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Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Latest News
Prices of TBBPA Rise After Crackdown on China's Bromine Companies
08/18/2017 | Doug Sober, Essex Technologies Group
Register Now for Mentor’s FloTHERM Award for Excellence Competition
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Nine Dot Connects and Solidworks Roadshow: PCBs in the Age of Mechatronics
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I-Connect007 Launches ‘The Printed Circuit Designer’s Guide to… Signal Integrity by Example’ Micro eBook
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Artificial Machines Standardizes on Mentor EDA Solutions to Develop Smart Machine IP
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Mentor's FloTHERM Offers New Command Center for Productivity and Performance
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Ultra Librarian Desktop Software Gets Advanced PDF Scraping Capabilities from Existing EMA Technologies
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Orange County Chapter of IPC Designers Council Lunch 'n' Learn Meeting July 19
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Mentor OSAT Alliance Streamlines IC High-Density Advanced Packaging Design and Manufacturing
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Intercept Technology Makes Strides with New Pantheon PCB/Hybrid/RF Layout Software Version
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Mentor Paper: DDR4 Board Design and Signal Integrity Verification Challenges
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New Ultra Librarian Website Provides ECAD/MCAD Models, Part Pricing
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Mentor Collaborates With Microsoft to Accelerate Internet of Things Solutions
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