Latest Articles

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

Standards Committees: Moving Faster, Working Better

Standards committee work is where much of the heavy lifting takes place for industry standards. To the inexperienced eye, the committee process can also seem as perplexing as it is crucial. In this conversation, Teresa Rowe, IPC’s senior director of assembly and standards technology, highlights what to expect from standards committee sessions at IPC APEX EXPO 2023. New committees, revisions, leadership, awards, and thoughtful pauses to celebrate achieving milestones are all part of the IPC APEX EXPO standards committee experience.

Altium Focuses on Design Education

Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.

STEM Program: Evolving and Growing

IPC has a responsibility to its current members but also in attracting and retaining new talent to the electronics manufacturing industry. This is no more evident than in the STEM event hosted by the IPC Education Foundation at IPC APEX EXPO. For the 2023 event, more than 500 students from nearly a dozen high schools are expected to participate in hands-on activities, touring the show floor, and learning from industry experts. The Career Panel Luncheon will expand across the in-person event as we broadcast and stream to schools across the United States.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

“New year, new you.” That tagline seems to be everywhere right now. All five must-reads this week reflect this theme. Does this apply to you and your company? We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.

The Battle of the Boards

Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.

Shawn Dubravac: What’s New in Tech

As the world grapples with issues like climate change, consumers and manufacturers are increasingly looking for ways to reduce environmental impact. This has led to a focus on fostering innovation in sustainable materials, renewable energy sources, and recyclable components. One example is CarbonX, a new carbon material composed of nano-sized carbon filaments that could help tire makers meet the increasing demand for sustainability. Technology will play a pivotal role in this transformation and one sector set to see tremendous change is the auto industry.

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Turn E-textiles Concepts Into Real-World Products

IPC E-Textiles 2023 is an international forum for materials suppliers, product designers, manufacturers, technical experts, and company executives from around the world to collaborate on all areas of the supply chain for e-textiles technologies in the fashion design, health and medical, sports and athletics, automotive, and military and aerospace sectors. It takes place Monday, Jan. 23, in conjunction with IPC APEX EXPO. This year’s event will feature informative and engaging presentations encompassing all areas of e-textiles, Q&A discussions with presenters, and a panel discussion on the economic and business aspects of e-textiles.

Real Time with… IPC APEX EXPO: Technica Keeps the Heat on a Hot Market

As the leader of a firm representing multiple equipment and supplies manufacturers in both the EMS and PCB fab markets, Technica USA president and CEO, Frank Medina, has a commanding view of what’s happening in the industry. In this Real Time with... IPC APEX EXPO 2023 preview, Nolan Johnson asks Frank what’s hot in the industry, and what visitors can expect to see from Technica at IPC APEX EXPO in San Diego.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.

Book Excerpt: 'The Electronics Industry’s Guide to… The Evolving PCB NPI', Chapter 3

With the need to move design data efficiently into manufacturing for assembly and test purposes, starting from a single source of intelligent data seems to be obvious. However, with different applications with different capabilities this can be difficult to achieve. Real-world support for any format can vary between machine and software vendors.

Real Time with… IPC APEX EXPO 2023: Blackfox Starts Year Off by Opening New Locations

Andy Shaughnessy recently spoke with Sharon Montana-Beard, vice president and director of sales for Blackfox Training Institute, about their plans for IPC APEX EXPO 2023 and the upcoming year. Sharon discusses the company’s expansion plans, including their seventh facility, opening soon in Minneapolis, and the meetings and events she’ll be attending in San Diego.

IPC APEX EXPO 2023 Special Session Sneak Peek

The IPC APEX EXPO 2023 Technical Conference at the San Diego Convention Center will feature two hot topics—Advanced Packaging and e-Mobility/EV Automotive—in custom and curated Special Sessions on Thursday, Jan. 26. Please plan your travel accordingly to attend these exciting sessions.

'Happy New Year' Celebrations Around the World

New Year’s Eve is tomorrow, and 2023 is around the corner. Where did the time go? That’s the $64,000 question. We celebrate New Year’s Day, in part, to help us mark the passage of time—sort of a shared experience for the human race. Humans have been celebrating New Year’s Day for thousands of years, but the party really took off in 45 BC, after Julius Caesar revamped the Roman calendar. From that point until the middle of the 18th century, New Year’s Day in Europe fell on a variety of days, including Dec. 25, March 1, and March 25. Andy Shaughnessy gives us the details.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Just because it’s a holiday week doesn’t mean the news is slow. Okay, maybe a little bit slower than normal, but “slower” can also be the same as “fast, just less fast.” We’re going a bit deeper into the list for our must-reads looking for high-impact hard news. I mean, you’ve all read the curated stuff already, no sense rehashing that. In fact, I’ll even throw in a bonus news item just because there was some good stuff this week. Have a great New Year’s weekend.

Reconnecting the Social Network

If the past two years have emphasized anything, it would be the importance and value of face-to-face networking at events. Face-to-face interactions help create lasting relationships with new connections and help strengthen existing relationships with industry friends and colleagues. Thousands of industry leaders, manufacturing innovators, and subject matter experts from across the globe will convene in San Diego for IPC APEX EXPO 2023, making it the place to be to help you connect with representatives from the entire electronics manufacturing supply chain. We have a full line-up of networking events planned for IPC APEX EXPO 2023 that you don’t want to miss.

The Five Most-read Design007 News of 2022

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Harry Styles album. So, grab some leftover ham and hang out with us for a while. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.

Five-Star Reflow Recipes: Q&A With Rob Rowland

In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

CyberOptics: New Partnership Shows Promise for Semiconductor Industry

Nolan Johnson checks in with Sean Langbridge, European sales director for CyberOptics, at electronica to discuss details of the recent merger between CyberOptics and Nordson and the partnership’s potential benefits for customers, especially regarding solutions geared toward enhancing the accuracy of test and inspection in advanced packaging. The company’s unique optical technologies, including its MRS sensors and AI² software, are already saving customers hours on the line; with Nordson’s X-ray capabilities in the mix, CyberOptics sees some very compelling technological solutions on the horizon.

Essemtec: Manufacturing Moves In-house

Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.

Let’s Get Technical

IPC members are constantly working to move the electronics industry forward by developing new technologies, innovative processes, and testing methods—and working to find solutions to known technical challenges. The IPC APEX EXPO Technical Conference is the premier forum in North America where these challenges, solutions, and innovations are shared among colleagues and competitors alike.

The Five Most-read Design007 Articles of 2022

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album. So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.

Looking Back: Here’s What Topped PCB Assembly Content in 2022

With the shutdowns of the pandemic a bit of a distant memory, industry activity really picked up in 2022. I thought it would be interesting to look back and see what captured the most interest in assembly news over the past year. Here are the top five most-read news articles and columns amongst our readers interested in printed circuit assembly this year, ranging from lowest to highest reads.

The Most-read I-Connect007 Articles of 2022

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like an Avril Lavigne album. So, grab a cup of eggnog and curl up by the fire! For your holiday enjoyment, here’s a blast from the past: the top five most-read I-Connect007 articles of 2022.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

In this week leading up to Christmas, we have a little bit of everything. Pete Starkey has a review of the most recent EIPC Technical Snapshot, while Tom Kastner discusses the dwindling number of PCB companies in North America. Are we really down to 170 companies? IPC reports that North American PCB sales up 26.1% in November YOY, and the book-to-bill is dead-on at 1.00. Cybord CEO Zeev Efrat explains how his company can provide 100% component inspection. And I have an interview with a student I ran into at PCB Carolina who is working toward his “dream job” on being a technician. As Alex Barile says, he’d hate to work at a desk all day; he likes to install equipment.

Cybord: 100% Component Inspection Is Here

Nolan Johnson speaks with Cybord’s Zeev Efrat about managing supply chain issues through advanced component verification procedures. Efrat describes the four-step process Cybord recommends to not only ensure that the components used are genuine and in good condition, but also to provide detailed provenance at the component level, thereby improving OEMs' ability to provide cradle-to-grave traceability.

The First India Pavilion

For the first time, IPC APEX EXPO will host an “India Pavilion,” showcasing 16 Indian companies promoting India’s electronics manufacturing capabilities. The initiative was undertaken by the Ministry of Commerce & Industry, Government of India, and implemented by the Indian government agency, Electronics and Computer Software Export Promotion Council (ESC) India.

Taiyo: Reopening Europe for Solder Mask

Nolan Johnson and Stuart Down discuss Taiyo’s partnership with Ventec and how both companies are leveraging their expertise to blaze a trail into the European PCB market. Stuart shares his outlook on the market and the unique challenges posed by global political instability and supply chain constraints, as well as how Europe’s evolving chemical regulations have impacted solder mask formulation. With their sights set on ramping up manufacturing capabilities, Taiyo sees a secure path forward to establishing a sizeable market presence in this promising region.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.

A New Gathering Place for Designers

IPC APEX EXPO started out as a show for the PCB manufacturing community, but it’s grown beyond that. This year, there’s more design curriculum at the show in San Diego than ever before. IPC instructor Kris Moyer has been instrumental in leading the organization’s efforts around PCB design and design engineering curriculum. So, I asked him the million-dollar question.

Intermingling Semiconductor and PCB Machine Capabilities

In the midst of electronica, which included the co-hosted SEMICON show, Nolan Johnson speaks with Koh Young’a Harald Eppinger about the convergence of capabilities in the IC and PCB lines at Koh Young. In addition, Eppinger points out that while there are similarities between the global regions of production, there also are unique requirements.

The Value of Training Committees

IPC APEX EXPO 2023 is right around the corner and the training groups are assiduously preparing for these meetings. IPC certification programs, built around IPC standards, play a key role in bringing value to the electronics industry. They are created and approved by training committees consisting of subject matter experts and trainers from around the world.

Industry Innovation Starts Here

If it isn’t clear already, your money, time, and effort will be well spent attending IPC APEX EXPO in January. Here, we’ve outlined the top six reasons that this event will be the highlight of your year. We’ve done all we can to make the event not only memorable, but a show that allows you to connect with industry peers, learn how to enhance your skills, help advance the industry, and discover new insights on products and strategies from industry innovators.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re into December, and the new year is around the corner. Things are looking pretty good for our industry. Trade show attendance is back up to pre-COVID levels, and a lot of companies are having banner years. Has the virtual trade show gone the way of the dodo bird? Let’s hope! This week, our must-reads include articles and news items on the decline of R&D, STEM education for kids, why vias do not heat up, the need for more DFT, and the lack of movement toward intelligent data transfer. Designers just love their Gerbers, but Dana Korf has a few ideas about how to make Gerbers obsolete.

The Test Connection: Spreading the Word About DFT

As signal speeds continue to increase and feature sizes decrease, PCB designers are beginning to pay greater attention to test and design for test (DFT) strategies. Bert Horner, president of The Test Connection in Hunt Valley, Maryland, is spearheading this drive to show designers the benefits of a solid DFT plan, as well as the downside of not having a test strategy. I met with Bert at PCB Carolina, where he was exhibiting and presenting a paper during the conference. We discussed his presentation, as well as why designers need to understand test and DFT issues, and why we need to see the PCB as one small—but very important—part of the entire system.

Trailblazing Substrates in PCB Fabrication

Todd Brassard, vice president and COO at Calumet Electronics, participated not only in the IPC Advanced Packaging Symposium in Washington, D.C., Oct. 11-13, but also met with congressional staffers at the Capitol during his visit. Todd does not back down from a challenge, and the one in front of him is no different. It’s why his company is at the forefront of the conversation, and he plans to keep it that way.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

Randy Faucette Discusses PCB Carolina’s Explosive Growth

One of the fastest-growing tabletop shows is PCB Carolina, which is held at NC State University in Raleigh. Each year, the show draws more exhibitors than the venue hall can hold, pushing some exhibitors out into the lobby. And this year, the number of registered attendees broke the 1,000 mark for the first time. At PCB Carolina, I spoke with Randy Faucette, the founder of the Research Triangle Park design bureau Better Boards, which organizes this annual tradeshow and conference, and I asked him to share the secret to this show’s expansion.

The Growing Need for UHDI

Jan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.

The Critical Nature of High-performance Computing

Dale McHerron is senior manager at IBM Research and oversees heterogenous integration research. In his presentation, Dale spoke about the need to architect the next generation of AI systems, and what it means to the infrastructure to run AI systems at this high level of technology.

Excerpt: The Evolving PCB NPI Process, Chapter 2

Managing the supply chain for electronics manufacturing has always been challenging. About 70-80% of the cost of building an electronic product is for the parts, while the remaining cost is in the process to assemble and test the product. However, during the worldwide pandemic, the strain on the overall supply chain for any product has been stretched to the breaking point. When supply of toilet paper, hand towels, and sanitizer is disrupted and cannot be found on the grocery store shelves, one could imagine the challenges in a similarly disrupted supply chain of efficiently acquiring complex electronic components.

The ‘Intel’ on Advanced Packaging Options

Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?

Brian O'Leary: Organizing to Meet e-Mobility in the Market

Brian O’Leary, head of Indium's e-Mobility & Infrastructure, reacts to SMTAI’s keynote delivered by John Thomas of Autel. The title of the keynote presentation was "The Electronic Vehicle (EV) Conundrum" which addressed the sheer scale of the transition to e-Mobility that we are now undertaking. In this interview, O’Leary discusses some of the technical challenges faced in product development by Indium (and everyone else) as well as the new IPC e-Mobility council. Participation in the council is open to everyone.

Understanding the UHDI Market

The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

An Opportunity to Give Thanks

I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.

Advanced Packaging Symposium: Looking in the Rearview Mirror

Matt Kelly had the vision and Jan Vardaman set the tone for the IPC Advanced Packaging Symposium, Oct. 11-13 in Washington, D.C. So, did they accomplish their goals? What were the real takeaways from the event, and what can we expect to see next? Spoiler alert: Matt and Jan came away impressed in more ways than one.

Material Management and Control

In a market that is trying to catch up with increasing customer demands and quickly ship products out the back door, no electronics manufacturing plant can afford to lose any time or resources during the production process. Manufacturers are forced to do more with less and get the most out of every single precious component.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy. There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.

Electronica: Picking Up Where We Left Off

The productronica/electronica pairing of trade shows is an experience unlike any other; anyone who has ever attended is likely to back me up on that claim. This year’s iteration of electronica, taking place in Messe Munich, Nov. 15-18, is no exception. I-Connect007 was onsite to gather the news and share our impressions of the show. First, the show’s attendance was rumored to be in the 60,000+ range. This number sure seemed to be reasonable given the crowd sizes we witnessed.

Strength in the Market for 2022 and 2023

In this conversation, Joel Scutchfield, general manager and sales director, discussed Koh Young’s growth and success through 2022 (as evidenced by their recent receipt of the same Service Excellence Award, two years in a row) and hints at some of what we can expect from Koh Young in 2023.

Momentum at Electrolube / MacDermid Alpha

We talk with Beth Turner, senior technical director, about how the integration between Electrolube and MacDermid Alpha is proceeding, especially the added momentum the new organization is bringing to product development. Beth also outlines some of the key customer needs that are driving product R&D.

Your Shortage Is Someone Else’s Excess

Excess inventory is a ubiquitous issue in the electronics manufacturing services (EMS) industry, and it is made worse by the complexity and volatility of the modern supply chain. Considered an unavoidable cost of doing business, unchecked inventory cost has wreaked havoc on manufacturers without strict controls in place to keep their businesses safe. Excess inventory is not only costly for manufacturers themselves, but also for their end customers. Unwillingly, manufacturers are sometimes forced to eat this cost to avoid disrupting relationships with their customers and with the hope of making up the losses in next year’s orders from the customer.

Laying It on the Line

What are the current challenges in managing workflow on a manufacturing floor? The I-Connect007 Editorial Team breaks down the process with Jason Sciberras, president of Saline Lectronics Inc., who shares insight into how his team has responded to the challenges faced across the industry. Jason says his key strategy has been the willingness to invest in technology, step back and look at the problems, and be bold enough to take risks. The payoff? A company that’s growing and customers that keep coming back.

ICAPE USA's Jeremy Griner Talks Market Conditions

ICAPE USA managing director Jeremy Griner discusses current market conditions for PCB fabrication and shares the ICAPE perspective on which industries are experiencing growth. Griner also outlines how ICAPE is navigating current shipping and logistics challenges while continuing to grow sales during these dynamic times.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.

IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023

IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.

Real Time with... SMTAI 2022: Essemtec Claiming Its Place in the Automated Factory

Bryce Timms, managing director, gives Nolan Johnson a tutorial on Essemtec’s position in the market, how Essemtec (as a division of Nano Dimension) fits not only into the additive manufacturing space but also in the more traditional EMS market.

Working on the Hill to Build a Future

The message can’t be emphasized enough: Producing IC substrates overseas weakens America’s position and national security. In this frank discussion with Will Marsh, president of PCBAA, he talks about his efforts to educate government policymakers on the dire need to consider the entire microelectronics ecosystem. There’s power in numbers, Will says, and he sees the association’s efforts making a difference.

Advanced Packaging Gets an Additive Upgrade

The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in