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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Column from: Matt Stevenson
Matt Stevenson
Matt Stevenson started in the PCB industry in 1995, came to Sunstone in 2006 as quality manager, and progressed to vice president in 2019. He has extensive experience in the PCB industry and has proven his skill and dedication to Sunstone by continuing to grow the company’s revenue, partnerships, and lead excellent customer experiences. Matt’s knowledge of the process from sales to production to quality control provides him a unique view of how to keep Sunstone growing and ahead of our competitors, and his background places him as the most appropriate figure to manage Sunstone's messaging, branding, and value proposition. With eight years as quality assurance manager at Sunstone Circuits, he has proven himself to be an invaluable resource, excelling in managing the quality of the Sunstone product line, and is uniquely qualified to represent the Sunstone brand. Matt has earned two Bachelor of Science degrees in chemistry and chemical engineering from Colorado State University, as well as a master’s degree in business administration from Portland State University.