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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Latest News

Douglas G. Brooks Co-Authors “Trace and Via Currents and Temperatures”
05/25/2016 | Douglas G. Brooks
Advanced Circuitry International Opens New Facility in Atlanta Georgia
05/19/2016 | Advanced Circuitry International


Read the DesignCon Award-Winning Paper by Mentor Graphics and Wild River Technology
05/18/2016 | Mentor Graphics






New Cadence Allegro Enhances Flex and Rigid-Flex Capabilities
05/04/2016 | Cadence Design Systems, Inc.



DownStream's Fabstream.com and Electro-Labs.com Combine Resources to Launch Solo-Labs.com
04/27/2016 | DownStream Technologies


Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
04/19/2016 | Andy Shaughnessy, PCBDesign007
Newbury Electronics Supports NOC to Discover More about the Deep Sea
03/29/2016 | Newbury Electronics
Intercept Extends Impedance Calculator App to Apple iOS Devices
03/14/2016 | Intercept Technology Inc.
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
03/08/2016 | Ventec International Group
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