-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Latest Articles
Sensible Design: The Little Guide to Resins

Beyond Design: How to Handle the Dreaded Danglers, Part 2

2016 Election Forecast

Space: Still the Final Frontier

Flexdude Abides: PCB Design for Satellites
The Fundamentals of Improving PCB Thermal Design
EIPC Reliability Workshop, Tamworth, UK, September 22, 2016

Prototron Adding a Variety of Services and Certifications
Quiet Power: Evaluating Evaluation Boards

John Cardone on Designing Flex for Spacecraft
Mike Creeden: Care and Training of Your Designers

Sensible Design: Conformal Coatings - Beware the Boards that ‘Bare’ All!

Beyond Design: How to Handle the Dreaded Danglers, Part 1

Transline Technology is Bullish on Design Engineers

The Evolution of Altium: Road to a Record-Breaking Year

Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols

Orange Co. Designers Council Meeting Draws A Packed House

Increasing Heat Dissipation in FPGAs
The Shaughnessy Report: Voices of the Industry

The Many Voices Over the Past Year

Lightning Speed Laminates: Smaller Circuits--Material Properties and Thermal Issues

Brooks' Bits: Your Traces Have Hot Spots!

Sensible Design: When Coatings Go Wrong

Beyond Design: The Rise of the Independent Engineer

Signal Integrity Tools and Design Methodology in the Modern Age
New SI Techniques for Large System Performance Tuning
The Gerber Guide, Chapters 15 and 16

Software Bytes: Having Fun With Impedance

Mentor Video: Impact of Power Integrity on Temperature

Designing for Profitability: Don’t Over-Materialize

Getting Signal Integrity Right by Design
Beyond Design: Mastering “Black Magic” with Howard Johnson’s Seminars

Making Digital and Analog “Play Nice” at Peavey
Designing With Tighter Tolerances

Lightning Speed Laminates: The Dilemma--Soldermask for High-Frequency PCBs

Designing with Fine Lines and Features

Taylor Guitars Protected with Analog, RF Circuitry

From the CAM Shop: Tight Tolerance Design Tips

Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection

The Importance of Design for Profit (DFP)

Sensible Design: Coatings—Five Essentials for Designers

Beyond Design: The Case for Artificial Intelligence in EDA Tools

The State of the Electronic Design Automation Nation

Changing the World of PCB Rapid Prototyping

EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry

Rogers’ John Coonrod on Insertion Loss

IPC President John Mitchell Discusses IPC's Footprint in China

Tim’s Takeaways: The Basics of Hybrid Design, Part 3

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Romanian Electronics Industry Celebrates 25th Anniversary of TIE

EDA Tools: Automation vs. Control
Institute of Circuit Technology Annual Symposium

DownStream: What a Long EDA Trip it’s Been

The Shaughnessy Report: The Designer Roundtable Roundup
PADS Paper: 10 Things to Know about Thermal Design

Design Automation Tools, Today and in the Future

Beyond Design: DDR3/4 Fly-by vs. T-topology Routing

Designers and Design Engineers: Two Sides of the Same Coin

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 6
