Latest Articles

Tim Haag Celebrates 10 Years as a Columnist

I ran into columnist Tim Haag at PCB West, who was visiting the show with co-workers from the technical writing company First Page Sage. We discussed Tim’s years as a Design007 Magazine columnist, and some of the drivers affecting the technical writing market, such as the retirement of many PCB subject matter experts who were also go-to writers within their companies.

The First India Pavilion

For the first time, IPC APEX EXPO will host an “India Pavilion,” showcasing 16 Indian companies promoting India’s electronics manufacturing capabilities. The initiative was undertaken by the Ministry of Commerce & Industry, Government of India, and implemented by the Indian government agency, Electronics and Computer Software Export Promotion Council (ESC) India.

Taiyo: Reopening Europe for Solder Mask

Nolan Johnson and Stuart Down discuss Taiyo’s partnership with Ventec and how both companies are leveraging their expertise to blaze a trail into the European PCB market. Stuart shares his outlook on the market and the unique challenges posed by global political instability and supply chain constraints, as well as how Europe’s evolving chemical regulations have impacted solder mask formulation. With their sights set on ramping up manufacturing capabilities, Taiyo sees a secure path forward to establishing a sizeable market presence in this promising region.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.

NCAB Creating a New Culture of Success

NCAB has been one of the most active companies in the industry when it comes to growth through acquisition, building an extensive global network over time. During the electronica show in Munich recently, Nolan Johnson met up with Greg Nicol and David Grant, both managing directors with NCAB’s UK organization. Greg and David had number of interesting insights on NCAB to share.

A New Gathering Place for Designers

IPC APEX EXPO started out as a show for the PCB manufacturing community, but it’s grown beyond that. This year, there’s more design curriculum at the show in San Diego than ever before. IPC instructor Kris Moyer has been instrumental in leading the organization’s efforts around PCB design and design engineering curriculum. So, I asked him the million-dollar question.

Industry Innovation Starts Here

If it isn’t clear already, your money, time, and effort will be well spent attending IPC APEX EXPO in January. Here, we’ve outlined the top six reasons that this event will be the highlight of your year. We’ve done all we can to make the event not only memorable, but a show that allows you to connect with industry peers, learn how to enhance your skills, help advance the industry, and discover new insights on products and strategies from industry innovators.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re into December, and the new year is around the corner. Things are looking pretty good for our industry. Trade show attendance is back up to pre-COVID levels, and a lot of companies are having banner years. Has the virtual trade show gone the way of the dodo bird? Let’s hope! This week, our must-reads include articles and news items on the decline of R&D, STEM education for kids, why vias do not heat up, the need for more DFT, and the lack of movement toward intelligent data transfer. Designers just love their Gerbers, but Dana Korf has a few ideas about how to make Gerbers obsolete.

Physics, Electrical Engineering, and PCB Design

When I was a sophomore in college, I had an amazing professor for Physics II: Electricity and Magnetism. He made a series of complex topics fun to learn, and his personality and way of teaching were almost tailor-made for the way I like to learn. He explained new concepts through practical examples, and always kept students engaged throughout the class, making sure everyone understood the lectures. Physics II was an engineering prerequisite, and I didn’t mind taking the class since I really enjoyed the material. However, I did find myself wondering a few times, “Will I ever use any physics in real life?” It turns out that the answer to the question was yes.

Polar Instruments: Simulating PCB Potentialities

Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.


The Test Connection: Spreading the Word About DFT

As signal speeds continue to increase and feature sizes decrease, PCB designers are beginning to pay greater attention to test and design for test (DFT) strategies. Bert Horner, president of The Test Connection in Hunt Valley, Maryland, is spearheading this drive to show designers the benefits of a solid DFT plan, as well as the downside of not having a test strategy. I met with Bert at PCB Carolina, where he was exhibiting and presenting a paper during the conference. We discussed his presentation, as well as why designers need to understand test and DFT issues, and why we need to see the PCB as one small—but very important—part of the entire system.

Electronics vs. Physics: Why Vias Don’t Get Hot

Most of are aware that when we pass an electrical current through a trace (conductor), the trace will heat up. This temperature increase is caused by the I2R power loss dissipated in the resistance of the trace. The resistance of a copper trace is mostly determined by its geometry (cross-sectional area), and there are lots of studies trying to look at the relationship between the current down a trace (of known size) and the resulting temperature of the trace. But the situation is much more complicated than this. There are physical properties that exist that result in helping to cool the trace. These properties are usually a combination of conduction of the heat away from the trace through the material, convection of the heat away from the trace through the air, and radiation of the heat away from the trace.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

Randy Faucette Discusses PCB Carolina’s Explosive Growth

One of the fastest-growing tabletop shows is PCB Carolina, which is held at NC State University in Raleigh. Each year, the show draws more exhibitors than the venue hall can hold, pushing some exhibitors out into the lobby. And this year, the number of registered attendees broke the 1,000 mark for the first time. At PCB Carolina, I spoke with Randy Faucette, the founder of the Research Triangle Park design bureau Better Boards, which organizes this annual tradeshow and conference, and I asked him to share the secret to this show’s expansion.

The Growing Need for UHDI

Jan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.

An Opportunity to Give Thanks

I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.

My Experience With Maxwell

I was first introduced to James Maxwell in 1967 as a college student. I had to decide whether I would take the Maxwell fields course or the switching and coding course. Being a chemical engineering major with a co-major in control theory, I had heard about the trials and tribulations of the infamous Maxwell fields course.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy. There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.

The Physics of PCB Design

In this wide-ranging interview, Dr. Eric Bogatin discusses the relationship between physics and electrical theory, and why it’s critical for designers and design engineers to understand the laws of physics. As he points out, the math is important, but designers shouldn’t let the principles of physics “hide behind the math.” Eric discusses some points of physics that designers need to understand, the physics resources available, and why it’s so important to have some understanding of Maxwell’s equations, even if you don’t have a strong math background.

DownStream Flexes in Rigid-Flex

During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.

PCB Carolina Breaks Attendance Record

PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!

IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023

IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re officially in show season and Managing Editor Nolan Johnson just got back from SMTA International. As he says in his review, the show drew a sizeable crowd this year. With the pandemic in the rear-view window, let’s hope our trade shows are getting back to normal.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.

The Printed Electronics Roundtable, Part 3

We recently conducted a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this third and final installment of the roundtable, these experts discuss some of the differences and similarities between PEC and traditional PCB processes, the future of printed electronic circuits, and why the best way to learn about this technology is through networking with veterans of this segment who are eager to share their expertise with the next generation.

Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book

There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.

HDI, A-SAP and mSAP: A Designer’s Point of View

HDI—high-density interconnect—designs require some different thinking on the part of the designer. One of the first things to consider is whether you need HDI, and if so, how much. The HDI option comes into play as soon as you purchase any components with 0.5 mm pin pitch. The number of these components and other specifications of your design will determine the amount of HDI you will need. Here’s a quick list of HDI options.

Forming Standards for Ultra HDI

To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?


EMA Helps Ease Designers’ Supply Chain Woes

Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.

Q&A: The Learning Curve for Ultra HDI

For this issue on ultra HDI, we reached out to Tara Dunn at Averatek with some specific questions about how she defines UDHI, more about the company’s patented semi-additive process, and what really sets ultra HDI apart from everything else. Do designers want to learn a new technology? What about fabricators? We hope this interview answers some of those questions that you may be having about these capabilities and what it could mean for your designs.

Sunstone and I-007eBooks Launch Book on Designing for Reality

I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality. This book covers both written and unwritten rules for how to create a realistic, manufacturable design.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.

Ultra HDI Primer

We recently spoke with Herb Snogren, an industry veteran and consultant with Summit Interconnect tasked with leading the company’s ultra HDI efforts. Herb is co-chair of the IPC ultra HDI subcommittee, IPC D-33-AP. In this interview, Herb discusses the current state of UHDI, how designers and fabricators can get started working in this new frontier, and why the U.S. must invest in UHDI technology now to counteract Asia’s near dominance of the UHDI segment, which has left some of our critical industries vulnerable to supply chain disruptions.

Microvias Can Be Stacked in Certain Package Densities

Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.

IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs

There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.

Lessons Learned: Breaking Down the Four Types of Communication

Kelly Dack and Nolan Johnson explore the silver linings from the past two years, especially the importance of good communication. These skills are—as they have always been—key to the success of the project. But how do you define the best methods for communication? Kelly breaks down four personality types and why it’s important to recognize how one person differs from another. When you better understand how a person thinks, your level of effective communication increases exponentially.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.

From the Floor at PCB West 2022

Though the organizers of PCB West had soldiered through in delivering a conference every year during the pandemic, the virtual and hybrid models just did not quite meet the requirements for a technical conference. To be fair, the limitations weren’t PCB West’s fault; the shortcomings came from the show’s virtual environments, not the host. All the more encouraging, then, that the 2022 edition of PCB West was back in bloom.


PCB West 2022 Draws Biggest Attendance in Years

There were more attendees at PCB West 2022 than I can remember in the time that it’s been held in this wing of the Santa Clara Convention Center. The show floor was busier than I’ve seen it in years. For the first couple of hours, the aisles were jammed with attendees, even on the outside aisles. You couldn’t walk without squeezing past other attendees. It was a topic of conversation all day: “How about this crowd? Wow.”

The Chip Shortage Leads to Innovation

The chip shortage is by no means over, with estimates expecting it will last into 2023. Some could see it taking even longer, such as Intel CEO Pat Gelsinger, who expects it to see shortages into 2024 due to those now impacting electronics production equipment. But if there’s any bright spot to be had, it’s that a crisis often leads to long-term solutions. In this case, it’s the increase in government funding for semiconductor production in the United States. Once the CHIPS Act proceeds, we can significantly accelerate building semiconductor fabs in the United States and work toward preventing future chip shortages that would put us back into our current situation.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.

DFM 101: Final Finishes—ENEPIG and IAg

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB. The other use for a final finish is to provide a known contact resistance and life cycle for connectors, keys, or switches. The primary purpose of a final finish is to create electrical and thermal continuity with a surface of the PCB.

Catching Up With John Johnson, New Director of Business Development at ASC

It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.

Book Excerpt: The Electronics Industry’s Guide to… The Evolving PCB NPI Process, Chapter 1

The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry. What follows is an excerpt from Chapter 1: 'How the NPI Process Has Changed and Where We're Going'.

Some Relief, But Hold Off on the Party

To help PCB designers and design engineers get a clearer picture of the stress points in the industry, particularly from a company that deals directly with EMS providers, we reached out to CalcuQuote CEO Chintan Sutaria with a list of questions. The following Q&A explores trends in the PCB supply chain and heady advice for dealing with long lead times and counterfeit parts.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.

Pack Your Bags! We’ve Got Your Trade Show Calendar Here

It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!

Part 2: The Printed Electronics Roundtable

We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.


IPC: Companies Are Intentional About Tracking Environmental and Social Risks

Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows. As part of IPC’s ESG for Electronics initiative, IPC is interested in developing resources for members on the most common ESG methods and priorities of leading companies across the electronics value chain. In support of this, IPC has preliminarily analyzed the ESG reports of approximately a dozen companies in selected portions of the industry.

A New Sourcing Paradigm

We’ve seen many changes over the past few years, and nowhere are they more evident than in the world of sourcing components. Sourcing has become one of the biggest challenges facing PCB designers and design engineers today. Gone are the days of procuring parts from a single source, and communication between stakeholders and distributors is critical. But as we learned in a conversation with I-Connect007 columnist Kelly Dack, PCB designers can use certain layout strategies to plan for the unexpected, such as leaving extra real estate so that smaller components can be replaced by larger, readily available parts if the originals become “unobtainium.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.

Altium’s EDDI Report Tracks Components’ Availability—Today and Historically

There’s one lesson that all designers have learned over the past few years: Components might be here today and gone tomorrow, so tracking your parts is more important than ever. Any resources that help you keep tabs on your required parts are invaluable in these days of 40-week lead times. Earlier this year, Altium released one such resource: the Electronic Design to Delivery Index (EDDI) report. Assembled from millions of bytes of data gleaned from the Octopart search engineer and the Nexar platform, the monthly EDDI report provides part availability histories going back years, as well as a real-time snapshot of global inventories.

Designing Through Supply Chain Pain

Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?

September 2022 Issue of Design007 Magazine Available Now

Supply chain management is a dynamic situation, with a number of global forces that can create pain for PCB designers. In this issue, we speak with a variety of experts and bring you up-to-the-minute insight about designing PCBs in this ever-changing environment.

Ventec Thermal Management Book Excerpt: Chapter 1

Regarding basic principles of thermal dissipation there are three ways of dissipating energy: Conduction, convection, and radiation. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator.

Material Conservation: The PCB Designer's Role

During these times of supply chain uncertainty, many product developers are considering new ways to conserve materials—from laminates to components, layer reduction, and everything in between. Barry Matties and Happy Holden recently spoke with Alun Morgan, president of EIPC and technology ambassador for Ventec, about material conservation strategies for today’s PCB designers and design engineers. Alun explained why this may be the perfect time to educate PCB designers about conserving materials: When a model is broken, the people involved are much more open to new ideas.

Designing for Material Conservation Means Changing Attitudes

It makes a lot of sense: During times when the supply chain is stretched to the breaking point—and the last few years certainly qualify—what if PCB designers created boards that used fewer components and less laminate? Do PCBs still have to be 0.062" thick? Why not reduce layer count while they’re at it? Andy Shaughnessy and Nolan Johnson spoke with I-Connect007 columnist Dana Korf about the idea of designing a PCB with material conservation in mind. Is it a great new idea, or are we opening a whole new can of worms and a separate group of problems?


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