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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EPTE Newsletter
Column from: Dominique Numakura
The EPTE Newsletter from Japan ran from 2014–2021 and was brought to you by Dominique Numakura, the founder and managing director of DKN Research. Prior to this column, he worked for circuit board businesses and packaging material businesses more than 25 years. Dominique developed many advanced technologies in high-density substrates and materials over the last decade. He wrote over 100 articles for major conferences and magazines, and he is the author of several books on electronic packaging technologies. He earned his master's degree in physical chemistry and nuclear chemistry from Ibaraki University, Japan.