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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It hardly feels like the end of 2021, but here we are, looking at a new year and IPC APEX EXPO and AltiumLive coming up in less than two months. If you don’t count days lost during the holidays, it’s more like one month before showtime. Hey, at least we have some live events to attend now. This week, we have some association and trade show news, as well as articles on data management and the diminished role of U.S. chip makers in the global electronics supply chain. We’re almost behind the eight-ball here, folks, and we can’t build chip factories overnight. Let’s get a move on!

EIPC Technical Snapshot Review: Semi-additive Processes

The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.

Alex Stepinski: A Philosophical View

"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."

Solid Data Management Key to Accurate Quotes

Data is omnipresent. At times it goes unnoticed, just waiting there for someone to collect, analyze, and make use of it to create value. Data that seemed irrelevant at the time might come in handy when you need to come up with a solution to a new challenge. When, for instance, you need a reliable quote that can accurately predict a product’s price, you need to base it on past actual operation machine time, raw materials cost, etc. Otherwise, guessing a new product’s price might result in unexpected spending, especially when it concerns sophisticated systems.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”

Happy Thanksgiving From the I-Connect007 Team

In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This month—and this year, really—has just flown by. As someone mentioned to me recently, “There are basically only three full work weeks before New Year’s Day.” Yikes. Thanksgiving is next week, which means most of your customers and suppliers will be hard to reach. Unless there’s a problem, that is! In that case, they’ll find you, even if you’re carving a turkey with the kids and grandkids. So, with a short week on the horizon, most of us are in overdrive now, trying to get ahead of the game.

New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges

Gerry Partida explains, "The industry is at a new point in evolving how we look at building boards. Our industry has historically built boards and then tried to find a test for them. Then, when they found a test for it, they figured out that it needed to be analyzed before they built the board. We did this with electrical test. We built boards and down the road, as people started asking, “Why am I buying bad boards? We should electrically test them,” electrical test was introduced, reluctantly, into the test part of manufacturing printed circuit boards by suppliers or fabricators. Then they embraced it. But when we started testing boards, we did comparison tests."

RealTime with....American Standard Circuits: The Fundamentals of RF and Microwave PCBs

In the second of a series of three RealTime with... interviews, I-Connect007 managing editor Nolan Johnson received knowledgeable and informative answers from John Bushie, director of technology at American Standard Circuits, and Anaya Vardya, president and CEO, to his questions on the unique challenges of RF and microwave PCBs.

From DesignCon: What’s Old is New Again with Selective Heat Sinks

Andy Shaughnessy met with James Hofer, General Manager of Accurate Circuit Engineering, during DesignCon 2021 in San Jose. He discussed some of the new technology they’ve been working on, including copper coins. James explains the benefits of making copper coins—a technology that’s been around for years—in 3D and even laminating them into the board to control heat in one area. James explains, "What we’re doing now is milling and forming these selective heat sinks into different shapes and heights. Rather than put a flat, round, 30-mil thick copper coin into a board, we’ll instead make it with some podiums so that the heat sink gets mounted to the board and is below level, except in particular areas where you bring it flush to the surface of the board, or even higher."

Pulsonix Discusses New Features, Including Design Reuse and Cross Probing

Jim Southward, executive account manager for SouthCom Technologies and head of the North American sales office for Pulsonix, recently met with Nolan Johnson to discuss what's been going on lately at Pulsonix. Jim walks us through some of the new features Pulsonix has added in recent releases, and he details a few handy functions that some users may not even be aware of.

A PCB Design Data Management Overview

In recent issues of Design007 Magazine, we’ve covered strategies for managing specific types of data. But in this issue, we’re looking into data management techniques from a company level. The I-Connect007 Editorial Team recently spoke with three PCB designers who have quite a bit to say about PCB data management: Altium’s John Watson, and Bissell’s Dugan Karnazes and Patryk Akhurst. They discussed their data management philosophies, the need for detailed processes that fit each company, and why data management techniques must undergo continuous improvement to be effective.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Welcome to Friday in mid-November. If you're celebrating Thanksgiving, have you made up your menu and bought the turkey? It will be here before you know it. Around here, we're talking financial news and I've selected my top five financial news items of the week. There was plenty to choose from and my picks this week highlight a few of the most-read financial news pieces from our industry, as well as a couple high-interest technology related pieces. We also released our latest webinar, an 11-part series from the expert at GEN3. Definitely check that one out!

Honoring Those Who Served

On this Veteran’s Day holiday, the I-Connect007 staff takes a moment to honor those men and women over the years, who served to protect and defend their country. Just on the I-Connect007 staff, we have loved ones who served, ranging from World War I to present-day active-duty military. The holiday isn’t intended to be a political statement, but rather a reflection on service, duty, and personal sacrifice. In some cases, the ultimate sacrifice. Our staff has submitted images of veterans who are near and dear to their hearts. Check them out!

Why Good PCB Data Management is Essential

Manufacturing data management consists of four primary components: data transfer, data storage, revision control, and data access. The PCB fabrication and assembly data management system and process is required to be robust to protect customer IP and ensure that the proper data is used to build the product. The entire process assumes that the provided designer data package can’t be built as-is. The design data must be updated/completed after it is received by the manufacturer. Powerful CAD/CAM software has made it easy for designers/companies to pass the final editing and revision control onto their manufacturers. Over time nefarious entities have significantly improved their ability to steal/copy data in parallel with this, thus complicating data transfer and management.

Manage Your Data and Document Everything

One of my biggest nightmares involves getting a call from my boss over the weekend; there’s a problem and they need documentation that I manage, but they can’t find it on our shared drive. At a small company, it’s important to have rules and guidelines about managing documentation. I’m sure bigger companies have full-time employees who oversee PLM systems and make sure every piece of work is documented in a clean and comprehensive way. In a startup environment, though, this type of work usually falls on engineers and the technologists doing the actual testing.

IPC-2581: An Open, Neutral, Efficient Data Transfer Format

PCB design and manufacture has become exponentially more complex as modern electronics providers strive to meet consumer demand for greater connectivity and performance. In the current process, two major pain points need to be overcome to achieve an efficient design and manufacturing process that results in first-time-right products that go to market quickly. The first pain point is time to manufacture—the flow from end of design to start of manufacturing is dependent on multiple communications and shared files between the design house and the manufacturing partner. The second pain point is the design for manufacturing (DFM) analysis that all manufacturers run on the data to see if the design violates any of their manufacturing rules/guidelines.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It’s merger mania! Yes, there’s been a lot of M&A activity lately in our industry over the past few months. This week was no different when it comes to merger activities. In this week’s selections, we have news about DuPont’s acquisition of Rogers, Nano Dimension’s merger with Essemtec, and NCAB’s acquisition of Elmatica. We also have news from SMTA International, and an interview with Joe Clark of DownStream Technologies about their new flex and rigid-flex technology.

Averatek Moves Ahead With A-SAP™, ASAP

During DesignCon, the I-Connect007 Editorial Team spoke with Mike Vinson and Paul Dennig of Averatek. They discussed the company’s latest advances in air cavities and semi-additive processes, and what this new technology will mean to the industry, especially PCB designers. Vinson said, "Over the next 12 months, I think you’ll see more involvement from a number of areas—everything from sensors to the actual printed circuit boards themselves and miniaturization. This technology can enable the more advanced packages and the smaller components to be used on the printed circuit board without a great deal of expensive modification."

DownStream Adding More Flex, Rigid-Flex Functionality

I recently spoke with Joe Clark, one of the co-founders for DownStream Technologies. We discussed the company’s latest software release, which adds more flex and rigid-flex capabilities, as well as updates to the scripting in DownStream’s tools.As Joe explained, "With our current release of software, we focused in on rigid-flex designs, which is becoming a common design challenge for our customers. We’ve implemented support for rigid-flex embedded components going to the next level now, and we’re working with some large companies to define the design for manufacturing checks that would be necessary for verifying these advanced designs. So that’s coming in our DFM release that will be out later this year."

Dan Beeker: Follow the Geometry and Control the EM Fields

Senior principal engineer Dan Beeker of NXP Semiconductor became something of an industry rock star a few years ago with his remake of the Meghan Trainor song “All About That Bass.” With “All About the Space,” Dan had his class attendees humming a tune that reminded them that signals travel in the spaces around the traces, not the traces themselves. Now, Dan is on a mission to spread the gospel of the late Ralph Morrison, who spent much of his career writing and teaching about electromagnetic field theory. In this DesignCon interview, Dan explains why the PCB design community needs to embrace Morrison’s teachings, which he believes could save the industry hundreds of millions of dollars in respins.

Sunny Patel on Design Data Formats

For this issue on design data file formats, we wanted to speak with someone who has experience using Gerber, IPC-2581, and ODB++. Sunny Patel of Candor Industries has used all three of these formats over the years, so we asked him to share his opinion of each format. He also points out why it might be more important to focus on flexibility than any one specific format. As Sunny says, "With Gerbers there’s a lot more opportunity to put different types of data into our pre-CAM software. That could be just us, but we haven’t had any issues so far, knock on wood, with any of the file formats. I just feel like there’s more opportunity to edit and make micro-adjustments on the HDI side with Gerber. But let’s see what happens. Everyone is always improving their file formats."

NCAB Discusses Recent Merger with Elmatica

I-Connect007’s Nolan Johnson catches up with Anders Forsén, chief financial officer at NCAB Group, to get an update on the recently announced acquisition of Elmatica by NCAB. In this audio interview from the NCAB headquarters in Sweden, Anders details how he sees Elmatica and NCAB working together to deliver a stronger solution for customers.

The Case for IPC-2581: Interview with Ed Acheson

Over the last few years, IPC-2581 has hit several milestones: Revision C was released in late 2020 and it now includes complete build intent for rigid-flex circuits. It is also integrated with IPC’s Connected Factory Exchange assembly format. To learn more, the I-Connect007 Editorial Team spoke with Ed Acheson, a senior principal product engineer with Cadence Design Systems. Ed is also one of the developers behind the IPC-2581 design data transfer format. He walks us through the ins and outs of IPC-2581, and explains why he believes this open-source format could be just what PCB designers and fabricators need today and tomorrow.

DFM 101: PCB Via Structures

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Who Selects the Design Data Format, and Why?

For this issue on design data formats, I wanted some feedback from a PCB design bureau, so I spoke with Jen Kolar, VP of engineering at Monsoon Solutions in Bellevue, Washington. I asked Jen who decides on the design data format at Monsoon, and why.

Polar Instruments: Pandemic and Parts Shortage Lead to More R&D Time

During PCB West, I met with Geoffrey Hazelett, VP of sales for Polar Instruments. He explained how the pandemic actually helped Polar’s R&D in the long run, and why the current parts shortages may offer a similar benefit for OEMs, who can now spend more time in what he calls “forced R&D.”

Test Strategies and Pain Points

In this interview with Bert Horner of The Test Connection, Inc., a test engineering service provider, he shares his insights on the trends and challenges for test and inspection. This discussion is centered around common challenges in the industry, and the importance of setting up your test and inspection strategy. Bert states, "The biggest challenge is giving access to the key points and understanding a test strategy prior to the assembly being built."

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 3

The third chapter of this book, "Limitations of Today's Electronic System Design," focuses on the variety of limitations that today’s electronics system designers face as data becomes evermore complex and the industry seeks alternatives past Moore’s law.

I-Connect007 Editor’s Choice: Five Must Reads for the Week

This week’s top picks, as influenced by readership interest, don’t seem to hold to a particular theme. Previously, I’ve referred to this as a potpourri, and now that I’ve done that once, I can’t really do so again, can I? How about a mixed bag? No, I don’t think so. While the news is certainly a diverse assortment, this just feels too obvious.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

There’s a lot going on in the industry this week, and my top five picks have a little bit of everything.

The Case for Gerber: Interview with Karel Tavernier and Dirk Stans

The I-Connect007 Editorial Team recently spoke with Karel Tavernier, managing director of Ucamco, which now takes care of the Gerber format; and Gerber advocate Dirk Stans, managing director of Eurocircuits. They discuss why Gerber continues to be the most popular format for PCB designers, the advantages it offers designers and fabricators, and what the future holds for this resilient format.

Soldering to Aluminum With Mina

At DesignCon, I caught up with Divyakant Kadiwala of Averatek Corporation. He spent a few minutes explaining a special process developed by Averatek that allows technologists to solder to aluminum.

Ken Wyatt: Think of Circuit Traces as Wave Guides

We spoke with Ken Wyatt of Wyatt Technical Services during DesignCon 2021. In this interview, Ken discusses his DesignCon tutorial and how proper stackup planning can help in the fight against radiated emissions. He also points out that many PCB designers lack a true understanding of EMC and radiated emissions in general, and why some knowledge of physics is so important to today’s PCB designers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Well, William Shatner finally did the field research for his role as Captain James T. Kirk this week, going sub-orbital on the Blue Origin launch platform. No, I’m not making fun of Shatner’s flight, quite the contrary. He’s the first actor in the entire Star Trek franchise to go into space while still living. And at 90 years old, he’s now the oldest person to make the trip as well!

The Case for ODB++: Interview with Pat McGoff and Max Clark

To learn more about ODB++, we spoke with Pat McGoff and Max Clark of Siemens Digital Industries Software, two developers who have been working on the format for years. In this interview, they explain how ODB++ works, why they believe designers and manufacturers should switch to this format, and what’s next for ODB++.

Tribal Knowledge and Design Data Formats

I recently began to investigate “tribal knowledge” in PCB and PCBA operations. My goal was to determine whether anything of value would be lost if it were not recorded or preserved for future industry technologists. In the face of modern material science and industry standards, the descriptive title “tribal knowledge” suggests that one must determine what is fact, what is fiction, and what may just be plain embellishment, coincidence, or even magic. In many cases, tribal knowledge seems to be composed of memories of problems solved due to trial and error, coupled with observations of resulting causes and effects.

Sunstone Circuits: Use the Design Data Format That Gives You Best Results

To get some feedback from a PCB prototype manufacturer about design data formats, we asked Matt Stevenson, Sunstone’s VP of sales and marketing, to weigh in. As Matt explains, his company is equally at home using Gerber or ODB++, but it’s not the fabricator’s job to convince customers to use one data format over another. In the end, you should use the format that gives you the best results.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week we have quite a potpourri for you. Our newest columnist, Kim O’Neil of Prototron Circuits, offers details on setting up your own quality management system (QMS). Emmy-winning tech writer David Pogue will be a keynote at IPC APEX EXPO, which I think is a great move on the part of IPC. We have an article from Brent Fischthal of Koh Young America on the value of investing in the latest AOI equipment, which can save you time and money by eliminating false calls.

Collaboration by Design: The Role of EDA Tools

Rapidly designing and building successful electronic circuit boards is always helped by good communication and collaboration among engineering teams (internal and/or external), purchasing departments, and EMS providers. Collaborating effectively and efficiently with colleagues throughout the design cycle leads to better results.

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 2

In Chapter 2 of this book, the subject involves the challenges in the design and development of data center systems. With the exponential growth in data center infrastructure for IT networking, numerous challenges have emerged, from limited ecosystems to high-performance computing issues. There are many constraints to building data centers and updating the equipment in them. Planning is critical in managing increased capacity in the existing data center space.

PCEA Approaches Two-Year Anniversary with New Members and Classes

I recently spoke with PCEA’s Mike Creeden at DesignCon 2021. As PCEA closes in on its two-year anniversary, Mike provides an update on the organization’s growth and plans to continue connecting and educating PCB designers and design engineers.

Applying DFM Analysis to Flexible PCBs

Flex circuit designs have unique properties and materials that separate them from rigid printed circuit boards. The flex circuits’ thinness makes them more delicate, and they are more susceptible to accidental damage during manufacturing. This negatively affects the yield, increasing the per-item cost. Let us explore why running concurrent DFM is even more important with flexible circuitry than for rigid PCBs.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Once again, seemingly like clockwork, the controversy erupts. It’s such a divisive issue, and it seems no one can be undecided in this debate; each of us is expected to take a stand. All of society—including the media—asks, “Which side are you on?”

Real Time with... American Standard Circuits: Flex and Rigid-Flex PCBs

In the first of a series of three Real Time with…ASC interviews, I-Connect007 Managing Editor Nolan Johnson got some no-nonsense answers from Anaya Vardya and Dave Lackey on the topic of flex and rigid-flex PCBs. I was impressed by ASC’s generosity in sharing knowledge and technology.

24 Essential Skills for Engineers: The Story Behind the Book

In this interview with I-Connect007’s own Happy Holden about his newest book, 24 Essential Skills for Engineers, which he wrote over the span of his career, he highlights some particular moments from his time working at HP and as CTO of Foxconn which inspired many of the book’s chapters. Happy explains why he covered engineering skills as well as “soft skills” such as problem-solving and communication—skills which are keys to succeeding as an engineer.

EIPC Technical Snapshot: Updates, Methods, and Interconnections

Not a lot happens in August, when European industry traditionally takes its summer holidays, ready to bounce back re-energised and invigorated in September. EIPC, the European Institute for the PCB Community, got the autumn webinar season off to a flying start with the 11th in their series of Technical Snapshots.

From DesignCon: Electro Rent Beats High Cost of Test Equipment

At DesignCon, I spoke with Rachael Lee, Western regional manager of Electro Rent. This company rents out test and measurement equipment like oscilloscopes and spectrum analyzers—machines that can cost six figures to purchase. In this interview, Rachael explains how the company operates and why certain companies choose to rent test equipment for the long term instead of buying.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Every fall, the action in the world of PCB design and manufacturing begins to pick up again. No more out-of-office email replies; summer vacation is over, and it’s time to get back at it. This week’s Top Five is a veritable pastiche of columns, articles, and news from the electronics industry.

BOMs and the Supply Chain from an Assembler's Point of View

Duane Benson of Screaming Circuits speaks with Nolan Johnson about issues assemblers encounter with BOMs and part shortages. Duane gives advice on how to avoid some common pitfalls.

From DesignCon: Bringing the Power of Simulation to a Wider Audience

Andy Shaughnessy ran into Siemens EDA Product Marketing Manager Todd Westerhoff during DesignCon 2021 and asked him for an update on his company’s simulation and analysis tools. They discussed Siemens’ ongoing efforts to bring the power of simulation to more PCB designers and run simulation earlier in the design process, as well as the challenges Siemens faces in developing tools that appeal to both signal integrity experts and mainstream hardware design engineers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In some weeks, readership numbers are pretty even, which means I make my picks based on “excellence” or “achievement” of some sort. Other weeks, you readers “go viral” on a few key news items, making the selection process numerically driven. This was one of those weeks. Here, then, are the five most-read news items. Of course, leading the way are our esteemed technical editors, Pete Starkey and Dan Feinberg. These gentlemen are examples of my opening statement, as both enjoy huge popularity with readers precisely because they are so good at reporting on the industry.

From DesignCon: EMA Helps Get DFM, Analysis Info to Designers Early in the Process

Andy Shaughnessy recently spoke with Chris Banton, Director of Marketing for EMA Design Automation, during DesignCon 2021 in San Jose, California. He explained how EMA helps Cadence Design Systems push more DFM and signal integrity information into designers’ hands earlier in the design cycle, as well as how they are blurring the lines between PCB and RF design functions. He also discussed the company’s increased efforts creating design education modules for customers who hire inexperienced PCB designers.

The Power of Designer and Manufacturer Collaboration

Whether you are beginning board layout, building the first run of a prototype, or you’re making a change to a mature product several years into its life span, there is no incorrect time to consult your PCB manufacturer. Circuit boards today are dense with features that push the limits of manufacturing technology, and as designers employ these technological advances it’s easy to venture off the well-documented path of standard manufacturing.

From DesignCon: Rogers’ Products at the Right Place and Time

Nolan Johnson recently spoke with Dean Marquart, product manager at Rogers Corporation about his role in managing parts so that customers are getting what they need—and when they need it.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The kids and grandkids are back in school, and fall is on the way. During this busy week, we published a variety of articles, covering everything from trade shows to mergers. It’s hard to argue with IPC’s plans to require proof of vaccine or a negative COVID test to enter IPC APEX EXPO; you can expect other trade shows to follow suit in the future. We’d hate for a show to become a super-spreader event.

Collaboration: The Key to Streamlining Your Design Process

We recently spoke with Patrick Davis, product management director of Cadence Design Systems, about the benefits of collaboration between PCB designers and fabricators—and the drawbacks to throwing designs “over the wall.” Patrick explains why designers and fabricators often seem to be talking past each other, the role that EDA software companies can play in facilitating collaboration, and why IPC-2581 may be the right means for connecting all of design’s stakeholders.

From DesignCon: Insulectro Educating Designers About New Materials

I recently met with Insulectro VP of Technology Chris Hunrath at DesignCon 2021. We discussed a variety of new laminates that Insulectro is distributing, as well as some newer processes and the need to educate designers on the ins and outs of cutting-edge laminates.

Seeking Out Design Education Resources

I’ve been doing PCB design for about 15 years. I started in high school, drawing out simple circuits in an image editor and raiding the local Radio Shack for ferric chloride and copper-clad boards for toner transfer etching. The results were crude, and often didn’t work, but the process was fascinating—and truthfully still is. For as empowering as it can be, PCB design has a shockingly low barrier to entry.

Paying it Forward: DFM Education for Engineering Grads

Every day, I had the opportunity to drive to several Seattle-based design companies and meet with their engineering staffs, usually full of young, recently graduated electrical engineers. Almost every company I visited had employed several recent EE graduates (all named Zach, Ian, or Ashley, it seemed) who were tasked with laying out PCBs. I could tell in a heartbeat that these kids were smart.
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