Latest News

Contract Price Increases Offset Seasonal Slump, Boosting DRAM Q1 Revenue by 5.1%
06/13/2024 | TrendForce



Top 10 Global Foundries at 4.3% QoQ Drop in 1Q24 Revenue as SMIC Climbed to 3rd Spot
06/12/2024 | TrendForce


Popular Book on Complex Circuit Board Design Now Available in Audio Format
06/19/2024 | I-Connect007



Geely Auto Gears up NEV Transformation and Innovation with Long-Term SiC Supply Agreement and Joint Lab with STMicroelectronics
06/11/2024 | STMicroelectronics



Collaboration and Data Management the Focus of Latest Podcast From Cadence and I-Connect007
06/19/2024 | I-Connect007

Magnachip Mixed-Signal Unveils Power Management IC and Level Shifter for Display Panels in IT Devices
06/11/2024 | Magnachip Semiconductor

Quantic Electronics Expands Global Footprint with Powell Electronics Distribution Deal
06/10/2024 | Quantic Electronics

Air Liquide Signed Major Contract to Support the Semiconductor Industry in the U.S.
06/07/2024 | Air Liquide

Dolby Laboratories Announces Agreement to Acquire GE Licensing from GE Aerospace
06/07/2024 | PRNewswire




Laser Photonics Completes Proof of Concept Testing for Fonon Corporations' Laser Shield Anti-Drone System
06/06/2024 | BUSINESS WIRE


Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
06/05/2024 | Indium Corporation



Samsung Reportedly Achieves Technical Breakthrough, Stacking 3D DRAM to 16 Layers
06/05/2024 | PRNewswire

Foldable Phone Shipments Gradually Rise, Market Penetration Expected to Reach Nearly 5% by 2028
06/04/2024 | TrendForce
STMicroelectronics to Build the World’s First Fully Integrated Silicon Carbide Facility in Italy
06/04/2024 | STMicroelectronics
Weidmüller Group Announces Randy Sadler as New President & CEO of Weidmuller USA
06/03/2024 | Weidmüller Group
DOCOMO Launches Japan's First Demonstration Experiment of Self-powered Hydropower Base Station
05/31/2024 | JCN Newswire
STMicroelectronics to Build First Fully Integrated Silicon Carbide Facility In Italy
05/31/2024 | STMicroelectronics
Growing Demand for High-Capacity Storage Propels Enterprise SSD Revenue Up by Over 60% in 1Q24
05/31/2024 | TrendForce
Cambridge GaN Devices Signs MoU with ITRI Covering GaN-based Power Supply Development
05/30/2024 | BUSINESS WIRE
SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
05/29/2024 | GlobeNewswire
NAND Flash Industry Revenue Grew 28.1% in 1Q24, Growth Expected to Continue into Q2
05/29/2024 | TrendForce
MLCC Shipments Expected to Increase by 6.8% in Q2 Thanks to Strong AI Server Demand
05/28/2024 | TrendForce
SiC & GaN Power Semiconductor Market Accelerates at 22.9% CAGR to Reach $11.08 Billion by 2034
05/27/2024 | PRNewswire
Quanta Partners with Obsidian Sensors to Spearhead Thermal Imaging Solutions
05/22/2024 | PRNewswire
Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules
05/22/2024 | PRNewswire
Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
05/24/2024 | I-Connect007
HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024
05/20/2024 | TrendForce
Shipments of OLED Monitors Hit 200,000 Units in 1Q24, Annual Forecast to Reach 1.34 Million
05/17/2024 | TrendForce
Magnachip Celebrates the Grand Opening of Magnachip Technology Company in China
05/16/2024 | Magnachip
MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites
05/14/2024 | Globe Newswire
Stefanik’s Advocacy Leads to Biden Administration Revoking Communist Chinese Huawei’s Export Licenses
05/14/2024 | Elise Stefanik
Dragonfly Energy Announces Breakthrough in Lithium Battery Production: Eliminating Harmful 'Forever Chemicals'
05/09/2024 | Globe Newswire
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechEx
HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total DRAM Value
05/06/2024 | TrendForce
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIRE
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRE
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight Technologies
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswire
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswire
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung Electronics
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
04/29/2024 | BUSINESS WIRE
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design Systems
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries Software
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007
Siemens Nederland, VDL Strengthen Partnership for Second-Generation Automated Guided Vehicles (AGVS)
04/24/2024 | VDL Automated Vehicles
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
04/24/2024 | GlobalFoundries
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
04/23/2024 | indie Semiconductor
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
04/23/2024 | GlobalFoundries
Scape Technologies Introduces SCAPE CoCreator at Hannover Messe 2024
04/18/2024 | Scape Technologies
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswire
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID Group
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRE
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