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This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
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Latest News
Mentor's Web Seminar on HyperLynx DRC Safety Critical and Creepage Checks
12/21/2018 | Mentor, a Siemens business
Mentor Paper: Ensuring DDRx Reliability by Integrating SI, PI
12/19/2018 | Mentor, a Siemens business
December Issue of Design007 Magazine Available Now
12/18/2018 | Andy Shaughnessy, Design007 Magazine
Cascade Chapter of IPC Designers Council Meets Dec. 7
11/29/2018 | IPC Designers Council, Cascade Chapter
Intelligent Framework Aims To Optimize Data Transfer in 5G Networks
11/29/2018 | North Carolina State University
Ventec to Focus on 5G, New Energy Vehicle and Mini LED Solutions at HKPCA 2018
11/29/2018 | Ventec International Group Co., Ltd.
November Issue of Design007 Magazine Available Now
11/21/2018 | Andy Shaughnessy, Design007 Magazine
New Mentor Xpedition Platform Delivers 'Shift-Left' Multi-Dimensional Verification
11/15/2018 | Mentor, a Siemens business
DownStream Technologies Unveils Updates of CAM350, DFMStream and BluePrint-PCB
11/14/2018 | DownStream Technologies, LLC
IPC Recognized by White House as a Major Contributor of New Job Opportunities to US Market
10/31/2018 | I-Connect007
Corelis Introduces New Features and Enhancements in ScanExpress Software Version 9.0
10/30/2018 | Corelis, Inc.
Cadence Named One of the World’s Best Multinational Workplaces for 2018
10/19/2018 | Cadence Design Systems, Inc.
Orange Co. Designers Council Chapter Meeting with SMTA Nov. 1
10/17/2018 | IPC Designers Council, Orange Co. Chapter
The October 2018 Issue of Design007 Magazine Available Now
10/17/2018 | Andy Shaughnessy, Design007 Magazine
Mentor Xpedition and PADS Professional Win ISO 26262 Functional Safety Compliance
09/17/2018 | Mentor, a Siemens business
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