-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Latest News
Mentor Webinar Sept. 8: Post-Route Verification of Multi-Gigabit Channels
08/26/2020 | Mentor, a Siemens business








Flex Expert Joe Fjelstad Releases Nine-Part Flexible Circuit Technology Workshop Series
08/04/2020 | I-Connect007

Mentor July 28 Webinar: A Hybrid Design Verification Methodology
07/23/2020 | Mentor, a Siemens business



EMA Design Automation Webinar Addresses Testing Challenges in PCB Design
07/17/2020 | EMA Design Automation


ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020
07/14/2020 | ESD Alliance


Rogers Corporation's Advanced Connectivity Solutions Business Adds North America Distribution Channel
07/07/2020 | Rogers Corporation

Mentor Webinar: Ensuring DDR4 Electrical Performance at Intended Data Rates
07/02/2020 | Mentor, a Siemens business

Dr. Alessandra Nardi Receives Marie R. Pistilli Women in Engineering Achievement Award
07/06/2020 | Business Wire
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/19/2020 | Andy Shaughnessy, Design007 Magazine
Essentra Components Advise on Efficient PCB Design With New Free Guide
06/16/2020 | Essentra Components
Altium and IHS Markit Partner to Solve Component End-of-Life Issues for PCB Design
06/11/2020 | Business Wire
Eagle Electronics Reduces Cycle Time for IPC-4761 Type VII Via Fill Process
06/08/2020 | Eagle Electronics
Ventec High-CTI Substrate Drives Increased Vehicle Electrification
06/04/2020 | Ventec International Group Co., Ltd.
Digi-Key Electronics Launches PCB Builder to Streamline Ordering Experience
06/02/2020 | PR Newswire
Next Week: App Note Analysis With Design007 Magazine
06/01/2020 | Andy Shaughnessy, Design007 Magazine
Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
06/01/2020 | Business Wire
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in