Latest Articles

Automotive Electronics Driving Innovations in Test

Boon Khim Tan, general manager of the Measurement Systems Division at Keysight Technologies, discusses with I-Connect007’s Stephen Las Marias the increasingly challenging test requirements in the automotive electronics space and the latest trends driving innovation in the sector.

Experience is Key

Sanmina's Bernd Enser, VP of Global Automotive, discusses with I-Connect007's Stephen Las Marias the impact of the latest development trends in cars today on the automotive electronics assembly space, as well as the qualifications required of an EMS provider to get into an automaker's AVL. He also explains why experience is essential to becoming successful in the automotive electronics space, and offers his outlook for the industry.

Benefits of Paralyne Conformal Coatings in Automotive Applications

Automotive systems have been subjected to increasing computerization, applied to virtually all of the vehicle’s operational technology. Since these assemblies are increasingly situated in demanding end-use environments, selection of appropriate conformal coatings for automotive applications is essential to assure efficient performance.

Kyzen Discusses Cleaning On the Stencil Printer

Thomas Forsythe, executive vice president of Kyzen, talks with I-Connect007's Andy Shaughnessy about the latest trends happening at his company and their focus on green cleaning solutions. He also explained the technical paper they presented at the SMTAI 2015 conference, which tackles cleaning on the stencil printer.

Driving Innovation

Arthur Tan, president and CEO of IMI, discusses with I-Connect007’s Stephen Las Marias the latest developments in his company, some of the trends happening in the automotive electronics space, the challenges he is seeing in Asia, as well as the opportunities for growth. He also touches on some of the latest technologies that will help improve the assembly processes.

Addressing the Need for Reliable, Accurate Inspection Results

Nori Koike of Saki Corp. discusses with I-Connect007’s Stephen Las Marias how the latest trends in the automotive electronics space is driving the developments in AOI technology, and the biggest challenges when it comes to providing solutions targeted at the automotive electronics industry.

Rehm Thermal Systems Talks 25 Years of Technology and Trends

Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, talked with I-Connect007's Stephen Las Marias about the business and technology developments and evolution that have happened at the company as it celebrates its 25 years of success in this business.

The Demands on Automated Fluid Dispensing

In an interview with I-Connect007's Barry Matties, Brad Perkins of Nordson ASYMTEK discusses the current demands on dispensing equipment, and the benefits of investing in a high-end dispenser and coating system. He also talks about their strategies to reduce the process time and cycle time of their equipment.

DoD’s First Pass at Grey Market Regulation

The U.S. government gets a great deal of heat for many things, including fostering the introduction of counterfeit components into the supply chain. But when you really study how their procurement process is setup, when you break down the layers, it’s not hard to see how a counterfeit component or suspect material can find its way in.

ELCOSINT - The Future of High Temperature Interconnect

The increasing need for electronic assemblies to endure high-temperature operating conditions in aerospace, automotive, oil and gas drilling, power management and renewable energy applications, whether those conditions involve high ambient temperatures, high cycle temperatures or high junction temperatures, is driving the development of high temperature interconnection technologies.

Technica’s Annual Tech Forum a Success

Co-sponsored by ASM Assembly Systems, with active participation from Koh Young Technology and Rehm Thermal Systems, Technica USA's Annual Technology Forum Event held last July 22–23 in San Jose, California, was again a success. The event featured technical presentations and demonstrations on stencil printing, SPI, SMT placement defects, as well as the challenge in complex boards with 03015 parts up to large components.

Choosing the Right Conformal Coating

Phil Kinner, head of conformal coatings at Electrolube, talks to I-Connect007’s Stephen Las Marias about the impact of increasing electronics in cars on conformal coating requirements. He also highlights the best practices that help automotive electronics makers select the correct conformal coating solution for their applications.

Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded Solder Alloys

This article provides the findings of a lengthy project of soldering electronic components with pure tin finishes with lead-containing solder for the attachment. The object of the project was to determine the conditions under which sufficient alloying of the pure tin finish by lead in the solder is achieved for the purpose of whisker suppression.

Faster, More Precise Jet-dispensing in Microsystems Technology

As miniaturization advances relentlessly, the components that need to be connected are becoming ever smaller and more delicate. At the same time, quality standards and the functionality of the materials are increasing. This development requires joining processes that can reliably fix the smallest of components.

How Automotive Electronics are Driving AOI Developments

Jens Kokott, head of AOI systems at GOEPEL Electronic, discussed with I-Connect007's Stephen Las Marias the increasing need for continuous development of testing technologies to cater to the innovations happening at breakneck speed in the automotive electronics industry.

A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. This article will illustrate the use of strain gauge testing and finite element analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods.

Material Considerations for Advanced Driver Assistance Systems Assembly

Added complexity in material selection comes from the ever-increasing array of applications in automotive electronics, and one of the newer applications is the deployment of an array of vision and detection systems for driver assistance, collectively known as advanced driver assistance systems (ADAS).

Mycronic Jet Printer Technology Addresses Board Challenges

Thomas Bredin, area manager and market support and sales for Mycronic, highlighted the unique characteristics of their jet printer, and how this technology helps customers in maintaining the volume distribution of the solder paste over the pad amid today's trends of high mix of small and big components on the same board.

Automotive EMS: Going Beyond Assembly

The trend toward outsourcing in the automotive industry continues as automotive manufacturers strive to capitalize on the technical expertise and cost effectiveness of the EMS providers. For their part, the automotive EMS players have expanded their role through vertical integration and venture into the realm of non-electronics manufacturing.

Saki Discusses AOI Innovations

Norihiko Koike, COO at Saki Co. Ltd, discussed with I-Connect007's Stephen Las Marias some of the latest 3D AOI technologies at the company, and how these are providing their customers easier programming and more reliable inspection.

The New Face of Automotive Traceability

Depending on the level of detail, accuracy, and timeliness of data capture from areas such as quality management, manufacturing, engineering, and supply chain, traceability can become the ultimate quality-management tool, as well as bring enhanced productivity and reduced operating costs.

OK International Talks Trends Driving Product Innovation Strategies

Bryan Gass, vice president for global sales and marketing at OK International, discussed with I-Connect007's Stephen Las Marias how trends such as automation, wearables, and Industry 4.0 are driving his company's product innovation strategies.

Selecting a Reflow Oven, Part 2

In this follow-up to Part 1, Robert Voigt writes about heating technologies such as vapor phase, infrared and convection--including their pros and cons; methods of board transportation such as belt conveyor and pin conveyor; and inerting systems.

What’s Driving Automotive Electronics?

Despite optimistic forecasts surrounding the automotive electronics industry, challenges remain, driven by the high level of complexity of devices and electronics being built into cars and the harsh operating conditions that these products are expected to operate in. Find out how equipment suppliers and automotive OEMs and EMS providers are addressing these issues in the September 2015 issue of SMT Magazine.

Don’t Allow Standards to Get the Better of You

In the electronics manufacturing industry, there are so many different so-called standards for everything ranging from operational rules and documentation, to quality and traceability, which are confusing, incomplete, and represent a major cost and waste to manufacturing. In the coming Internet of Manufacturing (IoM) age, where standardization of communication and storage of information will be critical, the current way in which we approach and adopt standards cannot prevail.

Collaboration between OEM and EMS to Combat Head-on-Pillowing Defects (Part 2)

There have been many publications, industry workshops, and symposia that describe process mitigation techniques for minimizing the occurrence of head-on-pillow defects during surface mount assembly. In this article, the authors address the root cause of the HoP defect—specifically the link between HoP defects and component warpage.

WKK Discusses Trends and Opportunities in China's Electronics Assembly Industry

WKK's Hamed El-Abd talked to I-Connect007's Stephen Las Marias about his outlook for the electronics manufacturing assembly industry. He also provided his insights on the current business climate in China.

ELEDLights.com: Manncorp's Bright Future

Ed Stone, sales manager at Manncorp Inc., speaks with I-Connect007's Stephen Las Marias about some of the trends he's seeing in the SMT equipment technology space that's driving demand for their ELEDLights.com business.

How Clean is Clean Enough to Achieve Reliable Electronic Hardware?

This article aims to develop an improved test method to measure the resistance on non-cleaned and cleaned test boards using low residue solder pastes under a series of bottom termination components. Testing the location, flux type, quantity and mobility may provide an improved risk assessment of reliability expectations.

Detecting Process Defects

In many cases, the same process problems in soldering, PCB manufacture, and component failures just go round and round and will return if the true cause of failure is not detected. The causes can be highly complex or very simple, but they are available if you care to search. In this article, Bob Willis talks about typical failures of boards and solder joints, process problems and their root causes, and their solutions.

Addressing Quality and Manufacturability Challenges of Mission-Critical Products

Mission-critical military and aerospace PCBAs are based on 100% SMT and optimized for manufacturability from day one of design. But the reality is that many of these products utilize mixed technology. In many cases, these mixed technology designs often violate industry-standard design guidelines, creating manufacturability issues.

Declaring War on Failure in Electronics

Failure, in electronics, while not necessarily desired by either manufacturer or consumer, is expected. This is not to say that the industry has not attempted to improve reliability. In this article, Verdant Electronics' Joseph Fjelstad writes that much is being done in an effort to improve reliability with new solder alloys, new fluxes, new materials, new equipment and process parameters.

Stencils: Why They Still Matter

Eric Weissmann, president and CEO of Photo Stencil, discusses with I-Connect007's Barry Matties some important points about the venerable stencil, the latest in stencil innovation, and the impact stencils, blades, and cleanliness can have on product quality.

Reducing Risks to Employees’ Health with Extraction and Filtration Technology

Occupational health and safety in manufacturing companies have become increasingly important in recent years. As manufacturing processes gain in complexity, the resulting pollutants have become smaller and particularly more exotic. These factors lead to a rising demand for extraction and filtration technology, which reliably protects equipment and employee health, and furthermore, takes account of changing process parameters.

The War on Soldering Defects under Area Array Packages: Head-in-Pillow and Non-Wet Open

The most difficult aspect of any soldering defect on an area array package is the inability to observe the defect easily. This article explains the characteristics of soldering defects to help identify the proper action to take to mitigate the defects in a soldering process. One particular defect in focus is the head-in-pillow (HiP), which are soldering defects on area array packages characterized by a lack of coalescence between the solder paste deposit and the package solder bump.

Acceptance Testing Of Low-Ag Reflow Solder Alloys (Part 2)

In Part 2 of this two-part article series, the authors discussed the test results for low-silver alloys using these solder paste alloy assessment protocols for BGAs and leaded components, and the impact of the alloys on printed circuit assembly process windows.

Acceptance Testing Of Low-Ag Reflow Solder Alloys (Part 1)

The electronics industry has seen an expansion of available low-silver Pb-free alloys for wave soldering, miniwave rework, BGA and CSP solder balls, and, more recently, solder pastes for mass reflow. In Part 1 of this two-part article series, the authors discussed test protocols that can be used for assessing new Sn-Ag-Cu(SAC), Sn-Ag, and Sn-Cu alloys for general use in electronics.

NEPCON Shenzhen 2015 Puts Spotlight on China's EMS Industry

From ODM and OEM to EMS, the Chinese electronics manufacturing industry is transforming from single, passive processing to active, intelligent manufacturing—in line with the "Made in China 2025" plan, as well as the latest trends happening in the electronics industry.

Selecting a Reflow Oven, Part 1

Finding out the size of oven you need is related to the number of zones you can afford. There will be tradeoffs between cost and capabilities, and more zones will always give you better flexibility and more control over your profile—but at a cost. Therefore, decision has to be qualified primarily on your anticipated throughput; that is, how many boards you process in a day or a week.

Supply Chain Risk Mitigation Applications for the Grey Market

It's 2015, and it's time that your supply chain became educated on how to effectively incorporate the benefits that independent distributors and brokers can offer your supply chain, while reducing your risk. If your supply chain still looks down on brokers or independent distributors, you are likely missing opportunities to reduce liability and cost, and increase readiness.

Mechatronics Innovations and Applications

In an interview with I-Connect007, Edward Neff, President of SMAC Moving Coil Actuators, discusses some of the latest mechatronics innovations happening in his company, and how these developments are being applied in different industries including electronics assembly and robotics.

A Greener, Money-saving Approach to Dealing with Waste

EMS firm Sanmina has a high technology manufacturing facility in Huntsville, Alabama, where it produces state of the art PCBAs on several advanced SMT lines, for some of the world’s leading medical and defense companies. Here's how the company was able to manage its hazardous waste disposal and be certified by ADEM, one of the strictest state regulatory agencies in the country.

SMT Magazine August Issue Tackles War on Process Failure

Based on our survey, there are four major issues when it comes to quality and process failure: poor process control, poor training of employees around quality, inability to quickly identify where and how waste is being created, and poor technical support from suppliers. The August issue of SMT Magazine features several though-provoking articles tackling the war on process failure in manufacturing electronics assemblies.

Understanding Parylene Deposition

Parylene's deposition process is unique among conformal coatings. Unlike others that start as a liquid, get deposited and dry, it starts as a solid, turned into a vapor, and then deposited onto the substrate. This article explains this unique method as well as its real advantages.

Fairlight: An Iconic Name in Digital Audio

Fairlight Instruments became one of the biggest names in the recording industry with its digital sampling technology in 1975. Forty years later, the company is still leading with a full line of products that their technologists design, engineer in house, and produce with a network of EMS companies. In this interview with I-Connect007's Barry Matties, Fairlight's Emilijo Mihatov shares insights and strategies for succeeding by thinking differently.

Connector Cleanliness and Flux Entrapment

Plated through hole connectors can present special challenges when it comes to assembly cleanliness and reliability. Cleanliness of the raw part, processing parameters and chemistry selection can all negatively affect the reliability and robustness of the interconnect system. This article will discuss some common issues and how to resolve them.

Localized Contamination Can Cause Big Problems

In today's electronics manufacturing environment, assemblers continue to overlook areas of localized contamination that are capable of causing product failures. By neglecting to examine especially sensitive, critical, or tightly packed areas on an assembly, opportunities for electrochemical failures loom. This article talks about a case study involving a visible white residue and dendritic growth in a connector area, and the analysis done to determine its cause and implications.

ROSE – What Does the Data Mean and When Is It Useful?

Profound changes in the processes and materials used in the electronic assembly industry have a significant impact on the usefulness of ROSE testing. This article will discuss what ROSE test results really mean and when they are—and more importantly, are not—useful.

Meeting High-Speed Demand with Optical Circuits

In an interview with I-Connect007 Publisher Barry Matties, Felix Betschon of vario-optics discusses the advancements in optical circuit boards, and explains the core advantage of this technology and what circuit designers must do to add optical circuits into their design disciplines. He also talks about the opportunities for this new technology, and what's driving customers to consider adopting it.

EchoStar: The Future of Supply Chain Management Done Right

EchoStar isn’t your typical OEM—they take supply chain management to a whole new level. Barry Matties was able to visit Echostar's EMS partner in Shanghai, DD & TT Electronic Enterprise, to take a look at what they are doing, and find out about Echostar's supply chain management strategies.

Cutting Cost, Not Price

In any supply chain survey, the issue of cost comes up repeatedly. This article explores the downside of focussing on price and suggests some of the practical ways you can reduce costs without having a negative impact on your product.

EMI-caused EOS Sources in Automated Equipment

Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This article analyses sources of such noise, how it affects components and how to mitigate this problem.

IPC-A-610: What's New With Rev F?

Why are new revisions created anyway? Can’t IPC just issue updates to the existing revision? Who defines what the changes are going to be and who approves of those changes? Why can’t they make changes for all the new technologies available? And the best question of all: Why does my product have some conditions that are not covered in the documents and specifications? Leo Lambert explains.

Pad Cratering Susceptibility Testing with Acoustic Emission

Pad cratering is difficult to detect by monitoring electric resistance since it initiates before an electrical failure occurs. This article presents the results of pad cratering susceptibility of laminates using the acoustic emission method under four-point bend and compares the AE results to the pad-solder level testing results.

Masking for Parylene Deposition

Parylene conformal coating does an incomparable job of protecting product substrates from harsh, unpredictable operating environments. But inappropriately applied parylene can have an adverse effect on the functionality and performance of an assembly or component. Ensuring proper implementation of masking can help address this.

Residues Can Cause Low Voltage Electronics to Ignite

This article dispels the myth that low-power devices such as remote controls have insufficient energy to be a source of ignition. It also discusses why leakage current, even in low voltage/low power applications, can be sufficient to eventually ignite proximate fuel and lead to sustained fire in PCBA surfaces.

Benefits of Soldering with Vacuum Profiles, Part 2

Part 1 of this article series explained the continuously increasing requirements for void-free solder joints in electronics manufacturing, amid the relentless introduction of new variants of bottom-terminated components. This article takes a closer look at the soldering process with a focus on vacuum profiles, as well as an evaluation project and the obtained soldering results.

China Electronics Manufacturing Industry Welcomes New Era

NEPCON South China 2015 will connect upstream and downstream players in the electronics manufacturing equipment and automation technologies industries, and provide the best possible platform to showcase industry progress, conduct exchange and advance trade.

A Rework Dilemma: PCB Shields

RF shields minimize radio frequency noise to prevent it from affecting the sensitive and critical electronic components beneath the shield, as well as from interfering with neighboring devices or other systems in the vicinity. This article talks about the challenges associated with reworking RF shields on wireless device PCBs.

A Look at the High-Reliability Interconnect Market

In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company's activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.
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