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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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Latest News
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
03/08/2016 | Ventec International Group
Cadence’s OrCAD Capture Supports Intel Schematic Connectivity Format
02/17/2016 | Cadence Design Systems, Inc.
EMA Launches Fun Valentine’s Day Contest for Electrical Engineers
02/10/2016 | EMA Design Automation
Corelis to Showcase Latest JTAG & Serial Bus Protocol Products at IPC APEX EXPO 2016
02/02/2016 | Corelis, Inc.
Mentor Graphics Names 26th Annual PCB Technology Leadership Awards Winners
01/21/2016 | Mentor Graphics
ORBOTECH: Gul Technologies Implements InCAM and InPlan Pre-production Solutions
01/19/2016 | Orbotech
Freedom CAD Services Exhibits PCB Offerings at DesignCon
01/13/2016 | Scott McCurdy, Freedom CAD Services
EMA Design Automation Announces Unprecedented OrCAD Offer for Innovators
01/13/2016 | EMA Design Automation
Ventec to Unveil New 'tec-speed' Brand for High Speed/Low Loss Materials at DesignCon 2016
01/13/2016 | Ventec International Group
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