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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Latest News
IPC Designers Council OC Chapter Meeting Features Julie Ellis of TTM
07/06/2016 | Judy Warner, I-Connect007
Accurate Circuit Engineering Implements Online DFM Reporting Tool
06/28/2016 | Accurate Circuit Engineering (ACE)
Voices of the Industry: Your Thoughts Wanted for Our August Magazine Issues
07/29/2016 | I-Connect007
Orange Co. DC Chapter Meeting: PCB Cost Adders
06/01/2016 | IPC Designers Council, Orange Co. Chapter
Douglas G. Brooks Co-Authors “Trace and Via Currents and Temperatures”
05/25/2016 | Douglas G. Brooks
Advanced Circuitry International Opens New Facility in Atlanta Georgia
05/19/2016 | Advanced Circuitry International
Read the DesignCon Award-Winning Paper by Mentor Graphics and Wild River Technology
05/18/2016 | Mentor Graphics
New Cadence Allegro Enhances Flex and Rigid-Flex Capabilities
05/04/2016 | Cadence Design Systems, Inc.
DownStream's Fabstream.com and Electro-Labs.com Combine Resources to Launch Solo-Labs.com
04/27/2016 | DownStream Technologies
Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
04/19/2016 | Andy Shaughnessy, PCBDesign007
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