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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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Happy’s Tech Talk
Column from: Happy Holden
Happy Holden is the retired director of electronics and Innovations for Gentex Corporation. He is the former chief technical officer for the world’s largest PCB fabricator, Hon Hai Precision Indus-tries (Foxconn). Prior to that, Happy was the senior PCB technologist for Mentor Graphics and the advanced technology manager at Nan Ya/Westwood Associates and Merix. He previously worked at Hewlett-Packard for over 28 years as director of PCB R&D, CIM Product Marketing and PCB manufacturing engineering manager. He has been involved in advanced PCB technologies for over 50 years.
He is currently a contributing technical editor to I-Connect007 and recently published his 24 Essential Skills for Engineers book which can be found in the I-007eBooks library.