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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Latest Articles
This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi
The Role of EDA Tools in Creating Fab Notes
Catching up With Nate Doemling, New CEO of IMS

An Excerpt From the Book ‘Thermal Management: A Fabricator’s Perspective’

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Real Time With…I-Connect007: The App Notes and Fab Notes Roundtable

Promoting a Circular Economy in Electronics Manufacturing

This Month in SMT007 Magazine: Robustness Is Not the Same as Reliability

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask Joe: Standardized Grid Designs

Catching up With VirBELA’s Glenn Sanford

I-Connect007 Survey on Leadership: More Important Now Than Ever
Just Ask Joe: The Land Warrior Project

Just Ask Joe: Automotive Conformal Coatings

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Got a Question? Just Ask Joe!

Just Ask Joe: Optimum Copper Plating for Thermal Via Farms

Understanding MIL-PRF-31032, Part 2

The Pros and Cons of Working Remotely

New Solder Joint Technology From Schmartboard

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Joe Fjelstad Updates His Online Flex Workshop

Avishtech: A New Player in the Field Solver and PCB Simulation Tools Market

Just Ask Happy: The Exclusive Compilation

This Month in Design007 Magazine: Dear Designers—Please Include a Sanity Check

I-Connect007 Editor's Choice: 5 Must-Reads for the Week

Flex Workshop Update With Joe Fjelstad and Anaya Vardya

I-Connect007’s Latest Innovation: Joe Fjelstad’s E-Workshop on Flexible Circuits

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask Happy: Monitoring Via Reliability on a Lot-by-Lot Basis

Just Ask Happy: What Would You Change About the Industry?

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask Happy: Manufacturing Issues From a Designer’s Viewpoint

Find the Perfect Employee With D.B. Management Group

Selling in a Post-COVID Environment, Part 2

Selling in a Post-COVID Environment, Part 1

With App Notes, Trust But Verify

A New Job Is One Click Away at I-Connect007 Career Opportunities

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Book Excerpt: Power Integrity By Example, Chapter 5

But Wait, There’s More Happy-ness: Happy Holden Wants Your Questions

Cyberattack! Think It Couldn’t Happen To You? Think Again!
What Is the Proper Role of App Notes?
I-Connect007 Leadership Survey: Valuable Lessons From Grandma

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask Happy: Resin-Filled Vias, Without Voids

This Month in Design007 Magazine: When Working Remotely, Cybersecurity Is a Necessity

Just Ask Happy: Integrating Design Processes With IEEE HIR

Understanding MIL-PRF-31032, Part 1

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

Just Ask Happy: Calculating Trace Temps in a Vacuum

Just Ask Happy: Mechanically Drilled Blind and Buried Vias

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask Happy: Two-Layer Low-Speed PCBs

Catching up With Fane Friberg: Supply Chain Management Expert

Materials for Automotive Applications: Thermal Management Issues

IPC: Shawn DuBravac and Chris Mitchell on USMCA

Just Ask Happy: PCB Design For EE Undergrads?

Just Ask Happy: Stacked Microvia Reliability Issues

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 3
