Driving Innovation: Inner Layer Alignment Methods in PCB Production
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Latest News
GrayMatter Robotics Raises $20M Series A to Fuel Continued Growth and Expansion
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CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan
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NCKU Researchers Develop the First Dual-mode Piezotronics-based Force Sensor
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Keysight Extends Collaboration with Synopsys to Validate Complex RF and Millimeter Wave Design
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5G Time Critical Services Boost Productivity and Efficiency of Industrial Operations
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Rockwell Automation Opens Registration to the 31st Annual Automation Fair
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Low-profile Hybrid FPC-to-Board Connector from Hirose Supports 5A in Miniature Footprint
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LattePanda Team, Global Partners Launch LattePanda 3 Delta, a Pocket-sized Single-board Computer
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Supreme Corporation Named 2022 Top 10 Wearable Technology Solutions Provider
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Antaris Closes $4.2 Million Seed Funding Round for Development of Software Solutions for Space
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Plex Systems Chosen by ZEVx to Automate Manufacturing for Fleet Electrification and EV Platforms
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FACT SHEET: CHIPS and Science Act Will Lower Costs, Create Jobs, Strengthen Supply Chains, and Counter China
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Indium to Showcase GalliTHERM Liquid Metal Technology and No-Clean Semiconductor Flux at SEMICON Taiwan
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GlobalFoundries, Qualcomm Announce Extension of Long-Term Agreement to Secure U.S. Supply Through 2028
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Inventec's O-RAN Convention Showcases 5G Smart Factory Applications with a Supply Chain Alliance
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Dr. Jennie Hwang Appointed the Chairman of Laboratory Assessment Board of The National Academies
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Johanson Enhances WiFi 6E and WiFi 7 and Coexistence Filter Solutions
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Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products
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Universal Joins ASIC, Effort to Fuel America’s Advanced Semiconductor Development
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Avicena Raises $25M in Series A to Fund Development of High Capacity microLED-based Optical Interconnects
08/02/2022 | Business Wire
U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce
08/01/2022 | Business Wire
Keysight Enables Global Certification Forum to Activate Certification of 5G Devices
08/01/2022 | Business Wire
Micron Announces Intent to Bring Leading-Edge Memory Manufacturing to the U.S.
07/29/2022 | Globe Newswire
Cadence: Samsung Foundry Achieves 2X Productivity on Large-Scale Analog, Mixed-Signal IP
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Mouser’s Empowering Innovation Together Explores AI-Based Driver Monitoring
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Gartner Forecasts Worldwide Semiconductor Revenue Growth to Slow to 7% in 2022
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Deep Learning Technology Enables Faster, More Accurate Terahertz Security Inspection
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Cadence Expands into Molecular Simulation with Acquisition of OpenEye Scientific
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Quantum Dot, MicroLED Pioneer Nanosys Secures Over $50M in Growth Capital Financing
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Qualcomm, Mahindra Collaborate to Provide Immersive In-Vehicle Experiences in the All-New Scorpio-N
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Overcoming Electronic Component Supply Chain Disruptions with Spectra
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Researchers to Present Findings on Democratizing Hardware Acceleration in Robotics
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Qualcomm Launches Snapdragon W5+ and W5 Platforms for Next Generation Wearables
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Keysight Enables MICAS to Obtain One of the First O-RAN Certifications for Open RAN Radio Unit
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SkyWater Technology to Build $1.8B Semiconductor Fab at Purdue's Discovery Park District
07/21/2022 | Purdue University
Alloy Products Corp. Receives ISO 14001: 2015 Certification
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Keysight Introduces Cloud-Based End-to-End Open RAN Architect Test Solutions
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TrendForce: Supply Chain Overstocked, NAND Flash 3Q22 Price Drop to Broaden to 8~13%
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SES’s O3b mPOWER Satellites to Provide Global High-Speed Connectivity to Explora Journeys
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Panasonic Energy, Kansas Partner to Advance Plans for US-based EV Battery Facility
07/14/2022 | PRNewswire
Tower Semiconductor, Cadence Expand Collaboration to Accelerate Automotive IC Development
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TTM Releases New Xinger Brand Resistors with RF Power Handling from 100 Watts to 150 Watts
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Elektrobit, Qt Announce Turnkey Development Solution for Next-Gen Automotive Digital Cockpits
07/12/2022 | Elektrobit
Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains
07/11/2022 | Cadence Design Systems, Inc.
Nexus Robotics Receives $2.6 Million in Grant Funding From Sustainable Development Technology Canada
07/08/2022 | PR Newswire
Semiconductor Silicon Wafer Market Size to Grow by $4.14 Billion between 2020 and 2025
07/07/2022 | PRNewswire
ULVAC-PHI Launches Sales of Latest XPS System that Accelerates Battery Research and Development
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NEC Expands Global Solutions Delivery Capacity with Acquisition of Aspire Technology
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Cadence Advances Radar, Lidar, Communications Processing for Automotive, Consumer and Industrial Markets
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Renesas: Strategic Partnership Focuses on Development of Semiconductor Solutions
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Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture
07/01/2022 | Samsung Electronics
New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile, Hyperscale Designs
07/01/2022 | Cadence Design Systems, Inc.
Keysight Launches New Design and Simulation Software for Radio Frequency and Microwave Designers
06/30/2022 | Keysight Technologies, Inc.
Siemens Takes Xcelerator Beyond Software to Connect the Real and the Digital Worlds
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Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success
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Keysight Commissioned Research Finds Automated Testing Remains a Significant Challenge for Organizations
06/29/2022 | Business Wire
Cadence, Intel Foundry Services Collaborate to Accelerate Innovation
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University of Illinois Researchers Create Low-cost High-Yield Plastic Microprocessors
06/28/2022 | University of Illinois
Keysight Enables World Standardization Certification & Testing Group
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New Unified Qualcomm AI Stack Portfolio Revolutionizes Developer Access, Extends AI Leadership
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Cadence Achieves PCIe 5.0 Specification Compliance for PHY, Controller IP in TSMC Advanced Technologies
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Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies
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Keysight Selected by Azcom for Verifying Open Radio Access Network Equipment Compliant to O-RAN Specifications
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Amphenol Awards Digi-Key Electronics 2021 Best Performance High Service – Digital
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CyberOptics to Launch Next-Generation WaferSense & ReticleSense Auto Teaching Systems during SEMICON West
06/22/2022 | CyberOptics Corporation
Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow
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Off-season Offsets Wafer Pricing Increase, 1Q22 Foundry Output Value Up 8.2% QoQ
06/20/2022 | TrendForce
Keysight, Synopsys Collaborate in TSMC’s N6RF Design Reference Flow
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Cadence Design IP Portfolio in TSMC’s N5 Process Gains Broad Adoption Among Leading Semiconductor, System Companies
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Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes
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Ynvisible Strengthens European Sales Channels, Signs Distribution Agreement With Computer Controls AG
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NEC Introduces a Transceiver that Can Tap into the Higher Frequency Bands of 5G Networks
06/15/2022 | ACN Newswire
Cadence Digital, Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes
06/15/2022 | Cadence Design Systems, Inc.
Finwave Semiconductor Addresses the 5G Challenge with Breakthrough 3DGaN FinFET Technology
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Qualcomm Acquires Cellwize to Accelerate 5G Adoption and Spur Network Infrastructure Innovation at the Edge
06/13/2022 | Qualcomm Technologies, Inc.
Cadence Cerebrus Delivers Transformative Results on Next-Gen Designs
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AEWIN Partners with Blaize to Deliver High Performance GSP Computing for Edge AI Applications
06/13/2022 | Business Wire
IAR Systems Accelerates Innovation for Solutions Based on Arm Cortex-M85 Processor
06/13/2022 | PRNewswire
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