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Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRE
Gartner Survey Finds 61% of Organizations Are Evolving Their D&A Operating Model Because of AI Technologies
05/01/2024 | Gartner, Inc.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight Technologies
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswire
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswire
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung Electronics
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
04/29/2024 | BUSINESS WIRE
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design Systems
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries Software
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007
Siemens Nederland, VDL Strengthen Partnership for Second-Generation Automated Guided Vehicles (AGVS)
04/24/2024 | VDL Automated Vehicles
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
04/24/2024 | GlobalFoundries
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
04/23/2024 | indie Semiconductor
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
04/23/2024 | GlobalFoundries
Scape Technologies Introduces SCAPE CoCreator at Hannover Messe 2024
04/18/2024 | Scape Technologies
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswire
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID Group
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRE
FPT Unveils Strategic Directions, “All In” on AI, Automotive and Semiconductor
04/15/2024 | BUSINESS WIRE
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess Industrial
U.S. Updates Advanced Semiconductor Ban, Actual Impact on the Industry Will Be Insignificant
04/09/2024 | TrendForce
Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity
04/08/2024 | Microchip Technology Inc.
Sondrel Poised to Support the Evolution of Intelligent Cars with Ultra-Complex Chips
04/08/2024 | Sondrel
Keysight Becomes Validated Test Tool Provider for FiRa 2.0 Technical and Test Specifications
04/05/2024 | Keysight Technologies, Inc.
indie Semiconductor Announces Strategic Investment in AI Processor Leader Expedera
04/03/2024 | indie Semiconductor
Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion
04/03/2024 | BUSINESS WIRE
Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
04/02/2024 | Indium Corporation
Scientists Propose a New Way to Search for Dark Matter
04/02/2024 | SLAC National Accelerator Laboratory
Murata Selected as a Clarivate Top 100 Global Innovator for 3rd Year in a Row
03/29/2024 | Murata Manufacturing Co., Ltd.
Recommended Cash Offer by Keysight for Spirent Communications PLC
03/29/2024 | Keysight Technologies, Inc.
AST SpaceMobile ASIC Chip Enters Tape-Out Phase in Collaboration with TSMC
03/28/2024 | BUSINESS WIRE
Embedded World 2024: Rohde & Schwarz Presents its Cutting-edge Test Solutions for Embedded Systems
03/27/2024 | Rohde & Schwarz
Accenture Invests in Sanctuary AI to Bring AI-Powered, Humanoid Robotics to Work Alongside Humans
03/27/2024 | BUSINESS WIRE
Intel Announces New Program for AI PC Software Developers and Hardware Vendors
03/27/2024 | Intel Corporation
NASA Uses ORNL Supercomputers to Plan Smooth Landing on Mars
03/26/2024 | Oak Ridge National Laboratory
Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
03/25/2024 | PRNewswire
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/29/2024 | I-Connect007
Keysight Accelerates Its 6G Efforts with NVIDIA 6G Research Cloud Platform
03/22/2024 | Keysight Technologies, Inc.
Keysight, Capgemini Validate 5G New Radio RAN Solution for Non-Terrestrial Networks
03/21/2024 | Keysight Technologies, Inc.
NEC, Skyloom to Pioneer 100 Gbps Space Optical Communications, Transforming Global Internet Connectivity
03/20/2024 | JCN Newswire
Kioxia, WD Elevate Capacity Utilization, Pushing NAND Flash Supply Growth to 10.9%
03/19/2024 | TrendForce
Nano Dimension Announces Another Deep Learning AI Patent Granted to its DeepCube Technology
03/19/2024 | Nano Dimension
Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era
03/19/2024 | Cadence Design Systems
Siemens, NVIDIA Expand Collaboration on Generative AI for Immersive Real-time Visualization
03/19/2024 | PRNewswire
Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3
03/18/2024 | Qualcomm Technologies, Inc.
2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry
03/18/2024 | TrendForce
HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation
03/15/2024 | TrendForce
inTEST Expands Electronic Test Capabilities with Acquisition of Alfamation S.p.A.
03/14/2024 | BUSINESS WIRE
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
03/14/2024 | Cadence Design Systems
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
03/14/2024 | TrendForce
Qualcomm Announces Shortlisted Teams for the Qualcomm Vietnam Innovation Challenge 2024
03/13/2024 | Qualcomm Technologies, Inc.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
03/12/2024 | JCN Newswire
Keysight, ETS-Lindgren Deliver First Narrowband Non-Terrestrial Networks Over-The-Air Test Solution
03/07/2024 | BUSINESS WIRE
Nordson to Demonstrate Plasma Treatment, Automated Fluid Dispensing Systems at SEMICON China 2024
03/06/2024 | Nordson Electronics Solutions
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