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Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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Latest News
April 2018 Issue of Design007 Magazine Available Now
04/16/2018 | Andy Shaughnessy, Design007 Magazine
TTM Wins Excellent Supplier Award From United Automotive Electronic Systems
04/11/2018 | Globe Newswire
Cadence Sigrity PowerDC Supports Future Facilities' Open Format
03/21/2018 | Cadence Design Systems, Inc.
Ultra Librarian and Digi-Key Team to Offer Symbols for 1.25 Million Components
03/21/2018 | Digi-Key
Now Available: The March 2018 Edition of Design007 Magazine
03/14/2018 | Andy Shaughnessy, Design007 Magazine
Cadence Named One of the 2018 Fortune 100 Best Companies to Work For
02/19/2018 | Cadence Design Systems, Inc.
I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
02/13/2018 | I-Connect007
Mentor Launches HyperLynx Solution with Automated and Intelligent Channel Extraction for SerDes Interfaces
02/13/2018 | Mentor, a Siemens business
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
02/12/2018 | Ventec
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