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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Latest Articles
PCBflow Helps Designers Choose Best Manufacturer for the Job

The Many Complexities of PFAS

UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium

Being the Best Design Engineer

The Challenges, Opportunities, and Future Specialties of PCB Design
I-Connect007 Editor’s Choice: Five Must-Reads for the Week

OrCADX: High Performance That's Easy to Use

The Survey Said: What Does It Take to Become a Great Designer?

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UHDI Fundamentals: Talking UHDI with John Johnson, Part 3

The Survey Said: What’s the Difference Between Good and Great Designers?

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 3

Cadence Continues ‘Left Shift’ of SI Functions

Embedded Design: Materials Matter

Embedded Capacitors for PCBs, Chips, and Packages

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Build Tariff Planning into Product Development Strategy Early

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Imagineering Driven by Customer Demand

Design Guidelines for Flexible Printed Circuits

Catching up with BidChip’s Moshe Hezrony

EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends

Every Designer Needs to Understand Embedded

Ventec: The Flexibility We Need in Standards-driven Manufacturing

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The Designer and Manufacturer Must Be in Sync

A System Designer’s Dream World at DuPont

DesignCon: Suzanne Deffree Feeling Positive Energy

What Designers Should Know About Test

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Rain or Shine, DesignCon 2024 is Happening

BOOK EXCERPT: 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design', Chapter 5

Talking Digital Twin and DFT With Aster

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Mya Gatzke: Mapping Out Her Future

Save Your Design by Understanding Fab Processes

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What Do You Know About PCB Manufacturing?

Beyond Blueprints: Early Involvement Shapes Superior Fab Outcomes

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Book Excerpt: 'The Printed Circuit Designer's Guide to... Designing for Reality,' Chapter 2

EDA Tools and Unconventional Geometries - Designing Embedded Components
Happy New Year 2024 From I-Connect007

I-Connect007 Editor’s Choice: Five Most-returned Holiday Gifts

UHDI Fundamentals: Talking UHDI with John Johnson, Part 2

Holiday Greetings From the Staff at I-Connect007

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Unconventional Geometry Design Techniques

Engineering Their Future at PCB Carolina

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Your Thermal Designs Are Inefficient

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