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Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Latest News
Advanced Circuitry International Opens New Facility in Atlanta Georgia
05/19/2016 | Advanced Circuitry International
Read the DesignCon Award-Winning Paper by Mentor Graphics and Wild River Technology
05/18/2016 | Mentor Graphics
New Cadence Allegro Enhances Flex and Rigid-Flex Capabilities
05/04/2016 | Cadence Design Systems, Inc.
DownStream's Fabstream.com and Electro-Labs.com Combine Resources to Launch Solo-Labs.com
04/27/2016 | DownStream Technologies
Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
04/19/2016 | Andy Shaughnessy, PCBDesign007
Newbury Electronics Supports NOC to Discover More about the Deep Sea
03/29/2016 | Newbury Electronics
Intercept Extends Impedance Calculator App to Apple iOS Devices
03/14/2016 | Intercept Technology Inc.
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
03/08/2016 | Ventec International Group
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