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Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Latest News
OC Designers Council Event to Focus on SI Routing Guidelines Nov. 18
11/11/2015 | IPC Designers Council, Orange Co. Chapter
New Version of Valor Process Preparation Connects Lean NPI Flow with Industry 4.0
11/04/2015 | Mentor Graphics
Frontline PCB Solutions and Nanjing College Launch InCAM Excellence Academy
10/13/2015 | Frontline PCB Solutions
Keysight Technologies to Demonstrate Latest EDA Software at CSICS
10/08/2015 | Keysight Technologies, Inc.
Herbstman, Holden and Kowalewski to Lead Denmark HDI Workshop
09/23/2015 | Andy Shaughnessy, PCBDesign007
Keysight EEs of EDA Software Helps University Students Conduct Research
09/22/2015 | Keysight Technologies, Inc.
Mentor Graphics Announces 26th Annual PCB Technology Leadership Awards Program
09/14/2015 | PRNewswire
Intercept Unveils Enhancements to Pantheon Ink Resistor Technology
09/10/2015 | Intercept Technology Inc.
Polar Instruments Launches New Language Versions of The Speedstack PCB Layer Stackup Design System
08/18/2015 | Polar Instruments
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