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Latest News
Wayve Expands Engineering Leadership to Power Next-Gen Autonomous Driving Technology
New Today | BUSINESS WIRE
Edgewater Wireless Wins Strategic Federal Grant for Advanced Wi-Fi Chip Commercialization
New Today | BUSINESS WIRE
Wayve Expands Engineering Leadership to Power Next-Gen Autonomous Driving Technology
06/27/2025 | BUSINESS WIRE
Berg Insight Expects Rapid Adoption of Autonomous Vehicle Technology in the Next 10 Years
06/26/2025 | Berg Insight
STMicroelectronics Introduces Advanced Human Presence Detection Solution to Enhance Laptop and PC User Experience
06/24/2025 | STMicroelectronics
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswire
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics Association
NXP Completes Acquisition of TTTech Auto to Accelerate the Transformation to Software-Defined Vehicles
06/21/2025 | NXP Semiconductor
Analog Devices Launches ADVentures, a New Corporate Venture Capital Fund
06/21/2025 | Analog Devices, Inc.
New GENESIS Project to Advance Sustainable Semiconductor Manufacturing in Europe
06/20/2025 | PRNewswire
Berg Insight Expects 60 Million Two-wheelers to Have an Active OEM Embedded Telematics System by 2029
06/20/2025 | Berg Insight
Crusoe Announces Strategic European Expansion with First Data Center in Norway, Partnering with Polar
06/19/2025 | Globe Newswire
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswire
Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI
06/18/2025 | PRNewswire
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced Semiconductors
Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging
06/18/2025 | Alpha and Omega Semiconductor
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight Technologies
Agileo Automation Announces Future Expansion of A²ECF-SEMI Automation Framework with SEMI EDA Standards
06/17/2025 | Agileo Automation
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics Solutions
Robust Gaming Demand Drives OLED Monitor Panel Shipments to Rise 69% YoY in 2025
06/17/2025 | TrendForce
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLC
President Trump Secures $200B Investment from Micron Technology for Memory Chip Manufacturing in the United States
06/16/2025 | U.S. Department of Commerce
Robust AI Demand Drives 6% QoQ Growth in Revenue for Top 10 Global IC Design Companies in 1Q25
06/15/2025 | TrendForce
Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
06/13/2025 | Cadence Design Systems, Inc.
China Subsidy Program Drives 1Q25 Smartphone Production to 289 Million Units
06/12/2025 | TrendForce
Nordson Appoints Chase Collier as a Regional Sales Manager for the EDI Product Line
06/11/2025 | Nordson Corporation
Microtech Announces the First U.S. Atrial Microsensor Implantations as Part of its FIH Study
06/11/2025 | PRNewswire
VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research
06/10/2025 | PRNewswire
VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
06/09/2025 | BUSINESS WIRE
Tariff Effects and China Subsidies Soften 1Q25 Downturn; Foundry Revenue Decline Narrows to 5.4%
06/09/2025 | TrendForce
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMS
GigaDevice Anchors Global Headquarters in Singapore to Power Synergy and Impact
06/05/2025 | GigaDevice
New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
06/09/2025 | I-Connect007
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.
Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies
06/05/2025 | TrendForce
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
06/04/2025 | GlobalFoundries
Siemens Announces PAVE360 Support for New Arm Zena Compute Subsystems
06/04/2025 | Siemens Digital Industries Software
New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswire
IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
06/03/2025 | IIT Kharagpur
DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot
06/03/2025 | TrendForce
Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications
06/02/2025 | Elma Electronic
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer Burger
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIRE
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium Corporation
Huawei Single SitePower Solution Creates Four Synergies to Accelerate Site Intelligence
05/27/2025 | PRNewswire
AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
05/27/2025 | TrendForce
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
05/26/2025 | ClassOne Technology
Hitachi Energy, Statnett to Deliver Norway’s First Eco-Efficient Transmission Grid Connection Solution
05/26/2025 | Hitachi Energy
TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure
05/26/2025 | Texas Instruments
AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
05/26/2025 | TrendForce
Qualcomm, Xiaomi Expand Collaboration with Multi-Year Agreement
05/23/2025 | Qualcomm Technologies, Inc.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForce
TRUMPF Electronics Announces the Opening of a Technical Center in Southeast Asia
05/22/2025 | TRUMPF Electronics
STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronics
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundries
Foxconn, Thales Group Announce Strategic Partnership in Semiconductor and Space
05/20/2025 | Foxconn
ICEYE, Safran Announce Strategic Partnership on Persistent Surveillance Capabilities
05/20/2025 | PRNewswire
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca Technologies
Keysight Quantum Control System Embedded within Fujitsu and RIKEN’s World-Leading 256-Qubit Quantum Computer
05/16/2025 | BUSINESS WIRE
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
05/15/2025 | BUSINESS WIRE
Indian Government Establishes Panel for New National Manufacturing Mission
05/14/2025 | I-Connect007
KEC International Lands New Orders, Including Semiconductor Breakthrough
05/14/2025 | KEC International
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRE
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial Team
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