Latest Articles

What Emerging Circularity Policies Mean for the Electronics Industry

As Europe accelerates toward a circular economy, electronics manufacturers face a wave of new sustainability requirements that will redefine product design, materials management, and end-of-life strategies. During a Nov. 11 webinar co-hosted by the Global Electronics Association and the Anthesis Group, industry leaders outlined the regulatory landscape shaping the next decade, including the Eco-design for Sustainable Products Regulation (ESPR), the Right to Repair (R2R) Directive, and the Extended Producer Responsibility (EPR) regulatory framework.

Advances in Conformal Coating Materials and Methods

High-performance electronics must endure everything from rain, dust, and oil to extreme temperatures, shock, and vibration. These reliability demands now share the stage with other priorities such as size reduction, lightweighting, and environmental sustainability. Combined with constant pressure to cut costs, accelerate production, and boost manufacturing efficiency, material suppliers are racing to develop advanced conformal coatings that deliver it all: compatibility with finer-pitch circuitry, durability, eco-friendliness, and manufacturing efficiency.

The Purity of Certification

The global context has changed dramatically. The United States has imposed tariffs on China and other countries with the goal of protecting its market and reducing dependence on distant supply chains. This measure has triggered a strategic realignment in manufacturing: Many companies are now seeking to establish operations closer to their main customer.

Enhancing Reliability in Harsh Environments

SLB is a leading technology OEM in the energy sector, providing technology, equipment, and services to support oil exploration, drilling, production, and processing. This is big business, and the technology can be complex. Chintan Sanghani—a new voice in SMT007 Magazine—is SLB’s expert in quality and process improvement, and I had the opportunity to meet him while in Chicago in October.

Chapters in Action: The Electronics Foundation Helps Students Connect, Learn, and Lead

The Electronics Foundation (formerly IPC Education Foundation), part of the Global Electronics Association, is focused on preparing U.S. students for careers in the electronics industry by fostering collaborations through student chapters. Here, we feature five initiatives that are cultivating a new generation of talent ready to meet the challenges and innovations of modern manufacturing.

Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.

‘Be One of Many’: Reimagining Women’s Roles in the Electronics Industry

One of my favorite ads is a recent one by Mercedes-Benz titled “Be One of Many.” It asks, “What if I didn’t have to be the exception? What if I just want to be one of many?” That simple question cuts deep, revealing how systemic inequality often hides behind the idea of women as rare anomalies. The truth is, in 2025, we’re still having the same conversations: “37% of the manufacturing workforce in Mexico is made up of women,” “the wage gap persists,” “women remain underrepresented in leadership.” None of this is new, and that’s the problem.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I read an interesting article this week about a breakthrough on building microprocessors to run on microwaves rather than traditional digital circuitry. It cites an academic study that begins, “The development of high-bandwidth applications, including multi-gigabit communication and radar imaging, demands faster processing. However, in the microwave regime, where frequencies exceed clock rates, sampling and computation become challenging. Here we report an integrated microwave neural network for broadband computation and communication.”

Real Time with... productronica 2025: Looking Ahead to productronica, and a Stronger European Electronics Ecosystem

Next week at productronica, the Global Electronics Association Europe will be hosting a full program each day of the show at their booth in Hall A1. Philippe Leonard, head of the Association’s European office, recently shared what’s happening for our industry in Europe, details of the Hand Soldering World Championship at the show, a preview of a new Cable & Wire Harness competition kicking off in 2026, and information about the impressive lineup of speakers at the Electronics Industry Forum at the Association’s booth.

Mexico's Moment in Electronics Manufacturing

On a weekday morning in the Bajío, Mexico, a training lab reviews accept/reject criteria before a line changeover. By mid-afternoon, a cross-border shipment clears in El Paso that left Ciudad Juárez at dawn. Farther south, a university team finalizes intake for a new electronics pathway blending online modules with factory practicums. These scenes—routine yet transformative—explain whyMexico is becoming the most strategic partner for the United States to ensure a resilient, innovative, and sovereign electronics supply chain in North America.

Advanced Electronics Packaging Digest: Third Issue Arrives November 17

The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

Pushing Boundaries in Measuring Board Warpage

Akrometrix is a key player in metrology equipment. It focuses on accurately assessing warpage and strain in PCBs and PCBAs and prospers through continuing R&D and local sourcing. I recently met with Neil Hubble, president of Akrometrix, and Paul Handler, director of sales, for a tour of their Georgia facility. We discussed the growing challenge of quality measurement for advanced products and denser designs and the need for industry standardization.

The Technical Backbone of an EMS Company: A CEO’s Perspective

As the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.

Real Time with... SMTAI 2025: Advancing PCB Manufacturing with Laser Depaneling from LPKF

Marcy LaRont and Jake Benz of LPKF discuss the growing interest in laser depaneling technology. Jake introduces the CuttingMaster 2246, a high-power laser that enhances the processing of FR4 substrates.

Koh Young: Committed to Environmental Stewardship

Koh Young has taken several measurable steps toward a more sustainable future. Its holistic approach reflects a deep understanding that sustainability and innovation are not competing priorities but mutually reinforcing forces that shape a more prosperous, responsible, and future-ready enterprise.

Real Time with... SMTAI 2025: SPEA Bridges the Gap Between Legacy and Next-Generation Test Solutions

Established in Italy in 1976, SPEA designs and manufactures automatic test equipment for various industries, including automotive, aerospace and defense, medical, consumer electronics, and energy. Recognized as one of Italy’s top-performing companies, SPEA continues to innovate in test automation technology. At SMTAI 2025, Dustin Warren, vice president of sales for SPEA America, discussed how the company is bridging the gap between older in-circuit test (ICT) systems and newer, more advanced testing solutions.

Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions

Marcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly. 

New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”

I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.

Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium

In this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.

Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment

It’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum. 

Real Time with... SMTA International 2025: Navigating Cybersecurity and Compliance in Manufacturing with Integris

Marcy LaRont introduces Michael Doucette from Integris at the SMTAI show, where they discuss the significance of networking and the new CMMC level 2.0 compliance requirements for manufacturers with DOD contracts. Integris shares their approach to technology assessments and highlights common cybersecurity risks. They emphasize the shift to cloud services and provide practical cybersecurity tips, underscoring the increasing importance of cybersecurity in IT strategies.

Real Time with... SMTAI 2025: The Importance of Precision Cleaning in Electronics Manufacturing with Kyzen

KYZEN Corporation focuses on precision cleaning chemistries for various industries, prioritizing environmental responsibility. In this audio interview with I-Connect007, Dr. Adam Klett talks to us about the role of cleaning in electronics manufacturing, particularly in UHDI technology, where cleanliness affects signal integrity. Material compatibility and sustainability are also key factors in developing new cleaning chemistries that protect electronic components and meet regulatory standards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix

Marcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.

Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology

Joel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.

Unlocking the Promise of AI in Electronics Manufacturing

The electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.

Sealed for Survival: Potting Electronics for the Toughest Environments

Electronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.

Real Time with... SMTAI 2025: Exploring Career Opportunities in Electronics Manufacturing with The Training Connection

Marcy LaRont introduces William Graver, a senior technologist with a rich background in electronics. William discusses the critical role of training in the industry, noting the high demand for skilled workers. He clarifies the difference between certification and practical training, emphasizing the need for hands-on experience. William encourages young people to explore careers in electronics manufacturing.

Mapping the EV Landscape: Markets, Platforms, and Powertrains

e-Mobility is the defining transformation of 21st-century transportation. As legacy OEMs, startups, and governments race to electrify vehicle fleets, the landscape of e-Mobility is expanding into previously unimaginable territory. But with innovation comes complexity, and with complexity, a need for systems that are not only high-performing but also reliably engineered for the long haul. Understanding the diversity and scale of the EV marketplace is essential to grasping the reliability challenges ahead.

SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry

Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.

Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard

When Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.

Sensors: The Invisible Force Behind Modern Convenience and Safety

Sensors and sensor technology are fundamental components of modern life that drive innovation across various electronics and devices. From smartphones to industrial machinery, these small but powerful tools enable seamless interaction with the environment, ensuring efficiency and safety. This article serves as an introduction and overview of sensor technology, highlighting its significance in modern applications and its growing importance in the market as we embrace smarter, more connected systems.

Simplifying Software Integration for Every Factory

As a leading provider of factory digitalization solutions for electronics manufacturers, Cogiscan is at the heart of the software integration process. Davina McDonnell, director of marketing and product management, discusses how Cogiscan ensures that customers are ready to integrate and what it looks for to ensure a quick and appropriate installation.

FCT Leverages Flex Design and Total Build Solutions to Drive Innovation

What’s hot in flexible circuits right now? At PCB West, I spoke with Ben Savage, business development manager at Flexible Circuit Technologies (FCT), about their flex design services and end-markets where FCT sees the most flex activity. We also discussed the company’s focus on providing supply chain resiliency, as well as the constant search for new flex engineers. If you’re looking for a new opportunity in flexible circuits, FCT is hiring.

Five Ways to Revolutionize EMS Sales With AI

If you’ve been in the EMS game for any length of time, you know the sales cycle can be a challenge to navigate. It’s complex, technical, and often a marathon, not a sprint. With OEMs demanding faster turnarounds, tighter margins, and bulletproof supply chains, the pressure is on for EMS providers to stand out in a crowded field.

Global Electronics Association Releases Fall Schedule of Instructor-led Courses

Whether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.

MES Software Tools Need Thoughtful Integration

The Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence,  connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.

New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection

In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.

Light-curable Solutions for Reliable Electronics in Space Applications

Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.

New Course Presents a Comprehensive Guide to IPC Standards

Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics

I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.

Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders

In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.

Catching Up With Mark Wood, Microart Services

Microart Services has been in business for over 40 years, growing from a design PCB layout company to a full-service EMS company focused on serving its customer base with standard and custom solutions. I’ve heard from my rep friends, their competitors, and even my Canadian PCB friends that Microart is “one of the best EMS companies in North America.” That’s why I decided to speak with CEO Mark Wood to discover the secret to his company's success.

EDADOC Ushers in a New Era of Robotics Innovation

On Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.

Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics

According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.

A Catalyst for Success: Meet Emerging Engineers Using the Global Electronics Association to Advance Their Careers

The Emerging Engineer program for the Global Electronics Association is a catalyst for student success, offering tools, resources, and experiences that help shape informed, capable, and confident future engineers. The Electronics Foundation (formerly known as the IPC Education Foundation) invited the following students to attend IPC APEX EXPO 2025 and participate in this program.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on. This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.

India: A Rising Exporter Still Dependent on Global Inputs

India has long been viewed as a country with vast potential in electronics manufacturing. Its large population, low labor costs, and growing domestic demand have made it an attractive destination for global companies looking to diversify production beyond China. In recent years, that potential has begun to materialize. Between 2017 and 2023, India emerged as one of the fastest-growing sources of finished electronics imports globally. This rapid expansion has been built on a foundation of imported components.

IEMI 2026 in Bengaluru: Shaping the Next Era of Electronics

Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, Jan. 29–30, at Taj Yeshwantpur, Bengaluru, builds on the success of IEMI 2024, which took place in both Kuala Lumpur and Bengaluru and attracted over 1,200 participants. From smart factory showcases to IPC-certified soldering competitions, it was a platform for knowledge exchange and technical engagement.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.

Beyond Boards: India’s EMS Revolution Takes Shape

In the past decade, India has made significant strides in electronics manufacturing. From being a largely import-driven consumer market, the country is now transitioning into a global manufacturing and export hub.

Cyient DLM, A Voice from the Frontlines

Once seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.

From Onboarding to Empowerment: How Milwaukee Electronics Invested in Its Workforce—and Its Future

In the competitive, fast-paced world of electronics manufacturing, success is often measured in units shipped, defects avoided, and deadlines met. But for Milwaukee Electronics, a company with more than 70 years of history and operations across the U.S., Mexico, and Asia, true success is defined by something deeper: the people who make it all possible.

Meet the Author Podcast Features Dr. Pritha Choudhury

I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.

How PCBA Excellence Transforms High-mix Operations

With over 30 years of manufacturing excellence, our organization has built deep expertise in PCBA contract manufacturing for downhole oilfield tools. Through years of focused operational leadership in this demanding sector, we've learned that in high-mix, low-volume (HMLV) environments, traditional manufacturing approaches can create more bottlenecks than breakthroughs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in