-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Inside Atotech and Challenges Ahead
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.
The Human Side of Automation
The September issue examines why human experience remains essential as PCB manufacturers adopt AI and automation, then looks at how Europe’s design communities use regional perspectives on today’s global industry challenges.
From Ecosystems to Innovation
This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Latest News
National Instruments App Note Demos EM Verification of Complex PCBs
01/29/2019 | National Instruments
Rogers to Show High-Speed and Millimeter Wave Materials at DesignCon 2019
01/28/2019 | Rogers Corporation
Orange County Chapter of the DC Designers Council Meeting January 22
01/15/2019 | Scott McCurdy, Freedom CAD Services
Ventec's Technology Ambassador Alun Morgan to Keynote at AltiumLive 2019
01/14/2019 | Ventec International Group
Mentor’s Hands-on Workshop on Virtual Prototype with HyperLynx
01/11/2019 | Mentor, a Siemens business
Mentor's Web Seminar on HyperLynx DRC Safety Critical and Creepage Checks
12/21/2018 | Mentor, a Siemens business
Mentor Paper: Ensuring DDRx Reliability by Integrating SI, PI
12/19/2018 | Mentor, a Siemens business
December Issue of Design007 Magazine Available Now
12/18/2018 | Andy Shaughnessy, Design007 Magazine
Cascade Chapter of IPC Designers Council Meets Dec. 7
11/29/2018 | IPC Designers Council, Cascade Chapter
Intelligent Framework Aims To Optimize Data Transfer in 5G Networks
11/29/2018 | North Carolina State University
Ventec to Focus on 5G, New Energy Vehicle and Mini LED Solutions at HKPCA 2018
11/29/2018 | Ventec International Group Co., Ltd.
November Issue of Design007 Magazine Available Now
11/21/2018 | Andy Shaughnessy, Design007 Magazine
New Mentor Xpedition Platform Delivers 'Shift-Left' Multi-Dimensional Verification
11/15/2018 | Mentor, a Siemens business
DownStream Technologies Unveils Updates of CAM350, DFMStream and BluePrint-PCB
11/14/2018 | DownStream Technologies, LLC
IPC Recognized by White House as a Major Contributor of New Job Opportunities to US Market
10/31/2018 | I-Connect007
Corelis Introduces New Features and Enhancements in ScanExpress Software Version 9.0
10/30/2018 | Corelis, Inc.
Cadence Named One of the World’s Best Multinational Workplaces for 2018
10/19/2018 | Cadence Design Systems, Inc.
Orange Co. Designers Council Chapter Meeting with SMTA Nov. 1
10/17/2018 | IPC Designers Council, Orange Co. Chapter
The October 2018 Issue of Design007 Magazine Available Now
10/17/2018 | Andy Shaughnessy, Design007 Magazine
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in