-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Trouble in Your Tank
Column from: Michael Carano
Mike brings over 40 years of electronics industry experience with special expertise in manufacturing, performance chemicals, metals, semiconductors, medical devices, and advanced packaging.
A recognized thought leader, subject matter expert (SME), and author, Mike holds 7 US and 20 foreign patents. He has published over 190 articles and presented peered reviewed technical papers all over the world.
Mike is currently a Technical and Market Intelligence consultant to IPC and a project facilitator for HDP User Group international.
Mike has served on more than 20 IPC Standards committees, and has served 14 years as a member of the IPC Board of Directors. Mike has developed multiple professional development courses for IPC including the Advanced Trouble Shooting and Defect Analysis for Printed Circuit Boards.
In 2014 Mike was elected to the IPC Raymond E. Pritchard Hall of Fame, and later recognized for his standards work with Mike’s awarding of the Dieter Bergman Fellowship award and most recently the ANSI Finegan Medal. Previously Mike was the VP of Technology Business Development at RBP Chemical Technology, and the Global Director of R&D and Applications Engineering for the OM Group. He holds a B.A. in Chemistry and an M.B.A.