation
04/28/2026 | XJTAG
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design Systems
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | Tomachie
Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
05/19/2026 | Global Electronics Association
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMI
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial Team
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial Team
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
04/09/2026 | ASC Sunstone Circuits
Global Electronics Association Announces New Board Members at APEX EXPO 2026
04/07/2026 | Global Electronics Association
Ann Fairchild Named President and CEO of Siemens USA
04/03/2026 | Siemens
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | Elsyca
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007
Zuken Announces Digital Assembly Workflows for Harness Manufacturing
03/31/2026 | Zuken
Cadence Recognized as a Platinum Employer on the Where You Work Matters List
03/25/2026 | Cadence Design Systems
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007
Siemens Launches Fuse EDA AI Agent for Chip and PCB Workflows
03/17/2026 | Siemens
I-Connect007 Magazine: AI, Tolerances, Flexible Circuits, and More
03/17/2026 | I-Connect007 Editorial Team
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007
Introducing Octopart Discover: From Part Search to Solutions Discovery
03/11/2026 | Altium
Zuken Releases Harness Builder for E3.series 2026 for Wire Harness Manufacturing
03/11/2026 | Zuken
APEX EXPO 2026 Show Floor Sells Out – 416 Exhibitors – Largest Manufacturer Lineup in Six Years
03/06/2026 | Global Electronics Association
Podcast Episode 2—AI Is Changing the Rules: Are Your PCB Materials Ready?
03/10/2026 | I-Connect007
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/10/2026 | I-Connect007
Future Electronics, SnapMagic Announce CAD Model Integration to Support Faster Design Cycles
03/04/2026 | SnapMagic
Synopsys Posts Financial Results for Q1 Fiscal Year 2026
03/02/2026 | PRNewswire
Electronics Industry Members Encouraged to Respond Immediately to Tariff Survey
02/24/2026 | I-Connect007 Editorial Team
DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
02/24/2026 | GlobeNewswire
APEX EXPO 2026, Flagship Event for the Global Electronics Association, Showcases the Future of Advanced Electronic Packaging
02/24/2026 | Global Electronics Association
Cadence Completes Acquisition of Hexagon’s Design and Engineering Business
02/23/2026 | BUSINESS WIRE
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
02/23/2026 | I-Connect007
Advanced Electronics Packaging Digest Expands Its Reach With New Substack Presence
02/23/2026 | I-Connect007
Cadence Reports Q4, Fiscal Year 2025 Financial Results
02/20/2026 | Cadence Design Systems
I-Connect007 Launches Six-Part Podcast Series Highlighting the Critical Role of PCB Materials
02/23/2026 | I-Connect007
The Global Electronics Association and ISC3 Announce Strategic Partnership to Advance Circular and Sustainable Electronics
02/18/2026 | Global Electronics Association
I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching
02/17/2026 | I-Connect007 Editorial Team
The Performance-enhancing Benefits of Flexible Circuit Technology
02/05/2026 | Joe Fjelstad, Verdant Electronics
Unlock Breakthrough Electronics Innovation at the APEX EXPO 2026 Technical Conference
01/28/2026 | Global Electronics Association
What’s Next for Global Electronics: A 2026 Outlook from East Asia
01/23/2026 | Sydney Xiao, Global Electronics Association East Asia
Ignite Next Welcomes Synopsys to its Scale-up Program for Deep Tech Innovation
01/20/2026 | PRNewswire
Announcing the New, Integrated I-Connect007 Magazine
01/20/2026 | I-Connect007 Editorial Team
Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
01/14/2026 | PRNewswire
Avnet Insights Survey: Engineers Embracing AI and Confronting Its Challenges
01/14/2026 | Avnet
ESD Alliance Reports Electronic System Design Industry Posts $5.6 Billion in Revenue in Q3 2025
01/13/2026 | SEMI
Following Merger, Top PCB Manufacturers Celebrate Industry’s Most Complete Solution With Brand Refresh
01/08/2026 | ASC Sunstone
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in