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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Latest News


Downstream Technologies Releases CAM35 Version 15 and BluePrint-PCB Version 7
10/12/2023 | DownStream Technologies, LLC


Keysight EDA 2024 Integrated Software Tools Shift Left Design Cycles to Increase Engineering Productivity
09/27/2023 | Keysight Technologies, Inc.




Ultra Librarian to Dramatically Reduce CAD Model Build Times with New AI-Driven Part Creation Methodology
09/19/2023 | Ultra Librarian


Cadence Next-Gen AI-Driven OrCAD X Delivers Up to 5X Faster PCB Design with Cadence OnCloud
09/13/2023 | Cadence Design Systems, Inc.

The September 2023 Issue of Design007 Magazine Available Now
09/11/2023 | I-Connect007 Editorial Team

Cadence Completes Acquisition of PHY IP Assets from Rambus
09/08/2023 | Cadence Design Systems, Inc.















Ansys Enables Flexium's 5G mmWave Antenna Module Designs to Advance ADAS/AV Technology
07/13/2023 | PRNewswire
Keysight Introduces PathWave Design 2024 with Automation, Collaboration Support for Enterprise EDA Workflows
07/11/2023 | Keysight Technologies, Inc.
Renesas Chooses Altium to Unify Company-Wide PCB Development, Accelerate Solution Design
06/27/2023 | Business Wire
Ventec to Showcase Latest PCB Materials for High-end RF, Microwave Applications at IMS 2023
06/08/2023 | Ventec International Group
Rogers Corporation to Exhibit with John Coonrod Presenting at IMS 2023
06/08/2023 | Rogers Corporation
American Standard Circuits to Exhibit at the International Microwave Symposium 2023
06/05/2023 | American Standard Circuits
Cadence Appoints Mary Louise Krakauer as Chair of the Board
05/12/2023 | Cadence Design Systems, Inc.
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