-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Ecosystems to Innovation
This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
Business Diversification and Display Electronics
Get the latest insights on business diversification, LED display electronics design, AI’s growing role in manufacturing, PCBAA’s five-year milestone, and more.
Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Latest News
Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil
01/13/2017 | Advanced Copper Foil
Ventec’s Martin Cotton to Showcase Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
01/10/2017 | Ventec International Group
MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
12/21/2016 | MacDermid Enthone Electronics Solutions
December 2016 Issue of The PCB Design Magazine Available Now
12/14/2016 | Andy Shaughnessy, PCBDesign007
Barry Hurley, PCB Designer and Porch Dawg Guitarist, Dies at 57
11/17/2016 | Andy Shaughnessy, PCBDesign007
Advanced Circuits Upgrades its Free PCB Design Software, PCB Artist 3.2
10/19/2016 | Advanced Circuits
EMA Puts SiliconExpert Part Insight Into OrCAD Design Environment, Reducing Supply Chain Risk
10/18/2016 | EMA Design Automation
Silicon Valley Designers Council Chapter Meeting Oct. 13
10/05/2016 | Silicon Valley IPC Designers Council
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in